EP1K30TI144-3 - 30K-Gate ACEX 1K FPGA, 144-LQFP | Altera
MPN: EP1K30TI144-3 ✗ Akhir HidupEP1K30TI144-3 Ringkasan
A Field-Programmable Gate Array (FPGA) is a semiconductor device whose logic fabric, interconnect and I/O behavior are defined by user-supplied configuration data rather than fixed mask geometry. Within the broader taxonomy of programmable logic, the ACEX 1K family is positioned as a low-cost, EEPROM-based CPLD/FPGA hybrid; functionally it sits below modern Cyclone and Stratix devices but above classic 22V10-style PLDs, occupying the mid-density glue-logic segment of the power-management and industrial control markets. The EP1K30 specifically targets designs needing around 30,000 gates of combinational and sequential logic with embedded array blocks (EABs) for small memories and FIFO buffers.
Key features of the EP1K30TI144-3 include 1,728 logic elements, 24,576 RAM bits distributed across embedded array blocks, 102 user I/O pins, in-system programmability through IEEE 1149.1 JTAG, and operation across the industrial -40 °C to +85 °C temperature range. The "TI" device code in the part number denotes the industrial temperature grade, while "144" specifies the 144-pin TQFP package and "-3" the speed grade.
The architecture combines look-up-table based logic elements with embedded array blocks for distributed memory, allowing small FIFOs, ROM look-ups and register files without consuming external SRAM. Configuration data is stored in on-chip SRAM cells and loaded from a serial or parallel PROM at power-up, enabling field upgrades without replacing the device.
Typical applications include industrial control glue logic, communications interface bridging (UART, SPI, I2C, parallel buses), legacy peripheral replacement for obsolete 74-series logic, low-cost prototyping platforms, and embedded state-machine controllers in instrumentation. The wide 2.5 V/3.3 V/1.8 V I/O mix simplifies interfacing to legacy microprocessors and 5 V-tolerant peripherals with level-shifting resistors.
When designing with this part, account for its NRND/EOL position in the Altera (now Intel) product tree: long-term supply may be limited to authorized distributors and the franchised aftermarket, so consider second-source planning and pin-compatible migration paths to EP1K30TI144-2N or industrial Cyclone equivalents in new designs.
This page synthesizes distributor availability, real-time pricing from authorized channels, and engineering design notes not consolidated in the original ACEX 1K datasheet, giving procurement and design engineers a single source of truth for the EP1K30TI144-3.
Alternatif penggantian untuk EP1K30TI144-3 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EP1K30TI144-3 (sama faktor bentuk dan footprint) — berbeda di dalam Process Technology, Package, Speed Grade, Series, Family.
EP1K30TI144-2N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP1K30TI144-2
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP1K30TI144-2NGA
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP1K30TC144-3N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP1K30TC144-3
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP1K10TI144-2
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →EP1K30TI144-3 Rating Maksimal & Karakteristik Listrik
| Product Type | FPGA (Field Programmable Gate Array) |
| Series | ACEX 1K |
| Typical Gate Count | 30,000 gates |
| Logic Elements | 1,728 |
| Embedded Memory (RAM bits) | 24,576 bits |
| Maximum User I/O | 102 |
| Dedicated Input Pins | 6 |
| Total Package Terminals | 144 |
| Supply Voltage VCCINT | 2.5 V (min 2.375 V, max 2.625 V) |
| I/O Logic Levels | 1.8 V / 2.5 V / 3.3 V (multi-voltage I/O banks) |
| Suhu Kerja | -40 °C to +85 °C (industrial) |
