S9S08AW60E5MFGE vs MC9S08AW32CFUE Perbandingan
Perbandingan bersamaan detil S9S08AW60E5MFGE dari NXP Semiconductors dan MC9S08AW32CFUE dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
S9S08AW60E5MFGE - 60KB Flash 8-Bit MCU 44-LQFP | NXP (Tape & Reel)
S9S08AW60E5MFGE ✓ Aktif
Perbandingan Spesifikasi
| Parameter Umum | S9S08AW60E5MFGE | MC9S08AW32CFUE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | NRND |
| Core Architecture | HCS08 (S08 enhanced), 8-bit CISC | — |
| CPU Clock (Max) | 40 MHz (20 MHz bus) | — |
| Program Flash | 60 KB (60K x 8) | — |
| RAM | [DATA_NEEDED: RAM size] | 2 KB |
| EEPROM / Data Flash | [DATA_NEEDED: data EEPROM size] | — |
| Tegangan Pemuat | 3 V / 3.3 V / 5 V | — |
| Paket | 44-pin LQFP (10 x 10 mm) | 64-QFP (14x14 mm) |
| I/O Pins | [DATA_NEEDED: GPIO count] | — |
| ADC | Multi-channel 10-bit (per family) | 10-bit, 8-channel |
| Communication | SCI (UART), SPI, I2C | — |
| Timers | TPM modules with PWM channels | Multiple TPM/MTIM (see datasheet) |
| Debug Interface | BDM (Background Debug Mode) | BDM (Background Debug Mode) |
| Suhu Kerja | -40C to +125C (automotive range) | -40C to +85C (industrial) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Family | S08 / MC9S08AW60 series | — |
| Automotive/Industrial | Dual-targeted | — |
| Lead Free / RoHS | Yes (per suffix "E" = Pb-free, "R" = tape & reel) | — |
| Core | — | S08 (HCS08 enhanced 8-bit) |
| Program Memory | — | 32 KB Flash |
| Maximum CPU Frequency | — | 40 MHz |
| Operating Voltage | — | 2.7 V to 5.5 V |
| Communication Interfaces | — | 2x SCI (UART), 1x SPI, 1x IIC |
| GPIO | — | Up to 54 |
| Level MSL | — | 3 |
| Status RoHS | — | Compliant |
| Lead-Free | — | Yes |