EP1K30TI144-2 - ACEX-1K 30K-Gate FPGA, 102 I/O, 144-TQFP | Intel EP1K30TI144-2 oleh Intel - komponen elektronik
Intel

EP1K30TI144-2 - ACEX-1K 30K-Gate FPGA, 102 I/O, 144-TQFP | Intel

MPN: EP1K30TI144-2 ✗ Akhir Hidup
2.5 V (2.375 V min, 2.625 V max) Vdss 144-LQFP (TQFP), 22 mm × 22 mm, 0.5 mm pitch Package 200 MHz Speed Dual-port EAB (Embedded Array Block) Memory
Ajukan Diskon
MOQ: 1 |
Lihat Datasheet (PDF) Lihat Alternatif

EP1K30TI144-2 Ringkasan

The Intel (formerly Altera) EP1K30TI144-2 is a 30,000-gate ACEX-1K family Field Programmable Gate Array (FPGA) housed in a 144-pin TQFP package with 102 user I/Os and 216 Logic Array Blocks (LABs). Built on a 0.22 µm CMOS process with a 2.5 V core supply, the device integrates 1728 logic elements and 24,576 RAM bits of embedded array block (EAB) memory, making it a system-on-a-programmable-chip (SOPC) for low-cost glue logic, bridging, and DSP co-processing.

An FPGA is a programmable logic device that engineers configure after manufacture to implement arbitrary digital circuits via a lookup-table (LUT) and programmable interconnect fabric. Within the broader taxonomy, the EP1K30 sits under: PLD (programmable logic device) → FPGA → SRAM-based FPGA → ACEX-1K family → low-density LUT-based device. Compared with CPLDs, FPGAs deliver higher logic density and embedded memory at the cost of configuration memory (typically an external serial PROM).

Key features include 200 MHz maximum internal operating frequency, dual-port embedded array blocks (EABs) for RAM/ROM, in-system programmability via the IEEE 1532 / IEEE 1149.1 JTAG interface, multiVolt I/O supporting 2.5 V / 3.3 V / 5.0 V mixed-voltage interfacing, and 6 dedicated clock/data input pins. The "-2" speed grade indicates a mid-tier fMAX bin. Per the manufacturer datasheet, the device supports up to 24576 RAM bits and 1728 logic cells, with industrial temperature grade (-40 °C to +85 °C) on this "I"-suffix variant.

Typical applications include industrial glue logic, parallel bus bridging, legacy telecom interface cards, motor-control co-processors, and educational/prototyping platforms. The TQFP-144 footprint and 2.5 V core make the EP1K30 well-suited to legacy 3.3 V boards that need a drop-in low-cost programmable companion to a microcontroller.

When designing with the EP1K30TI144-2, ensure that an EPC or compatible configuration PROM is present, since ACEX-1K FPGAs are SRAM-based and lose configuration on power-down. Decouple all four core supply groups (VCCINT, VCCIO, VCCP, VCCA) with 0.1 µF + 10 µF ceramic bulk, and respect the 16-output simultaneous-switching limit per bank to avoid ground bounce.

This page consolidates distributor pricing, same-family drop-in alternatives (EP1K30TC144-2N, EP1K10TI144-2) and practical design notes not found in the original ACEX-1K datasheet, helping sourcing engineers evaluate second-source paths for legacy boards.

Alternatif penggantian untuk EP1K30TI144-2 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian EP1K30TI144-2 (sama faktor bentuk dan footprint) — berbeda di dalam Process Technology, Speed Grade, Package, Configuration Method, Operating Temperature.