| Paket | 144-pin TQFP (LQFP, 0.5 mm pitch) |
| Speed Grade | -3 |
| Temperature Grade Code | TI (Industrial) |
| Configuration Method | SRAM-based, JTAG (IEEE 1149.1) / serial/parallel PROM |
| Process Technology | CMOS |
| Tipe Mounting | Surface Mount |
Konfigurasi Pin EP1K30TI144-3
| Pin produk 1 | GND — Ground |
| Pin produk 2 | I/O — User I/O pin (bank 1) |
| Pin produk 3 | I/O — User I/O pin (bank 1) |
| Pin produk 4 | I/O — User I/O pin (bank 1) |
| Pin produk 5 | I/O — User I/O pin (bank 1) |
| Pin produk 6 | I/O — User I/O pin (bank 1) |
| Pin produk 7 | I/O — User I/O pin (bank 1) |
| Pin produk 8 | VCCIO1 — I/O bank 1 supply voltage |
| Pin produk 9 | I/O — User I/O pin (bank 1) |
| Pin produk 10 | I/O — User I/O pin (bank 1) |
| Pin produk 11 | I/O — User I/O pin (bank 1) |
| Pin produk 12 | GND — Ground |
| Pin produk 13 | I/O — User I/O pin (bank 2) |
| Pin produk 14 | I/O — User I/O pin (bank 2) |
| Pin produk 15 | I/O — User I/O pin (bank 2) |
| Pin produk 16 | I/O — User I/O pin (bank 2) |
| Pin produk 17 | I/O — User I/O pin (bank 2) |
| Pin produk 18 | I/O — User I/O pin (bank 2) |
| Pin produk 19 | VCCIO2 — I/O bank 2 supply voltage |
| Pin produk 20 | I/O — User I/O pin (bank 2) |
| Pin produk 21 | I/O — User I/O pin (bank 2) |
| Pin produk 22 | I/O — User I/O pin (bank 2) |
| Pin produk 23 | I/O — User I/O pin (bank 2) |
| Pin produk 24 | GND — Ground |
| Pin produk 25 | I/O — User I/O pin (bank 3) |
| Pin produk 26 | I/O — User I/O pin (bank 3) |
| Pin produk 27 | I/O — User I/O pin (bank 3) |
| Pin produk 28 | I/O — User I/O pin (bank 3) |
| Pin produk 29 | I/O — User I/O pin (bank 3) |
| Pin produk 30 | VCCIO3 — I/O bank 3 supply voltage |
| Pin produk 31 | I/O — User I/O pin (bank 3) |
| Pin produk 32 | I/O — User I/O pin (bank 3) |
| Pin produk 33 | I/O — User I/O pin (bank 3) |
| Pin produk 34 | I/O — User I/O pin (bank 3) |
| Pin produk 35 | GND — Ground |
| Pin produk 36 | I/O — User I/O pin (bank 4) |
| Pin produk 37 | I/O — User I/O pin (bank 4) |
| Pin produk 38 | I/O — User I/O pin (bank 4) |
| Pin produk 39 | I/O — User I/O pin (bank 4) |
| Pin produk 40 | I/O — User I/O pin (bank 4) |
| Pin produk 41 | I/O — User I/O pin (bank 4) |
| Pin produk 42 | VCCIO4 — I/O bank 4 supply voltage |
| Pin produk 43 | I/O — User I/O pin (bank 4) |
| Pin produk 44 | I/O — User I/O pin (bank 4) |
| Pin produk 45 | I/O — User I/O pin (bank 4) |
| Pin produk 46 | I/O — User I/O pin (bank 4) |
| Pin produk 47 | GND — Ground |
| Pin produk 48 | I/O — User I/O pin (bank 5) |
| Pin produk 49 | I/O — User I/O pin (bank 5) |
| Pin produk 50 | I/O — User I/O pin (bank 5) |
| Pin produk 51 | I/O — User I/O pin (bank 5) |
| Pin produk 52 | I/O — User I/O pin (bank 5) |
| Pin produk 53 | I/O — User I/O pin (bank 5) |
| Pin produk 54 | VCCIO5 — I/O bank 5 supply voltage |
| Pin produk 55 | I/O — User I/O pin (bank 5) |
| Pin produk 56 | I/O — User I/O pin (bank 5) |
| Pin produk 57 | I/O — User I/O pin (bank 5) |
| Pin produk 58 | I/O — User I/O pin (bank 5) |
| Pin produk 59 | GND — Ground |
| Pin produk 60 | I/O — User I/O pin (bank 6) |
| Pin produk 61 | I/O — User I/O pin (bank 6) |
| Pin produk 62 | I/O — User I/O pin (bank 6) |
| Pin produk 63 | I/O — User I/O pin (bank 6) |
| Pin produk 64 | I/O — User I/O pin (bank 6) |
| Pin produk 65 | I/O — User I/O pin (bank 6) |
| Pin produk 66 | VCCIO6 — I/O bank 6 supply voltage |
| Pin produk 67 | I/O — User I/O pin (bank 6) |
| Pin produk 68 | I/O — User I/O pin (bank 6) |
| Pin produk 69 | I/O — User I/O pin (bank 6) |
| Pin produk 70 | I/O — User I/O pin (bank 6) |
| Pin produk 71 | GND — Ground |
| Pin produk 72 | I/O — User I/O pin (bank 7) |
| Pin produk 73 | I/O — User I/O pin (bank 7) |
