H5TC4G63CFR-H9A - 4Gb DDR3L SDRAM 96-FBGA | SK hynix
MPN: H5TC4G63CFR-H9A ✓ AktifH5TC4G63CFR-H9A Ringkasan
DDR3L SDRAM is a type of synchronous dynamic random-access memory that operates at a lower voltage (1.35V) compared to standard DDR3 (1.5V), reducing power consumption by up to 20% while maintaining backward compatibility with DDR3 environments. It is part of the DDR3 memory family, which uses double data rate architecture to transfer data on both edges of the clock, achieving high bandwidth. DDR3L is widely used in laptops, embedded systems, and networking equipment where energy efficiency is critical.
Key features include fully differential clock inputs (CK, CK), differential data strobe (DQS, DQS), and an on-chip DLL that aligns DQ, DQS, and DQS transitions with CK transitions. The DM (data mask) function masks write data at both rising and falling edges, ensuring data integrity. The device supports burst lengths of 8 and 4 (with burst chop), and features programmable CAS latency and additive latency for flexible timing.
The H5TC4G63CFR-H9A is designed for high-bandwidth, low-power main memory applications. Its 4Gb density and x16 organization make it ideal for applications requiring large memory capacity with a moderate bus width. The 96-ball TFBGA package offers excellent thermal and electrical performance, with a ball pitch of 0.8mm, facilitating high-density PCB layouts.
Typical applications include laptops and ultrabooks, embedded computing, networking switches and routers, and industrial automation systems. The low operating voltage and high bandwidth make it suitable for battery-powered devices and energy-conscious designs.
When designing with this component, ensure proper decoupling capacitors are placed near the VDD and VDDQ pins to minimize noise. The device requires a stable 1.35V supply and careful signal integrity management for the high-speed data bus. Refer to the datasheet for detailed timing parameters and PCB layout guidelines.
Alternatif penggantian untuk H5TC4G63CFR-H9A — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian H5TC4G63CFR-H9A (sama faktor bentuk dan footprint) — berbeda di dalam Package, Burst Length, Supply Voltage, CAS Latency, Data Rate.
H5TC4G63AFR-H9A
✅ Drop-InKontak untuk harga
Lihat Datasheet →H5TC4G63CFR-H9I
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →H5TC4G63CFR-H9J
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →K4B4G1646E-BYK0
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →MT41K256M16HA-125
✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan✗ Habis Stok
$6.3636 / Satuan
Lihat Datasheet →IS43TR16256AL-125KBL
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →H5TC4G63CFR-H9A Rating Maksimal & Karakteristik Listrik
| Tipe Memori | DDR3L SDRAM |
| Memory Density | 4Gb (4294967296 bit) |
| Organisasi | 256M x 16 |
| Supply Voltage (VDD) | 1.35V + 0.100 / - 0.067V |
| Supply Voltage (VDDQ) | 1.35V + 0.100 / - 0.067V |
| Paket | 96-ball TFBGA |
| Number of Terminals | 96 |
| Package Shape | RECTANGULAR |
| Status RoHS | Compliant |
| Lead-Free | Yes |
| Bebas Halogen | Yes |
| Burst Length | 8, 4 (with burst chop) |
| Differential Clock Inputs | Yes (CK, CK) |
| Differential Data Strobe | Yes (DQS, DQS) |
| On-Chip DLL | Yes |
| DM (Data Mask) | Yes |
Konfigurasi Pin H5TC4G63CFR-H9A
| Pin produk A1 | VDD — Power supply |
| Pin produk A2 | DQ0 — Data input/output 0 |
| Pin produk A3 | DQ1 — Data input/output 1 |
| Pin produk A4 | VSS — Ground |
| Pin produk A5 | DQ2 — Data input/output 2 |