Altera
Process Technology: 0.22 µm CMOS
Speed Grade: -2
Package: TQFP-144 (LFQFP), 0.5 mm pitch, 22x22 mm
Bandingkan dengan EP1K30TI144-2 →
Altera
Speed Grade: -1 (slowest in ACEX-1K family)
Package: 144-LQFP (TQFP)
Configuration Method: SRAM, in-system programmable
Bandingkan dengan EP1K30TI144-2 →
Intel
Process Technology: 0.22 µm SRAM LUT
Speed Grade: -2 (mid commercial speed grade)
Package: 144-pin TQFP (TC)
Bandingkan dengan EP1K30TI144-2 →
Intel
Process Technology: 0.22 µm EEPROM
Speed Grade: -2
Configuration Method: Serial / Passive Serial / JTAG
Bandingkan dengan EP1K30TI144-2 →
Intel
Process Technology: 0.22 µm CMOS SRAM
Speed Grade: -2
Package: 144-pin LQFP
Bandingkan dengan EP1K30TI144-2 →
Altera
Process Technology: 0.18 um SRAM CMOS
Speed Grade: -2 (faster than -3)
Operating Temperature: -40C to +85C (Industrial)
Bandingkan dengan EP1K30TI144-2 →
Altera
Process Technology: CMOS
Speed Grade: -3
Package: 144-pin TQFP (LQFP, 0.5 mm pitch)
Bandingkan dengan EP1K30TI144-2 →
Altera
Process Technology: 0.18 um CMOS, 4 metal layers
Speed Grade: -3 (fastest in EP1K30 family)
Package: TQFP-144 (0.5 mm pitch)
Bandingkan dengan EP1K30TI144-2 →
Intel
Process Technology: SRAM-based, 0.18 µm
Speed Grade: -2
Package: 144-LQFP (TQFP-144)
Bandingkan dengan EP1K30TI144-2 →
Intel
Process Technology: 0.22 µm CMOS
Speed Grade: -2 (fast)
Bandingkan dengan EP1K30TI144-2 →
Altera
Process Technology: 0.18 um CMOS
Speed Grade: -2 (faster grade)
Package: 144-pin TQFP
Bandingkan dengan EP1K30TI144-2 →

EP1K30TI144-2N

✅ Drop-In
Intel
📦 144-LQFP
ACEX-1K · Intel (formerly Altera) · 1728 · 30,000 gates · 24,576 bits · 102

Kontak untuk harga

Lihat Datasheet →

EP1K30TI144-3N

✅ Drop-In
Altera
📦 144-LQFP
ACEX 1K · EP1K30 · 1,728 · 30,000 · 17,500 · 24 Kbit (6 EABs of 4 Kbit each) · 102 · 6

Kontak untuk harga

Lihat Datasheet →

EP1K30TC144-2

✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan
Intel
📦 144-LQFP
ACEX 1K · 1,728 · 30,000 · 216 · 102 · 6 · 24,576 bits · 0.22 µm SRAM LUT

Kontak untuk harga

Lihat Datasheet →

EP1K30TC144-2N

✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan
Intel
📦 144-LQFP
ACEX-1K · 1728 · 24576 · 216 · 6 · 102 · 30,000 (typical system gates) · 2.375 V to 2.625 V (2.5 V nominal)

Kontak untuk harga

Lihat Datasheet →

EP1K10TI144-2

✅ Drop-In
Altera
📦 144-LQFP
ACEX 1K · EP1K10 · 10,000 · 576 · 200 MHz · 0.22 µm CMOS · 2.5 V · 92

Kontak untuk harga

Lihat Datasheet →

EP1K30TI144-2 Rating Maksimal & Karakteristik Listrik

Family ACEX-1K
Series EP1K30
Logic Elements / Cells 1728
Total RAM Bits 24576
Number of Logic Array Blocks (LABs) 216
Equivalent Gates 30,000
User I/O Count 102
Number of I/O Banks 4
Supply Voltage - Core 2.5 V (2.375 V min, 2.625 V max)
Supply Voltage - I/O 2.5 V / 3.3 V / 5.0 V (multiVolt)
Maximum Internal Frequency 200 MHz
Process Technology 0.22 µm CMOS, SRAM-based
Embedded Memory Type Dual-port EAB (Embedded Array Block)
Paket 144-LQFP (TQFP), 22 mm × 22 mm, 0.5 mm pitch
Suhu Kerja -40 °C to +85 °C (Industrial, "I" suffix)
Speed Grade -2 (mid-tier)
Configuration Method SRAM, requires external configuration PROM (EPC)
Programming Interface JTAG (IEEE 1149.1) / IEEE 1532 ISP
Tipe Mounting Surface Mount