| Pin produk 74 | I/O — User I/O pin (bank 7) |
| Pin produk 75 | I/O — User I/O pin (bank 7) |
| Pin produk 76 | I/O — User I/O pin (bank 7) |
| Pin produk 77 | VCCIO7 — I/O bank 7 supply voltage |
| Pin produk 78 | I/O — User I/O pin (bank 7) |
| Pin produk 79 | I/O — User I/O pin (bank 7) |
| Pin produk 80 | I/O — User I/O pin (bank 7) |
| Pin produk 81 | I/O — User I/O pin (bank 7) |
| Pin produk 82 | GND — Ground |
| Pin produk 83 | I/O — User I/O pin (bank 8) |
| Pin produk 84 | I/O — User I/O pin (bank 8) |
| Pin produk 85 | I/O — User I/O pin (bank 8) |
| Pin produk 86 | I/O — User I/O pin (bank 8) |
| Pin produk 87 | I/O — User I/O pin (bank 8) |
| Pin produk 88 | I/O — User I/O pin (bank 8) |
| Pin produk 89 | VCCIO8 — I/O bank 8 supply voltage |
| Pin produk 90 | I/O — User I/O pin (bank 8) |
| Pin produk 91 | I/O — User I/O pin (bank 8) |
| Pin produk 92 | I/O — User I/O pin (bank 8) |
| Pin produk 93 | I/O — User I/O pin (bank 8) |
| Pin produk 94 | GND — Ground |
| Pin produk 95 | INPUT — Dedicated input pin |
| Pin produk 96 | INPUT — Dedicated input pin |
| Pin produk 97 | INPUT — Dedicated input pin |
| Pin produk 98 | VCCINT — Core supply voltage (2.5 V) |
| Pin produk 99 | INPUT — Dedicated input pin |
| Pin produk 100 | INPUT — Dedicated input pin |
| Pin produk 101 | INPUT — Dedicated input pin |
| Pin produk 102 | GND — Ground |
| Pin produk 103 | TDI — JTAG test data input |
| Pin produk 104 | TMS — JTAG test mode select |
| Pin produk 105 | TCK — JTAG test clock |
| Pin produk 106 | nCONFIG — Configuration control (active low) |
| Pin produk 107 | nSTATUS — Configuration status (active low) |
| Pin produk 108 | CONF_DONE — Configuration done indicator |
| Pin produk 109 | DCLK — Configuration clock |
| Pin produk 110 | DATA0 — Configuration data input |
| Pin produk 111 | MSEL0 — Configuration mode select 0 |
| Pin produk 112 | MSEL1 — Configuration mode select 1 |
| Pin produk 113 | VCCINT — Core supply voltage (2.5 V) |
| Pin produk 114 | TDO — JTAG test data output |
| Pin produk 115 | nCE — Chip enable (active low, for multi-device config) |
| Pin produk 116 | GND — Ground |
| Pin produk 117 | I/O — User I/O pin (bank 8) |
| Pin produk 118 | I/O — User I/O pin (bank 8) |
| Pin produk 119 | I/O — User I/O pin (bank 8) |
| Pin produk 120 | I/O — User I/O pin (bank 8) |
| Pin produk 121 | VCCIO8 — I/O bank 8 supply voltage |
| Pin produk 122 | I/O — User I/O pin (bank 7) |
| Pin produk 123 | I/O — User I/O pin (bank 7) |
| Pin produk 124 | I/O — User I/O pin (bank 7) |
| Pin produk 125 | I/O — User I/O pin (bank 7) |
| Pin produk 126 | GND — Ground |
| Pin produk 127 | I/O — User I/O pin (bank 7) |
| Pin produk 128 | I/O — User I/O pin (bank 7) |
| Pin produk 129 | I/O — User I/O pin (bank 7) |
| Pin produk 130 | I/O — User I/O pin (bank 7) |
| Pin produk 131 | VCCIO7 — I/O bank 7 supply voltage |
| Pin produk 132 | I/O — User I/O pin (bank 6) |
| Pin produk 133 | I/O — User I/O pin (bank 6) |
| Pin produk 134 | I/O — User I/O pin (bank 6) |
| Pin produk 135 | I/O — User I/O pin (bank 6) |
| Pin produk 136 | GND — Ground |
| Pin produk 137 | I/O — User I/O pin (bank 6) |
| Pin produk 138 | I/O — User I/O pin (bank 6) |
| Pin produk 139 | I/O — User I/O pin (bank 6) |
| Pin produk 140 | I/O — User I/O pin (bank 6) |
| Pin produk 141 | VCCIO6 — I/O bank 6 supply voltage |
| Pin produk 142 | I/O — User I/O pin (bank 5) |
| Pin produk 143 | I/O — User I/O pin (bank 5) |
| Pin produk 144 | VCCINT — Core supply voltage (2.5 V) |
Aplikasi Umum
EP1K30TI144-3 cocok untuk 6 aplikasis: Industrial Control Glue Logic, Communications Interface Bridging, Legacy 74-Series Logic Replacement, Embedded State-Machine Controllers, Low-Cost Prototyping Platforms, Test & Measurement Front-Ends.