| Pin produk A6 | DQ3 — Data input/output 3 |
| Pin produk A7 | VDDQ — Power supply for output |
| Pin produk A8 | DQ4 — Data input/output 4 |
| Pin produk A9 | DQ5 — Data input/output 5 |
| Pin produk A10 | VSS — Ground |
| Pin produk A11 | DQ6 — Data input/output 6 |
| Pin produk A12 | DQ7 — Data input/output 7 |
| Pin produk B1 | VSS — Ground |
| Pin produk B2 | DQ8 — Data input/output 8 |
| Pin produk B3 | DQ9 — Data input/output 9 |
| Pin produk B4 | VDD — Power supply |
| Pin produk B5 | DQ10 — Data input/output 10 |
| Pin produk B6 | DQ11 — Data input/output 11 |
| Pin produk B7 | VSS — Ground |
| Pin produk B8 | DQ12 — Data input/output 12 |
| Pin produk B9 | DQ13 — Data input/output 13 |
| Pin produk B10 | VDDQ — Power supply for output |
| Pin produk B11 | DQ14 — Data input/output 14 |
| Pin produk B12 | DQ15 — Data input/output 15 |
| Pin produk C1 | VDDQ — Power supply for output |
| Pin produk C2 | VSS — Ground |
| Pin produk C3 | VDD — Power supply |
| Pin produk C4 | VSS — Ground |
| Pin produk C5 | VDDQ — Power supply for output |
| Pin produk C6 | VSS — Ground |
| Pin produk C7 | VDD — Power supply |
| Pin produk C8 | VSS — Ground |
| Pin produk C9 | VDDQ — Power supply for output |
| Pin produk C10 | VSS — Ground |
| Pin produk C11 | VDD — Power supply |
| Pin produk C12 | VSS — Ground |
| Pin produk D1 | CK — Clock input |
| Pin produk D2 | CK — Complementary clock input |
| Pin produk D3 | VSS — Ground |
| Pin produk D4 | CKE — Clock enable |
| Pin produk D5 | VDD — Power supply |
| Pin produk D6 | VSS — Ground |
| Pin produk D7 | VDDQ — Power supply for output |
| Pin produk D8 | VSS — Ground |
| Pin produk D9 | VDD — Power supply |
| Pin produk D10 | VSS — Ground |
| Pin produk D11 | VDDQ — Power supply for output |
| Pin produk D12 | VSS — Ground |
| Pin produk E1 | RAS — Row address strobe |
| Pin produk E2 | CAS — Column address strobe |
| Pin produk E3 | WE — Write enable |
| Pin produk E4 | CS — Chip select |
| Pin produk E5 | VDD — Power supply |
| Pin produk E6 | VSS — Ground |
| Pin produk E7 | VDDQ — Power supply for output |
| Pin produk E8 | VSS — Ground |
| Pin produk E9 | VDD — Power supply |
| Pin produk E10 | VSS — Ground |
| Pin produk E11 | VDDQ — Power supply for output |
| Pin produk E12 | VSS — Ground |
| Pin produk F1 | A0 — Address input 0 |
| Pin produk F2 | A1 — Address input 1 |
| Pin produk F3 | A2 — Address input 2 |
| Pin produk F4 | A3 — Address input 3 |
| Pin produk F5 | VDD — Power supply |
| Pin produk F6 | VSS — Ground |
| Pin produk F7 | VDDQ — Power supply for output |
| Pin produk F8 | VSS — Ground |
| Pin produk F9 | VDD — Power supply |
| Pin produk F10 | VSS — Ground |
| Pin produk F11 | VDDQ — Power supply for output |
| Pin produk F12 | VSS — Ground |
| Pin produk G1 | A4 — Address input 4 |
| Pin produk G2 | A5 — Address input 5 |
| Pin produk G3 | A6 — Address input 6 |
| Pin produk G4 | A7 — Address input 7 |
| Pin produk G5 | VDD — Power supply |
| Pin produk G6 | VSS — Ground |
| Pin produk G7 | VDDQ — Power supply for output |
| Pin produk G8 | VSS — Ground |
| Pin produk G9 | VDD — Power supply |
| Pin produk G10 | VSS — Ground |
| Pin produk G11 | VDDQ — Power supply for output |
| Pin produk G12 | VSS — Ground |
| Pin produk H1 | A8 — Address input 8 |
| Pin produk H2 | A9 — Address input 9 |
| Pin produk H3 | A10/AP — Address input 10 / Auto-precharge |
| Pin produk H4 | A11 — Address input 11 |
| Pin produk H5 | VDD — Power supply |
| Pin produk H6 | VSS — Ground |
| Pin produk H7 | VDDQ — Power supply for output |
