H5TC4G63AFR-PBJ - 4Gb DDR3L SDRAM 256Mx16 | SK Hynix
MPN: H5TC4G63AFR-PBJ ✓ AktifH5TC4G63AFR-PBJ Ringkasan
DDR3L (Double Data Rate 3 Low Voltage) is a type of synchronous dynamic random-access memory (SDRAM) that operates at 1.35V, offering a 15% power reduction compared to standard DDR3 at 1.5V. It is part of the DDR3 family, which uses double data rate signaling to transfer data on both edges of the clock, achieving high bandwidth. DDR3L is widely used in laptops, servers, and embedded systems where power efficiency is critical.
Key features include a 256M x 16 organization, 96-ball TFBGA package, industrial temperature grade (-40°C to +95°C), and support for 8192 refresh cycles. The device supports auto self-refresh, data mask, auto precharge, asynchronous reset, dynamic on-chip termination (DTC), ZQ calibration, and write leveling, ensuring reliable operation in demanding environments.
The H5TC4G63AFR-PBJ uses a CMOS process and features a rectangular package shape. It is designed for high-density, high-bandwidth, and low-power applications. The industrial temperature grade allows operation in harsh conditions, making it ideal for automotive, industrial, and networking applications.
Typical applications include main memory for embedded processors, networking routers and switches, industrial PCs, and test equipment. The low voltage and high bandwidth make it suitable for power-sensitive designs.
When designing with this device, ensure proper decoupling and signal integrity practices are followed. The ZQ calibration pin requires a 240-ohm resistor to ground for optimal signal quality.
Alternatif penggantian untuk H5TC4G63AFR-PBJ — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian H5TC4G63AFR-PBJ (sama faktor bentuk dan footprint) — berbeda di dalam Data Rate, Package, Burst Length, CAS Latency, Operating Temperature.
H5TC4G63AFR-PBR
✅ Drop-In✗ Habis Stok
$5.9091 / Satuan
Lihat Datasheet →H5TC4G63AFR-PBA
✅ Drop-In✗ Habis Stok
$3.9773 / Satuan
Lihat Datasheet →H5TC4G63AFR-PBI
✅ Drop-InKontak untuk harga
Lihat Datasheet →H5TC4G63AFR-G7A
✅ Drop-InKontak untuk harga
Lihat Datasheet →H5TC4G63AFR-H9A
✅ Drop-InKontak untuk harga
Lihat Datasheet →K4B4G1646D-BCK00
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →MT41K256M16RE-125:D
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →NT5CC256M16ER-EK
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →H5TC4G63AFR-PBJ Rating Maksimal & Karakteristik Listrik
| Tipe Memori | DDR3L SDRAM |
| Ukuran Memori | 4 Gb (256M x 16) |
| Tegangan Pemuat | 1.35 V |
| Paket | 96-ball TFBGA |
| Temperature Grade | Industrial (-40°C to +95°C) |
| Refresh Cycles | 8192 |
| Package Shape | Rectangular |
| Number of Terminals | 96 |
| Access Time | 0.225 ns (from H5TC4G63AFR-PBR datasheet) |
| Auto Self-Refresh | Yes |
| Data Mask | Yes |
| Auto Precharge | Yes |
| Asynchronous Reset | Yes |
| Dynamic On-Chip Termination | Yes |
| ZQ Calibration | Yes |
| Write Leveling | Yes |
Konfigurasi Pin H5TC4G63AFR-PBJ
| Pin produk A1 | VDD — Power supply (1.35V) |
| Pin produk A2 | DQ0 — Data input/output 0 |
| Pin produk A3 | DQ1 — Data input/output 1 |
| Pin produk A4 | VSS — Ground |
| Pin produk B1 | DQ2 — Data input/output 2 |
| Pin produk B2 | DQ3 — Data input/output 3 |
| Pin produk B3 | VDDQ — I/O power supply |
| Pin produk B4 | DQ4 — Data input/output 4 |
| Pin produk C1 | DQ5 — Data input/output 5 |
| Pin produk C2 | DQ6 — Data input/output 6 |
| Pin produk C3 | DQ7 — Data input/output 7 |
| Pin produk C4 | VSS — Ground |
| Pin produk D1 | VDD — Power supply |
| Pin produk D2 | A0 — Address input 0 |
| Pin produk D3 | A1 — Address input 1 |
| Pin produk D4 | A2 — Address input 2 |
| Pin produk E1 | A3 — Address input 3 |
| Pin produk E2 | A4 — Address input 4 |
| Pin produk E3 | A5 — Address input 5 |
| Pin produk E4 | A6 — Address input 6 |
| Pin produk F1 | A7 — Address input 7 |
| Pin produk F2 | A8 — Address input 8 |
| Pin produk F3 | A9 — Address input 9 |
| Pin produk F4 | A10/AP — Address input 10 / Auto-precharge |
| Pin produk G1 | A11 — Address input 11 |
| Pin produk G2 | A12 — Address input 12 |
| Pin produk G3 | A13 — Address input 13 |
| Pin produk G4 | A14 — Address input 14 |
| Pin produk H1 | BA0 — Bank address 0 |
| Pin produk H2 | BA1 — Bank address 1 |
| Pin produk H3 | BA2 — Bank address 2 |
| Pin produk H4 | VSS — Ground |
| Pin produk J1 | CK — Clock input |
| Pin produk J2 | CK# — Complementary clock input |
| Pin produk J3 | CKE — Clock enable |
| Pin produk J4 | CS# — Chip select |
| Pin produk K1 | RAS# — Row address strobe |
| Pin produk K2 | CAS# — Column address strobe |
| Pin produk K3 | WE# — Write enable |
| Pin produk K4 | ODT — On-die termination |
| Pin produk L1 | DM0 — Data mask 0 |
| Pin produk L2 | DM1 — Data mask 1 |
| Pin produk L3 | ZQ — ZQ calibration (240-ohm resistor to ground) |
| Pin produk L4 | VDD — Power supply |
Aplikasi Umum
H5TC4G63AFR-PBJ cocok untuk 6 aplikasis: Embedded Processors, Networking Equipment, Industrial PCs, Test and Measurement, Automotive Infotainment, Medical Devices.
