S9S08AW60E5MFGE vs MC9S08AW32CFUE Karşılaştırma
Ayrıntılı yan yana karşılaştırma S9S08AW60E5MFGE tarafından NXP Semiconductors ve MC9S08AW32CFUE tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
NXP Semiconductors
S9S08AW60E5MFGE - 60KB Flash 8-Bit MCU 44-LQFP | NXP (Tape & Reel)
S9S08AW60E5MFGE ✓ Aktif
Özellik Karşılaştırması
| Parametre | S9S08AW60E5MFGE | MC9S08AW32CFUE |
|---|---|---|
| Marka | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Yaşam Döngüsü Durumu | Aktif | NRND |
| Core Architecture | HCS08 (S08 enhanced), 8-bit CISC | — |
| CPU Clock (Max) | 40 MHz (20 MHz bus) | — |
| Program Flash | 60 KB (60K x 8) | — |
| RAM | [DATA_NEEDED: RAM size] | 2 KB |
| EEPROM / Data Flash | [DATA_NEEDED: data EEPROM size] | — |
| Besleme Gerilimi | 3 V / 3.3 V / 5 V | — |
| Paket | 44-pin LQFP (10 x 10 mm) | 64-QFP (14x14 mm) |
| I/O Pins | [DATA_NEEDED: GPIO count] | — |
| ADC | Multi-channel 10-bit (per family) | 10-bit, 8-channel |
| Communication | SCI (UART), SPI, I2C | — |
| Timers | TPM modules with PWM channels | Multiple TPM/MTIM (see datasheet) |
| Debug Interface | BDM (Background Debug Mode) | BDM (Background Debug Mode) |
| İşletim Sıcaklığı | -40C to +125C (automotive range) | -40C to +85C (industrial) |
| Montaj Türü | Surface Mount | Surface Mount |
| Family | S08 / MC9S08AW60 series | — |
| Automotive/Industrial | Dual-targeted | — |
| Lead Free / RoHS | Yes (per suffix "E" = Pb-free, "R" = tape & reel) | — |
| Core | — | S08 (HCS08 enhanced 8-bit) |
| Program Memory | — | 32 KB Flash |
| Maximum CPU Frequency | — | 40 MHz |
| Operating Voltage | — | 2.7 V to 5.5 V |
| Communication Interfaces | — | 2x SCI (UART), 1x SPI, 1x IIC |
| GPIO | — | Up to 54 |
| MSL Seviyesi | — | 3 |
| RoHS Durumu | — | Compliant |
| Lead-Free | — | Yes |