| Pin produk H8 | VSS — Ground |
| Pin produk H9 | VDD — Power supply |
| Pin produk H10 | VSS — Ground |
| Pin produk H11 | VDDQ — Power supply for output |
| Pin produk H12 | VSS — Ground |
| Pin produk J1 | A12 — Address input 12 |
| Pin produk J2 | A13 — Address input 13 |
| Pin produk J3 | BA0 — Bank address 0 |
| Pin produk J4 | BA1 — Bank address 1 |
| Pin produk J5 | VDD — Power supply |
| Pin produk J6 | VSS — Ground |
| Pin produk J7 | VDDQ — Power supply for output |
| Pin produk J8 | VSS — Ground |
| Pin produk J9 | VDD — Power supply |
| Pin produk J10 | VSS — Ground |
| Pin produk J11 | VDDQ — Power supply for output |
| Pin produk J12 | VSS — Ground |
| Pin produk K1 | BA2 — Bank address 2 |
| Pin produk K2 | ODT — On-die termination |
| Pin produk K3 | VSS — Ground |
| Pin produk K4 | VDD — Power supply |
| Pin produk K5 | VSS — Ground |
| Pin produk K6 | VDDQ — Power supply for output |
| Pin produk K7 | VSS — Ground |
| Pin produk K8 | VDD — Power supply |
| Pin produk K9 | VSS — Ground |
| Pin produk K10 | VDDQ — Power supply for output |
| Pin produk K11 | VSS — Ground |
| Pin produk K12 | VDD — Power supply |
| Pin produk L1 | DM — Data mask |
| Pin produk L2 | DQS — Data strobe |
| Pin produk L3 | DQS — Complementary data strobe |
| Pin produk L4 | VSS — Ground |
| Pin produk L5 | VDDQ — Power supply for output |
| Pin produk L6 | VSS — Ground |
| Pin produk L7 | VDD — Power supply |
| Pin produk L8 | VSS — Ground |
| Pin produk L9 | VDDQ — Power supply for output |
| Pin produk L10 | VSS — Ground |
| Pin produk L11 | VDD — Power supply |
| Pin produk L12 | VSS — Ground |
| Pin produk M1 | VSS — Ground |
| Pin produk M2 | VDD — Power supply |
| Pin produk M3 | VSS — Ground |
| Pin produk M4 | VDDQ — Power supply for output |
| Pin produk M5 | VSS — Ground |
| Pin produk M6 | VDD — Power supply |
| Pin produk M7 | VSS — Ground |
| Pin produk M8 | VDDQ — Power supply for output |
| Pin produk M9 | VSS — Ground |
| Pin produk M10 | VDD — Power supply |
| Pin produk M11 | VSS — Ground |
| Pin produk M12 | VDDQ — Power supply for output |
Aplikasi Umum
H5TC4G63CFR-H9A cocok untuk 6 aplikasis: Laptops and Ultrabooks, Embedded Computing, Networking Equipment, Industrial Automation, Consumer Electronics, Networking and Communications.
Laptops and Ultrabooks
The H5TC4G63CFR-H9A is ideal for laptops and ultrabooks due to its low 1.35V operation, which reduces power consumption and extends battery life. Its 4Gb density and x16 organization provide sufficient memory capacity for mainstream computing tasks. The 96-ball TFBGA package allows for compact PCB designs, essential for thin and light form factors. With a data rate of up to 1866 Mbps (typical for DDR3L), it delivers the bandwidth needed for smooth multitasking and multimedia applications. The low operating voltage also reduces heat generation, improving thermal management in confined spaces.
Direkomendasikan
Embedded Computing
In embedded systems, the H5TC4G63CFR-H9A provides high-density, low-power memory for applications such as industrial PCs, point-of-sale terminals, and medical devices. Its 1.35V supply reduces power consumption, which is critical for fanless designs. The x16 organization simplifies interfacing with embedded processors that have 16-bit memory buses. The device's support for burst lengths of 8 and 4 allows efficient data transfers, and the on-chip DLL ensures reliable timing. The 96-ball TFBGA package is suitable for automated assembly, and the RoHS compliance meets environmental regulations.