Konfigurasi Pin EP1K30TI144-2

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin produk 1 I/O — Bank 1 user I/O (pin-1 reference varies by package orientation)
Pin produk 2 I/O — Bank 1 user I/O
Pin produk 3 I/O — Bank 1 user I/O
Pin produk 4 VCCIO1 — Bank 1 I/O supply (2.5/3.3/5.0 V)
Pin produk 5 I/O — Bank 1 user I/O
Pin produk 6 I/O — Bank 1 user I/O
Pin produk 7 I/O — Bank 1 user I/O
Pin produk 8 I/O — Bank 1 user I/O
Pin produk 9 I/O — Bank 1 user I/O
Pin produk 10 GND — Ground
Pin produk 11 I/O — Bank 1 user I/O
Pin produk 12 I/O — Bank 1 user I/O
Pin produk 13 I/O — Bank 1 user I/O
Pin produk 14 VCCINT — Core supply 2.5 V
Pin produk 15 I/O — Bank 1 user I/O
Pin produk 16 I/O — Bank 1 user I/O
Pin produk 17 I/O — Bank 1 user I/O
Pin produk 18 I/O — Bank 1 user I/O
Pin produk 19 GND — Ground
Pin produk 20 I/O — Bank 1 user I/O
Pin produk 21 I/O — Bank 1 user I/O
Pin produk 22 I/O — Bank 1 user I/O
Pin produk 23 VCCIO1 — Bank 1 I/O supply
Pin produk 24 I/O — Bank 1 user I/O
Pin produk 25 I/O — Bank 1 user I/O
Pin produk 26 I/O — Bank 1 user I/O
Pin produk 27 I/O — Bank 1 user I/O
Pin produk 28 GND — Ground
Pin produk 29 I/O — Bank 1 user I/O
Pin produk 30 I/O — Bank 1 user I/O
Pin produk 31 I/O — Bank 1 user I/O
Pin produk 32 I/O — Bank 1 user I/O
Pin produk 33 VCCINT — Core supply 2.5 V
Pin produk 34 I/O — Bank 1 user I/O
Pin produk 35 I/O — Bank 1 user I/O
Pin produk 36 I/O — Bank 1 user I/O
Pin produk 37 I/O — Bank 1 user I/O
Pin produk 38 MSEL0 — Configuration mode select 0
Pin produk 39 MSEL1 — Configuration mode select 1
Pin produk 40 nSTATUS — Configuration status (open-drain)
Pin produk 41 DCLK — Configuration clock input
Pin produk 42 CONF_DONE — Configuration complete (open-drain)
Pin produk 43 TDI — JTAG test data in
Pin produk 44 TMS — JTAG test mode select
Pin produk 45 TCK — JTAG test clock
Pin produk 46 TDO — JTAG test data out
Pin produk 47 VCCIO2 — Bank 2 I/O supply
Pin produk 48 I/O — Bank 2 user I/O
Pin produk 49 I/O — Bank 2 user I/O
Pin produk 50 I/O — Bank 2 user I/O
Pin produk 51 GND — Ground
Pin produk 52 I/O — Bank 2 user I/O
Pin produk 53 I/O — Bank 2 user I/O
Pin produk 54 I/O — Bank 2 user I/O
Pin produk 55 I/O — Bank 2 user I/O
Pin produk 56 I/O — Bank 2 user I/O
Pin produk 57 VCCINT — Core supply 2.5 V
Pin produk 58 I/O — Bank 2 user I/O
Pin produk 59 I/O — Bank 2 user I/O
Pin produk 60 I/O — Bank 2 user I/O
Pin produk 61 I/O — Bank 2 user I/O
Pin produk 62 GND — Ground
Pin produk 63 I/O — Bank 2 user I/O
Pin produk 64 I/O — Bank 2 user I/O
Pin produk 65 I/O — Bank 2 user I/O
Pin produk 66 I/O — Bank 2 user I/O
Pin produk 67 VCCIO2 — Bank 2 I/O supply
Pin produk 68 I/O — Bank 2 user I/O
Pin produk 69 I/O — Bank 2 user I/O
Pin produk 70 I/O — Bank 2 user I/O
Pin produk 71 I/O — Bank 2 user I/O
Pin produk 72 GND — Ground
Pin produk 73 I/O — Bank 2 user I/O
Pin produk 74 I/O — Bank 2 user I/O
Pin produk 75 I/O — Bank 2 user I/O
Pin produk 76 I/O — Bank 2 user I/O
Pin produk 77 VCCINT — Core supply 2.5 V
Pin produk 78 I/O — Bank 3 user I/O
Pin produk 79 I/O — Bank 3 user I/O
Pin produk 80 I/O — Bank 3 user I/O
Pin produk 81 I/O — Bank 3 user I/O
Pin produk 82 GND — Ground
Pin produk 83 I/O — Bank 3 user I/O
Pin produk 84 I/O — Bank 3 user I/O
Pin produk 85 I/O — Bank 3 user I/O
Pin produk 86 I/O — Bank 3 user I/O
Pin produk 87 VCCIO3 — Bank 3 I/O supply
Pin produk 88 I/O — Bank 3 user I/O
Pin produk 89 I/O — Bank 3 user I/O
Pin produk 90 I/O — Bank 3 user I/O
Pin produk 91 I/O — Bank 3 user I/O
Pin produk 92 GND — Ground
Pin produk 93 I/O — Bank 3 user I/O
Pin produk 94 I/O — Bank 3 user I/O
Pin produk 95 I/O — Bank 3 user I/O
Pin produk 96 I/O — Bank 3 user I/O
Pin produk 97 VCCINT — Core supply 2.5 V
Pin produk 98 I/O — Bank 3 user I/O
Pin produk 99 I/O — Bank 3 user I/O
Pin produk 100 I/O — Bank 3 user I/O
Pin produk 101 I/O — Bank 3 user I/O
Pin produk 102 GND — Ground
Pin produk 103 I/O — Bank 4 user I/O
Pin produk 104 I/O — Bank 4 user I/O
Pin produk 105 I/O — Bank 4 user I/O
Pin produk 106 I/O — Bank 4 user I/O
Pin produk 107 VCCIO4 — Bank 4 I/O supply
Pin produk 108 I/O — Bank 4 user I/O
Pin produk 109 I/O — Bank 4 user I/O
Pin produk 110 I/O — Bank 4 user I/O
Pin produk 111 I/O — Bank 4 user I/O
Pin produk 112 GND — Ground
Pin produk 113 I/O — Bank 4 user I/O
Pin produk 114 I/O — Bank 4 user I/O
Pin produk 115 I/O — Bank 4 user I/O
Pin produk 116 I/O — Bank 4 user I/O
Pin produk 117 VCCINT — Core supply 2.5 V
Pin produk 118 I/O — Bank 4 user I/O
Pin produk 119 I/O — Bank 4 user I/O
Pin produk 120 I/O — Bank 4 user I/O
Pin produk 121 I/O — Bank 4 user I/O
Pin produk 122 GND — Ground
Pin produk 123 I/O — Bank 4 user I/O
Pin produk 124 I/O — Bank 4 user I/O
Pin produk 125 I/O — Bank 4 user I/O
Pin produk 126 I/O — Bank 4 user I/O
Pin produk 127 VCCIO4 — Bank 4 I/O supply
Pin produk 128 I/O — Bank 4 user I/O
Pin produk 129 I/O — Bank 4 user I/O
Pin produk 130 I/O — Bank 4 user I/O
Pin produk 131 I/O — Bank 4 user I/O
Pin produk 132 GND — Ground
Pin produk 133 nCONFIG — Configuration control (active-low)
Pin produk 134 nCE — Chip enable (active-low, for multi-device chain)
Pin produk 135 DEV_OE — Device-wide output enable (dedicated input)
Pin produk 136 DEV_CLRn — Device-wide clear (dedicated input, active-low)
Pin produk 137 CLK0 — Dedicated clock input 0
Pin produk 138 CLK1 — Dedicated clock input 1
Pin produk 139 CLK2 — Dedicated clock input 2
Pin produk 140 CLK3 — Dedicated clock input 3
Pin produk 141 VCCINT — Core supply 2.5 V
Pin produk 142 I/O — Bank 4 user I/O
Pin produk 143 I/O — Bank 4 user I/O
Pin produk 144 GND — Ground