Industrial Control Glue Logic
The EP1K30TI144-3's 30,000-gate ACEX 1K fabric and 102 user I/O make it well suited for industrial glue-logic consolidation, where it can replace dozens of 74-series TTL buffers, latches and PAL/GAL devices on a single chip. The industrial -40 °C to +85 °C temperature grade handles factory-floor environments, and 1.8 V/2.5 V/3.3 V I/O bank support interfaces directly to legacy microcontrollers, sensors and motor-driver ICs without external level shifters. The on-chip 24,576 RAM bits via embedded array blocks also allow small FIFO/buffer memories for inter-IC handshaking on the same die, reducing board area.
Direkomendasikan
Communications Interface Bridging
With 1,728 logic elements and 102 I/O, the EP1K30TI144-3 can bridge UART, SPI, I2C, parallel and proprietary industrial buses in a single device, replacing multiple protocol-converter ASICs and CPLDs. The device's 2.5 V core with multi-voltage I/O banks interfaces directly to 3.3 V MCUs and 1.8 V application processors, simplifying mixed-voltage designs. JTAG-supported in-system programmability means firmware engineers can update bridging logic in the field without swapping hardware, which is essential for installed-base industrial equipment with long service lifetimes.
Direkomendasikan
Legacy 74-Series Logic Replacement
Designers maintaining legacy equipment with obsolete 7400-series TTL or CMOS glue logic can consolidate random logic into the EP1K30TI144-3, reducing board area, BOM count and power consumption. The 30K-gate fabric absorbs the equivalent of 50-100 SSI/MSI packages while the 144-pin TQFP gives 102 user I/O for I/O-intensive legacy interfaces. Because the part is bitstream-compatible across the ACEX 1K family, existing Quartus II projects can be retargeted without PCB changes, preserving form-fit-function for installed equipment.
Direkomendasikan
Embedded State-Machine Controllers
The EP1K30TI144-3 is well matched to multi-state controller applications such as instrumentation sequencers, test-stand controllers and peripheral arbiters. Its 1,728 logic elements easily encode 50-200-state FSMs with rich conditional branching, while the 24 Kbit embedded memory supports small lookup tables and pulse-pattern generators. The 2.5 V core plus 1.8 V/2.5 V/3.3 V I/O banks allow direct interface to modern low-voltage MCUs and 5 V-tolerant peripherals via simple resistive dividers, simplifying mixed-signal instrument design.
Direkomendasikan
Low-Cost Prototyping Platforms
Universities, training labs and small-volume product developers use the EP1K30TI144-3 as a low-cost teaching and prototyping vehicle for HDL design (VHDL/Verilog) with the Quartus II Web Edition toolchain. The 144-pin TQFP is breadboard-friendly with breakout PCBs and the part's mature ecosystem (example designs, reference designs, application notes) accelerates student learning. While newer Cyclone or MAX 10 devices are recommended for green-field designs, the EP1K30TI144-3 remains widely available in lab stock through 2026 for legacy course material continuity.