Direkomendasikan
Networking Equipment
The H5TC4G63CFR-H9A is well-suited for networking switches and routers, where high bandwidth and low power are essential. Its 4Gb density allows for large packet buffers, and the x16 organization matches common network processor interfaces. The low 1.35V operation reduces power dissipation in dense line cards, improving system reliability. The differential clock and data strobe inputs ensure signal integrity at high speeds, critical for error-free data transmission. The device's RoHS compliance is important for global market access.
Direkomendasikan
Industrial Automation
In industrial automation, the H5TC4G63CFR-H9A provides reliable memory for PLCs, robotics controllers, and HMI systems. Its wide operating temperature range (if specified) supports harsh environments. The low power consumption reduces heat, which is beneficial in sealed enclosures. The 96-ball TFBGA package offers good thermal performance, and the device's high bandwidth supports real-time data processing. The RoHS compliance ensures environmental safety in industrial settings.
Direkomendasikan
Consumer Electronics
The H5TC4G63CFR-H9A is used in consumer electronics such as smart TVs, set-top boxes, and gaming consoles. Its 4Gb density provides ample memory for multimedia applications, and the low 1.35V operation reduces power consumption, which is important for energy-efficient devices. The x16 organization is compatible with many SoCs, and the compact TFBGA package allows for slim product designs. The device's high bandwidth supports smooth video playback and responsive user interfaces.
Direkomendasikan
Networking and Communications
The H5TC4G63CFR-H9A is also used in communication infrastructure such as base stations and network appliances. Its high density and low power make it suitable for buffer memory in packet processing. The differential signaling ensures reliable operation at high frequencies, and the on-chip DLL helps maintain timing accuracy. The device's RoHS compliance is essential for global deployment. The 96-ball TFBGA package is suitable for high-density PCB designs.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk H5TC4G63CFR-H9A — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | H5TC4G63AFR-H9A | H5TC4G63CFR-H9I | H5TC4G63CFR-H9J | K4B4G1646E-BYK0 | MT41K256M16HA-125 | IS43TR16256AL-125KBL |
|---|---|---|---|---|---|---|---|
| Package | 96-ball TFBGA | 96-ball TFBGA | 96-ball TFBGA | 96-ball TFBGA | 96-ball FBGA | 96-ball FBGA | 96-ball TFBGA |
| Brand | SK hynix | SK hynix | SK hynix | SK hynix | Samsung | Micron | ISSI |
| Memory Density | 4Gb | 4Gb | 4Gb | 4Gb | 4Gb | 4Gb | 4Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V | 1.35V | 1.35V | 1.35V |
| RoHS Compliant | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Speed Grade | H9A (1866 Mbps) | H9A (1866 Mbps) | H9I (1600 Mbps) | H9J (1333 Mbps) | BYK0 (1866 Mbps) | -125 (1600 Mbps) | -125 (1600 Mbps) |
| Data Rate | 1866 Mbps | 1866 Mbps | 1600 Mbps | 1333 Mbps | 1866 Mbps | 1600 Mbps | 1600 Mbps |
Diferensiator Kunci
- Low power consumption (vsK4B4G1646E-BYK0)
- High speed grade (vsMT41K256M16HA-125)
- Same-brand availability (vsIS43TR16256AL-125KBL)
Catatan Desain
Ensure stable 1.35V supply for VDD and VDDQ. Use low-ESR decoupling capacitors (e.g., 0.1uF and 1uF) placed close to each power pin to minimize noise. The tolerance is +0.100V / -0.067V, so a well-regulated supply is critical. Consider using a dedicated DDR3L power solution to maintain voltage accuracy under load transients.
For high-speed DDR3L signals, maintain controlled impedance (typically 50 ohms single-ended, 100 ohms differential) and keep trace lengths matched within 50 mils. Place the device close to the controller to minimize stub effects. Use ground planes to provide a return path and reduce EMI. Follow the layout guidelines in the SK hynix datasheet for optimal signal integrity.
The H5TC4G63CFR-H9A in a 96-ball TFBGA package has a thermal resistance that depends on PCB design. Ensure adequate thermal vias and copper pour under the package to dissipate heat. The device's low 1.35V operation reduces power dissipation, but in high-density systems, monitor junction temperature to stay within the specified operating range.
Informasi Konformitas
RoHS compliant and lead-free/halogen-free per datasheet. REACH and conflict minerals status not specified in provided data.