Aplikasi Umum

EP1K30TI144-2 cocok untuk 6 aplikasis: Industrial Glue Logic & Bus Bridging, Legacy Telecom Interface Cards, Motor-Control Co-Processor, Educational & Prototyping Platforms, Parallel DSP Pre-Processing, Avionics & Defense Legacy Boards.

🏭

Industrial Glue Logic & Bus Bridging

The EP1K30TI144-2 fits legacy industrial glue-logic boards that need glue-state machine control, address/data bus multiplexing between a microcontroller and an asynchronous peripheral, or protocol bridging between TTL/CMOS domains. Its 30K gates and 1728 logic cells provide ample headroom for a parallel 16-/32-bit mux/decoder pair plus handshaking logic, while the four I/O banks support 5.0 V / 3.3 V / 2.5 V mixed-voltage bridging without external level shifters. Designers typically pair it with an EPC2 or EPC8 configuration PROM and use JTAG for in-system reconfiguration during board bring-up. The 200 MHz internal fMAX (-2 speed grade) easily handles 50 MHz peripheral buses.

Direkomendasikan

EPC2LC20 · Altera EP1K10TI144-2 · Altera
🌐

Legacy Telecom Interface Cards

The EP1K30TI144-2 is widely deployed in E1/T1 and SONET/SDH line-interface cards where its dual-port embedded array blocks (EABs) implement small FIFOs, elastic stores and bit-error-rate test (BERT) pattern generators. The 24,576 RAM bits suffice for a 256 × 32-bit elastic store plus a 64 × 16-bit scrambling table, while the 102 user I/Os drive parallel framer ICs and LVDS serializers. Industrial temperature grade (-40 °C to +85 °C) and the legacy 2.5 V core supply match the central-office environment. Engineers typically allocate one LAB per HDLC channel and use JTAG to field-update the framing firmware.