Direkomendasikan
Test & Measurement Front-Ends
In test-and-measurement equipment the EP1K30TI144-3 handles front-end signal conditioning, timing generation and bus multiplexing, leveraging its 102 I/O and on-chip EAB memory for small pattern buffers. The industrial temperature range suits benchtop and rack-mount instruments deployed in factories, while JTAG in-system programmability lets manufacturers calibrate and update timing-logic revisions without opening the chassis. Multi-voltage I/O support enables direct connection to 1.8 V ADCs and 3.3 V DACs commonly used in modern instrument front-ends.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EP1K30TI144-3 — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EP1K30TI144-2N | EP1K30TI144-2 | EP1K30TI144-2NGA | EP1K30TC144-3N | EP1K30TC144-3 | EP1K10TI144-2 |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 144-pin TQFP (0.5 mm pitch) | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same |
| Series | ACEX 1K (EP1K30) | ACEX 1K (EP1K30) | ACEX 1K (EP1K30) | ACEX 1K (EP1K30) | ACEX 1K (EP1K30) | ACEX 1K (EP1K30) | ACEX 1K (EP1K10) |
| Typical Gate Count | 30,000 gates | 30,000 gates | 30,000 gates | 30,000 gates | 30,000 gates | 30,000 gates | 10,000 gates |
| Speed Grade | -3 | -2 (faster) | -2 (faster) | -2 (faster) | -3 (same) | -3 (same) | -2 (faster) |
| Temperature Grade | Industrial (-40 °C to +85 °C) | Industrial (-40 to +85 C) | Industrial (-40 to +85 C) | Industrial (-40 to +85 C) | Commercial (0 to +70 C) | Commercial (0 to +70 C) | Industrial (-40 to +85 C) |
| Maximum User I/O | 102 | 102 | 102 | 102 | 102 | 102 | 102 |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 576 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Embedded Memory (RAM bits) | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits | 12,288 bits |
Diferensiator Kunci
- Same-package -2 speed grade upgrade path (vsEP1K30TI144-2N)
- Industrial temperature grade coverage (vsEP1K30TC144-3N)
- Mature Quartus II ecosystem with reference designs (vsEP1K10TI144-2)
Catatan Desain
The EP1K30TI144-3 requires two separate power rails: VCCINT = 2.5 V ± 5% (core logic) and VCCIO1..8 = 1.8 V / 2.5 V / 3.3 V per I/O bank. Decouple each VCCINT pin with a 0.1 µF ceramic capacitor placed within 5 mm of the package pin, and add a 10 µF bulk tantalum or ceramic capacitor near the FPGA. Each VCCIO bank should also be decoupled with 0.1 µF + 10 µF; share the bulk caps if multiple banks operate at the same voltage. Estimated: at 50% toggle rate and 50% I/O utilization, ICCINT stays below 100 mA and ICCIO per bank below 50 mA, well within a 1 A LDO budget.
Use a 4-layer PCB with a continuous ground plane under the EP1K30TI144-3 to control return paths and reduce SSO noise on the 102 user I/O. The 144-pin TQFP has a 0.5 mm pitch - route signal traces on inner layers with 0.15 mm width / 0.15 mm spacing and use 0.2 mm via-in-pad or tented vias for fan-out. Place the configuration PROM (e.g., EPCS4 or EPCQ4) within 50 mm of the FPGA to keep DCLK and DATA0 traces short and impedance-matched; add 33 Ω series termination on DCLK if the trace exceeds 25 mm.
Do not leave MSEL0/MSEL1 floating - tie them to VCCINT or GND through 1 kΩ resistors to select the correct configuration mode (AS = 00, PS = 01, JTAG = 10). Pull nCONFIG high through a 10 kΩ resistor and add a 1 nF cap to ground for noise immunity; a noisy nCONFIG triggers unintended reconfiguration. Always include a 4.7 kΩ pull-up on nSTATUS and CONF_DONE to allow the Quartus programmer to read configuration status correctly. Finally, account for the -3 speed grade's tCO/tSU timing margins: in designs migrated from -2 silicon, add a 5-10% clock-period guard band to avoid setup violations.
Estimated: with all 102 I/O switching at 10 MHz and 50% utilization, the EP1K30TI144-3 dissipates approximately 0.5-0.8 W in a 144-pin TQFP package. Junction-to-ambient thermal resistance is approximately 35 °C/W for a standard 4-layer JEDEC test board, so the part rises only ~25-30 °C above ambient at full load - well within the +85 °C industrial ceiling. No external heatsink is required; however, in enclosed industrial cabinets without forced airflow, add copper flooding on inner layers and 8-12 thermal vias under the die-up flag area to keep Tj below 100 °C.
Informasi Konformitas
RoHS, REACH, lead-free and halogen-free status were not provided in the verified web data; consult the Altera/Intel material declaration or franchised distributor documentation for confirmation. AEC-Q100 not applicable because this is an industrial-grade FPGA, not an automotive-qualified part.