S9S08AW60E5MFGE vs MC9S08AW32CFUE 比較
詳細並排比較 S9S08AW60E5MFGE 由 NXP Semiconductors 與 MC9S08AW32CFUE 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
S9S08AW60E5MFGE - 60KB Flash 8-Bit MCU 44-LQFP | NXP (Tape & Reel)
S9S08AW60E5MFGE ✓ 啟用中
規格比較
| 參數 | S9S08AW60E5MFGE | MC9S08AW32CFUE |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 啟用中 | NRND |
| Core Architecture | HCS08 (S08 enhanced), 8-bit CISC | — |
| CPU Clock (Max) | 40 MHz (20 MHz bus) | — |
| Program Flash | 60 KB (60K x 8) | — |
| RAM | [DATA_NEEDED: RAM size] | 2 KB |
| EEPROM / Data Flash | [DATA_NEEDED: data EEPROM size] | — |
| 供應電壓 | 3 V / 3.3 V / 5 V | — |
| 封裝 | 44-pin LQFP (10 x 10 mm) | 64-QFP (14x14 mm) |
| I/O Pins | [DATA_NEEDED: GPIO count] | — |
| ADC | Multi-channel 10-bit (per family) | 10-bit, 8-channel |
| Communication | SCI (UART), SPI, I2C | — |
| Timers | TPM modules with PWM channels | Multiple TPM/MTIM (see datasheet) |
| Debug Interface | BDM (Background Debug Mode) | BDM (Background Debug Mode) |
| 工作溫度 | -40C to +125C (automotive range) | -40C to +85C (industrial) |
| 安裝類型 | Surface Mount | Surface Mount |
| Family | S08 / MC9S08AW60 series | — |
| Automotive/Industrial | Dual-targeted | — |
| Lead Free / RoHS | Yes (per suffix "E" = Pb-free, "R" = tape & reel) | — |
| Core | — | S08 (HCS08 enhanced 8-bit) |
| Program Memory | — | 32 KB Flash |
| Maximum CPU Frequency | — | 40 MHz |
| Operating Voltage | — | 2.7 V to 5.5 V |
| Communication Interfaces | — | 2x SCI (UART), 1x SPI, 1x IIC |
| GPIO | — | Up to 54 |
| MSL 等級 | — | 3 |
| RoHS 狀態 | — | Compliant |
| Lead-Free | — | Yes |