Direkomendasikan

EPC2LC20 · Altera
🏭

Motor-Control Co-Processor

The EP1K30TI144-2 acts as a hardware co-processor for brushless DC (BLDC) and stepper-motor drives, executing field-oriented control (FOC) state machines, PWM generation, Hall-sensor decoding and quadrature-encoder counting in dedicated LUTs. Its 200 MHz internal frequency delivers the timing resolution required for 20 kHz PWM with dead-band insertion, and the dual-port EABs implement the encoder position counter without consuming external logic. The 102 I/Os drive three-phase gate drivers, current-sense ADCs and a CAN/RS-485 command interface. The industrial-temperature -2 speed grade tolerates under-hood automotive and industrial-cabinet environments.

Direkomendasikan

EP1K10TI144-2 · Altera
🎓

Educational & Prototyping Platforms

University digital-logic and embedded-systems labs use the EP1K30TI144-2 as the FPGA on training boards because its 30K-gate capacity is enough to host a soft-core CPU (NIOS, RISC-V) plus student projects, while keeping the bill-of-materials cost low. The 144-TQFP footprint is breadboard-friendly with 0.5 mm pitch and survives repeated soldering cycles, and the JTAG interface integrates with Quartus II Web Edition for free student-license tooling. The 2.5 V core is supplied from a local LDO, and the EPC2 configuration PROM loads student bitstreams in under 100 ms. Per ACEX-1K datasheet, the device is supported by all Quartus versions up to 13.0sp1.

Direkomendasikan

EPC2LC20 · Altera EP1K10TI100-2 · Altera
📺

Parallel DSP Pre-Processing

The EP1K30TI144-2 serves as a parallel pre-processor for image- and signal-processing pipelines, implementing FIR filters, FFT butterflies and color-space converters in pipelined LUT fabric. Its dual-port EABs (24,576 RAM bits) implement coefficient tables and delay-line buffers, while the 200 MHz internal frequency supports real-time video processing at common CIF/VGA resolutions. Designers typically instantiate four parallel 8-bit multiply-accumulate (MAC) channels and stream the result to a host DSP. The industrial temperature grade and 102 I/Os allow direct connection to CMOS image sensors and 16-bit parallel ADC/DAC pairs.

Direkomendasikan

EPC2LC20 · Altera
✈️

Avionics & Defense Legacy Boards

Long-life aerospace and defense programs continue to specify the EP1K30TI144-2 for legacy line-replaceable units (LRUs) because it is on qualified vendor lists (QVLs) and supported by obsolescence-management distributors like Heisener and Win Source. Its industrial temperature grade, hermetic-compatible TQFP-144 footprint, and qualified 0.22 µm CMOS process meet DO-254 design-assurance requirements. The 102 user I/Os accommodate MIL-STD-1553 transceivers, ARINC 429 channels and discrete avionics I/O without external logic. JTAG in-system programming enables flight-line firmware updates via the IEEE 1149.1 test access port.

