S9S08AW60E5MFGE vs MC9S08AW32CFUE Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci S9S08AW60E5MFGE disebabkan oleh NXP Semiconductors dan MC9S08AW32CFUE disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
S9S08AW60E5MFGE - 60KB Flash 8-Bit MCU 44-LQFP | NXP (Tape & Reel)
S9S08AW60E5MFGE ✓ Aktif
Pengandingan Spesifikasi
| Parametr | S9S08AW60E5MFGE | MC9S08AW32CFUE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | NRND |
| Core Architecture | HCS08 (S08 enhanced), 8-bit CISC | — |
| CPU Clock (Max) | 40 MHz (20 MHz bus) | — |
| Program Flash | 60 KB (60K x 8) | — |
| RAM | [DATA_NEEDED: RAM size] | 2 KB |
| EEPROM / Data Flash | [DATA_NEEDED: data EEPROM size] | — |
| Tegangan Pemberi Arus | 3 V / 3.3 V / 5 V | — |
| Kemasan | 44-pin LQFP (10 x 10 mm) | 64-QFP (14x14 mm) |
| I/O Pins | [DATA_NEEDED: GPIO count] | — |
| ADC | Multi-channel 10-bit (per family) | 10-bit, 8-channel |
| Communication | SCI (UART), SPI, I2C | — |
| Timers | TPM modules with PWM channels | Multiple TPM/MTIM (see datasheet) |
| Debug Interface | BDM (Background Debug Mode) | BDM (Background Debug Mode) |
| Suhu Operasi | -40C to +125C (automotive range) | -40C to +85C (industrial) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Family | S08 / MC9S08AW60 series | — |
| Automotive/Industrial | Dual-targeted | — |
| Lead Free / RoHS | Yes (per suffix "E" = Pb-free, "R" = tape & reel) | — |
| Core | — | S08 (HCS08 enhanced 8-bit) |
| Program Memory | — | 32 KB Flash |
| Maximum CPU Frequency | — | 40 MHz |
| Operating Voltage | — | 2.7 V to 5.5 V |
| Communication Interfaces | — | 2x SCI (UART), 1x SPI, 1x IIC |
| GPIO | — | Up to 54 |
| Aras MSL | — | 3 |
| Status RoHS | — | Compliant |
| Lead-Free | — | Yes |