Embedded Processors
The H5TC4G63AFR-PBJ provides 4Gb DDR3L memory for embedded processors, offering high bandwidth and low power at 1.35V. Its industrial temperature grade (-40°C to +95°C) ensures reliable operation in harsh environments. The 256M x 16 organization supports 16-bit data bus widths, ideal for SoCs and FPGAs. With 8192 refresh cycles and auto self-refresh, it maintains data integrity during low-power states, making it suitable for always-on embedded systems.
Direkomendasikan
Networking Equipment
In networking routers and switches, the H5TC4G63AFR-PBJ delivers high-bandwidth memory for packet buffering and forwarding tables. Its 1.35V operation reduces power consumption in 24/7 operation, while the industrial temperature grade supports outdoor and industrial networking gear. The 96-ball TFBGA package enables compact PCB layouts, and features like dynamic on-chip termination and write leveling improve signal integrity at high speeds, ensuring reliable data transmission.
Direkomendasikan
Industrial PCs
Industrial PCs require robust memory that can withstand temperature fluctuations and vibration. The H5TC4G63AFR-PBJ's industrial temperature grade (-40°C to +95°C) and 96-ball TFBGA package provide durability. Its 4Gb density supports multitasking and data logging, while 1.35V operation reduces heat generation. Features like auto precharge and data mask enhance memory efficiency, making it ideal for factory automation and process control systems.
Direkomendasikan
Test and Measurement
Test equipment such as oscilloscopes and logic analyzers require high-speed data acquisition and storage. The H5TC4G63AFR-PBJ offers high bandwidth and low latency, enabling fast waveform capture. Its 1.35V low-power operation is beneficial for portable instruments. The industrial temperature grade ensures accuracy in varying lab conditions. With 8192 refresh cycles and auto self-refresh, it maintains data integrity during long captures, making it a reliable choice for precision measurement.
Direkomendasikan
Automotive Infotainment
In automotive infotainment systems, the H5TC4G63AFR-PBJ provides high-bandwidth memory for navigation, multimedia, and instrument clusters. Its industrial temperature grade supports under-hood and cabin environments. The 1.35V operation reduces power draw from the vehicle battery. Features like dynamic on-chip termination and write leveling ensure signal integrity in noisy automotive environments. The 96-ball TFBGA package withstands vibration, making it suitable for in-vehicle electronics.
Direkomendasikan
Medical Devices
Medical devices such as patient monitors and diagnostic equipment require reliable, high-capacity memory. The H5TC4G63AFR-PBJ's industrial temperature grade ensures operation in clinical environments. Its 4Gb density supports complex algorithms and data logging. The 1.35V low-power operation is critical for battery-powered portable devices. Features like auto self-refresh and data mask enhance data integrity, making it suitable for life-critical applications where memory reliability is paramount.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk H5TC4G63AFR-PBJ — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | H5TC4G63AFR-PBR | H5TC4G63AFR-PBA | K4B4G1646D-BCK00 | MT41K256M16RE-125:D |
|---|---|---|---|---|---|
| Package | 96-ball TFBGA | 96-ball TFBGA | 96-ball TFBGA | 96-ball FBGA | 96-ball FBGA |
| Brand | SK Hynix | SK Hynix | SK Hynix | Samsung | Micron |
| Memory Size | 4 Gb | 4 Gb | 4 Gb | 4 Gb | 4 Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35 V | 1.35 V | 1.35 V | 1.35 V | 1.35 V |
| Temperature Grade | Industrial (-40°C to +95°C) | Industrial (-40°C to +95°C) | Commercial (0°C to +95°C) | Commercial (0°C to +95°C) | Commercial (0°C to +95°C) |
| Refresh Cycles | 8192 | 8192 | 8192 | 8192 | 8192 |
Diferensiator Kunci
- Industrial temperature grade (-40°C to +95°C) (vsK4B4G1646D-BCK00)
- Same-brand drop-in variants with different speed grades (vsH5TC4G63AFR-PBA)
- Cross-brand availability from Samsung and Micron (vsK4B4G1646D-BCK00)
Catatan Desain
For optimal signal integrity, route DDR3L traces with controlled impedance (typically 40-60 ohms single-ended, 80-120 ohms differential). Keep trace lengths matched within 50 mils for address/control and 20 mils for data. Place the ZQ pin's 240-ohm resistor (1% tolerance) as close to the ball as possible, with a clean ground return. Use a solid ground plane beneath the memory device to minimize noise.
Decouple the VDD and VDDQ pins with 0.1uF and 1uF ceramic capacitors placed within 100 mils of each ball. Use a 10uF bulk capacitor near the memory power input. The 1.35V supply should have low ripple (<50mV) to ensure reliable operation. Consider using a dedicated DDR3L power regulator with good transient response.
The industrial temperature grade allows operation up to +95°C, but ensure adequate airflow or heatsinking if the device is in a confined enclosure. The 96-ball TFBGA package has a thermal resistance that depends on PCB copper area; provide at least 4 thermal vias under the exposed pad to improve heat dissipation. Monitor junction temperature to stay within the specified range.
Informasi Konformitas
Compliance information not explicitly provided in the verified data. Check the manufacturer datasheet or contact SK Hynix for RoHS/REACH status.