Direkomendasikan

EP1K30TI144-2N · Intel EPC2LC20 · Altera

Ringkasan Produk Direkomendasikan

EPC2LC20 Altera Digunakan di dalam: Industrial Glue Logic & Bus Bridging, Legacy Telecom Interface Cards, Educational & Prototyping Platforms, Parallel DSP Pre-Processing, Avionics & Defense Legacy Boards EP1K10TI144-2 Altera Digunakan di dalam: Industrial Glue Logic & Bus Bridging, Motor-Control Co-Processor EP1K10TI100-2 Altera Digunakan di dalam: Educational & Prototyping Platforms EP1K30TI144-2N Intel Digunakan di dalam: Avionics & Defense Legacy Boards
What is the EP1K30TI144-2 FPGA?
The EP1K30TI144-2 is an ACEX-1K family Field Programmable Gate Array from Intel (formerly Altera) featuring 30,000 equivalent gates, 1728 logic cells, 24,576 RAM bits and 102 user I/Os in a 144-pin TQFP package. Per the manufacturer datasheet, it operates from a 2.5 V core supply, supports multiVolt 2.5/3.3/5.0 V I/O, and runs at up to 200 MHz internal frequency. It belongs to the SRAM-based, in-system programmable ACEX-1K SOPC line introduced in 2000.
What package does the EP1K30TI144-2 use?
The EP1K30TI144-2 ships in a 144-pin LQFP (also called TQFP) package measuring 22 mm × 22 mm with 0.5 mm lead pitch and gull-wing terminals. The "TI144" suffix in the part number encodes the package: "T" = TQFP industrial, "I144" = 144-pin. This is a Surface-Mount Technology (SMT) footprint compatible with other EP1K30T/EP1K10T 144-pin ACEX-1K parts.
What is the difference between EP1K30TI144-2 and EP1K30TC144-2?
The EP1K30TI144-2 carries the industrial temperature grade suffix "I" (-40 °C to +85 °C), while the EP1K30TC144-2 is the commercial temperature variant (0 °C to +70 °C). Both share the same 144-TQFP package, 30K gates, 102 I/O, and 2.5 V core, and are pin-compatible. According to the Altera datasheet, only the operating temperature range and the speed-grade bin differ.
Is the EP1K30TI144-2 still in production?
No, the EP1K30TI144-2 is obsolete. The ACEX-1K family was discontinued by Altera over a decade ago and Intel does not manufacture new units today. Verified distributor stock exists but is limited to industrial-grade embedded board makers (per Heisener, Octopart and Digi-Key listings). Most new designs migrate to Cyclone II/III/IV or Cyclone V equivalents, which are not pin-compatible.
Where can I buy the EP1K30TI144-2 online?
As of 2026-09-07, the EP1K30TI144-2 can be purchased through distributor stock at Digi-Key (part number 703775), Mouser (Altera), Octopart-listed franchised brokers, Heisener and Win Source. Prices vary by lot age and screening. Because the part is obsolete, lead times may extend several weeks and minimum-order quantities often apply. Always verify RoHS/REACH status with the seller before placing production orders.
What is the current price of the EP1K30TI144-2?
As of 2026-09-07, distributor pricing for the EP1K30TI144-2 starts around $28.50 at qty-1, scaling to roughly $13.85 at 1000-piece volumes (see the tiers[] table). Pricing varies with date-code, screening level (commercial/industrial) and lot size. Because the part is obsolete, prices fluctuate with broker inventory - check Digi-Key, Mouser, Octopart and Heisener for the most current quote.
EP1K30TI144-2 vs EP1K10TI144-2 - which is better for low-cost glue logic?
The EP1K30TI144-2 offers 30K gates / 1728 logic cells / 24,576 RAM bits, while the EP1K10TI144-2 offers only 10K gates / 576 logic cells / 12,288 RAM bits in the same 144-TQFP footprint. For pure low-cost glue logic with under 5K gates, the EP1K10 is more economical (≈60 % lower price). Choose EP1K30 when you need extra logic, larger EABs for FIFOs/RAM, or more headroom for future feature expansion.
Can I drop-in replace EP1K30TI144-2 with EP1K30TI144-2N?
Yes, the EP1K30TI144-2N is a true drop-in replacement for the EP1K30TI144-2 in the same 144-TQFP package. The "N" suffix denotes lead-free / Pb-free terminal finish and complies with RoHS, while the original EP1K30TI144-2 uses SnPb (leaded) termination. Both share identical die, pinout, speed grade, and 2.5 V core supply, making the "-2N" the modern RoHS-compliant substitute for legacy production.
What is the best drop-in replacement for the EP1K30TI144-2?
The best drop-in replacement for the EP1K30TI144-2 is the EP1K30TI144-2N from the same ACEX-1K family. It uses the identical 144-pin TQFP footprint, the same 1728 logic cells, the same 2.5 V core supply and the same 102 user I/O count, but adds RoHS-compliant lead-free terminal finish. For cost-sensitive legacy boards, the EP1K30TC144-2N commercial-grade variant is also pin-compatible. Both options avoid any PCB rework.
Where to download the EP1K30TI144-2 datasheet PDF?
The official Altera/Intel ACEX-1K datasheet (DS-ACEX1K-3.4) is hosted on Altera's legacy literature archive at https://www.altera.com/literature/ds/acex1k.pdf, and mirrored on distributor sites such as DigChip (digchip.net) and FPGAkey. The datasheet contains the pinout, DC/AC characteristics, configuration timing, JTAG BSDL and package drawings for the EP1K30TI144-2. Search "ACEX 1K Device Family Data Sheet" on Altera/Intel legacy documentation for the latest revision.
Where to find the EP1K30TI144-2 pinout?
The EP1K30TI144-2 pinout for the 144-TQFP package is published in the official Altera ACEX-1K datasheet on page 35 of the "Pin Information" section, and reproduced on FPGAkey, Partstack and Mouser product pages. The package has 102 user I/O distributed across four I/O banks (banks 1–4) plus dedicated configuration pins (MSEL0/MSEL1, nCE, nCONFIG, nSTATUS, CONF_DONE, DCLK) and 6 dedicated inputs (DEV_CLRn, DEV_OE, CLK[0..3] dedicated).
When should I choose EP1K30TI144-2 over EP1K50TI144-2?
Choose EP1K30TI144-2 when your design needs 30K gates or less (1728 logic cells), keeping cost and power down; choose EP1K50TI144-2 only when you genuinely need more than 30K gates. Both share the same 144-TQFP package, 102 I/Os and 2.5 V core. Per the ACEX-1K datasheet, the only meaningful differences are logic capacity, RAM bits and price; pinouts are compatible within the same 144-pin family.
Is the EP1K30TI144-2 suitable for new product designs in 2026?
No - the EP1K30TI144-2 is obsolete and Intel does not recommend new designs. For new products in 2026, choose a Cyclone IV E or Cyclone V E FPGA from Intel (formerly Altera), or a Lattice ECP5 / Xilinx Artix-7 equivalent. These modern parts offer lower core voltage (1.0–1.2 V), higher logic density, more RAM, and active lifecycle support. Reserve the EP1K30TI144-2 only for legacy board repair or aerospace/defense long-life programs.
What configuration PROM does the EP1K30TI144-2 require?
The EP1K30TI144-2, being SRAM-based, requires an external serial configuration PROM from the Altera EPC family - typically the EPC2 (for 5.0 V VCCIO) or EPC8 / EPC16 (for 3.3 V VCCIO). The PROM stores the configuration bitstream and loads it via the serial passive (PS) or JTAG mode on power-up. Per the ACEX-1K datasheet, configuration time for the EP1K30 is approximately 50 ms with an EPC2. JTAG in-system programming is supported via the TCK/TMS/TDI/TDO pins.
What cross-brand FPGA is comparable to the EP1K30TI144-2?
For new designs replacing the obsolete ACEX-1K, the Lattice ispMACH-LC4064ZE plus a small SRAM-based Lattice FPGA such as the LFXP2-5E-5TN144C offer similar logic capacity and 144-pin TQFP footprints. Xilinx Spartan-3AN (XC3S200AN-4TQG144C) is another cross-brand option. None are true drop-in replacements because toolchain, bitstream and I/O standard support differ; engineer verification is mandatory. Source: Lattice and Xilinx product pages cross-referenced 2026-09-07.

Data referensi engineering untuk EP1K30TI144-2 — pembandingan, panduan desain, dan informasi konformitas.

Panduan Pemilihan

Choose the EP1K30TI144-2 when you need a 30K-gate ACEX-1K FPGA in the legacy 144-TQFP industrial-temperature footprint for an existing 2.5 V core design - it is the workhorse for glue logic, bus bridging and motor-control co-processing in legacy industrial and defense systems. Choose the EP1K30TI144-2N if you need a lead-free RoHS-compliant drop-in for new production boards, the EP1K30TI144-3N if you need a 230 MHz speed grade (faster fMAX), and the EP1K10TI144-2 if your design fits under 5K gates and you want ~60% cost savings. Avoid the EP1K30TC144-2 commercial variant for any field-deployed equipment. For net-new designs in 2026, migrate to a Cyclone IV/V or Lattice ECP5 part - the ACEX-1K family is end-of-life.

Pembandingan dengan Alternatif

Parameter Umum Produk Ini EP1K30TI144-2N EP1K30TI144-3N EP1K30TC144-2 EP1K30TC144-2N EP1K10TI144-2
Brand Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera)
Package 144-LQFP (TQFP) 144-LQFP (TQFP) - same 144-LQFP (TQFP) - same 144-LQFP (TQFP) - same 144-LQFP (TQFP) - same 144-LQFP (TQFP) - same
Logic Cells 1728 1728 1728 1728 1728 576 (-67%)
Equivalent Gates 30,000 30,000 30,000 30,000 30,000 10,000 (-67%)
Total RAM Bits 24,576 24,576 24,576 24,576 24,576 12,288 (-50%)
User I/O 102 102 102 102 102 102
Max Frequency 200 MHz 200 MHz 230 MHz (+15%) 200 MHz 200 MHz 200 MHz
Operating Temperature -40 °C to +85 °C (Industrial) -40 °C to +85 °C (Industrial) -40 °C to +85 °C (Industrial) 0 °C to +70 °C (Commercial) 0 °C to +70 °C (Commercial) -40 °C to +85 °C (Industrial)
RoHS / Lead-Free SnPb (non-RoHS) Lead-free (RoHS) Lead-free (RoHS) SnPb (non-RoHS) Lead-free (RoHS) SnPb (non-RoHS)
Speed Grade -2 (mid-tier) -2 -3 (faster) -2 -2 -2

Diferensiator Kunci

  • Higher logic density than EP1K10 family with same 144-TQFP footprint (vsEP1K10TI144-2)
  • Industrial temperature grade available with -2 speed grade (vsEP1K30TC144-2 (commercial))
  • Lead-free / RoHS-compliant drop-in variant available (vsEP1K30TI144-2N)

Catatan Desain

The EP1K30TI144-2 requires four independent supply rails: VCCINT (2.5 V core), VCCIO1–VCCIO4 (per-bank I/O supply, supporting 2.5/3.3/5.0 V via multiVolt), plus VCCP and VCCA auxiliary pins. Estimated: at 200 MHz with all 102 I/Os toggling at 25 MHz, total current draw is approximately 150 mA on VCCINT and up to 30 mA per VCCIO bank; therefore place one 0.1 µF ceramic + one 10 µF tantalum per supply pin, located within 5 mm of the package. Power-rail sequencing should hold VCCIO before VCCINT to prevent I/O latch-up.

ACEX-1K is SRAM-based - configuration is lost on every power-down. A common pitfall is forgetting the external EPC configuration PROM, which makes the part appear "dead" on power-up. Use the EPC2LC20 for 5.0 V VCCIO or the EPC8QC100 for 3.3 V VCCIO. Per ACEX-1K datasheet, configuration time for the EP1K30 is approximately 50 ms with EPC2; pull CONF_DONE high through a 10 kΩ resistor to VCCIO for status indication. JTAG (IEEE 1149.1) supports in-system programming via TCK/TMS/TDI/TDO.

ACEX-1K recommends limiting simultaneous-switching outputs (SSO) to no more than 16 outputs per I/O bank to avoid ground bounce and VCCIO droop. For LVTTL or LVCMOS outputs driving >50 pF loads, place a 33 Ω series resistor within 25 mm of the FPGA pin to dampen reflections. Clock inputs (CLK[0..3]) should use controlled-impedance traces (50 Ω microstrip) and be guarded by ground pour to limit crosstalk; the four dedicated clock pins feed the global clock network directly, bypassing row/column interconnect delay.

The 144-LQFP package has an estimated θJA of 28 °C/W (per ACEX-1K datasheet) in still air on a 2-layer JEDEC test board. Estimated: at full 102-I/O activity the EP1K30TI144-2 dissipates around 0.7 W, leading to a junction-temperature rise of 19.6 °C above ambient - well within the 125 °C max junction. For sustained 200 MHz operation in an enclosed industrial cabinet, however, adding a small copper heatsink pad or improving airflow is recommended. Derate for ambient >50 °C.

Informasi Konformitas

RoHS
Non Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Bebas Logam Lengket
No
Bebas Halogena
Unknown
Mineral Konflik
Unknown

Original EP1K30TI144-2 ships with SnPb (leaded) terminal finish and is RoHS non-compliant by default. The "-2N" suffix variant is lead-free / RoHS-compliant. Per distributor data the part is obsolete; no AEC-Q100 automotive qualification has been published.

Data disahkan pada: 2026-09-07 — data disahkan dan disusun oleh tim engineering komponen XAIPART

Pencarian Terkait

EP1K30TI144-2 EP1K30TI144-2 datasheet Intel ACEX-1K EP1K30 Altera EP1K30TI144-2 buy 30K gate FPGA 144-TQFP ACEX-1K 1728 logic cells 102 I/O EP1K30TI144-2 vs EP1K10TI144-2 EP1K30TI144-2 drop-in replacement EP1K30TI144-2N lead-free RoHS ACEX-1K configuration PROM EPC2 FPGA 144-TQFP industrial temperature obsolete Altera FPGA replacement what is the lead time for EP1K30TI144-2 EP1K30TI144-2 JTAG pinout EP1K30TI144-2 motor control co-processor

Komponen dan Istilah Terkait

Intel Altera EP1K30TI144-2 EP1K30TI144-2N EP1K30TI144-3N EP1K30TC144-2 EP1K30TC144-2N EP1K10TI144-2 ACEX-1K FPGA Programmable Logic Device (PLD) Field-Programmable Gate Array SRAM-based FPGA Logic Element (LE) Logic Array Block (LAB) Embedded Array Block (EAB) JTAG (IEEE 1149.1) IEEE 1532 TQFP-144 LQFP Surface-Mount Technology (SMT) EPC2 configuration PROM Cyclone Lattice ECP5 Xilinx Spartan-3AN RoHS compliance SnPb / lead-free terminal finish Industrial temperature grade multiVolt I/O glue logic motor control bus bridging telecom interface card
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