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Samsung Electronics

K9UMGB8U7M - Samsung NAND Flash Memory | Samsung Electronics

部品番号: K9UMGB8U7M ✓ 生産中
在庫あり 1〜3営業日以内に発送
NAND Flash Memory
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価格更新日: 2026-09-03
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K9UMGB8U7M 概要

The Samsung Electronics K9UMGB8U7M is a NAND flash memory device from Samsung's K9U family of high-density non-volatile storage ICs, designed for mass storage and code storage applications in embedded and consumer systems. Full verified datasheet-level specifications for this exact MPN were not retrievable from the provided web sources, so key parameters below are marked for verification against the official Samsung datasheet before design-in.

NAND flash memory is a type of non-volatile storage technology that retains data without power and is organized into pages and blocks that are erased and programmed in units. Within the memory hierarchy, NAND flash sits below volatile DRAM in speed but offers far higher density and lower cost per bit, making it the dominant technology for solid-state storage, eMMC modules, SSDs, and raw managed-NAND solutions. Samsung is one of the world's largest NAND flash manufacturers, and the K9 family has historically defined industry-standard raw NAND interfaces such as asynchronous ONFI-compatible timing.

Key differentiators of Samsung K9-series NAND typically include a x8-bit data interface, single-level or multi-level cell technology depending on the generation, low power consumption in active and standby modes, and copy-back program operations that reduce host-side data manipulation. Devices in this family are controlled through standard command latching cycles on CLE, ALE, WE, RE, and CE signals.

Typical applications include set-top boxes, digital television firmware storage, industrial embedded controllers, networking equipment boot storage, and consumer electronics requiring reliable non-volatile mass storage.

A critical design consideration with raw NAND is the requirement for external error-correction code (ECC) management, wear-leveling, and bad-block management in the host controller, since the memory device does not perform these functions internally.

This page synthesizes drop-in alternatives from the same Samsung K9 family, design considerations, and sourcing guidance not consolidated in the manufacturer datasheet alone.

ドロップイン代替品: K9UMGB8U7M — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: K9UMGB8U7M (同一形状・フットプリント) — 相違点: Memory Type, Organization, Package, Density, Interface.

Samsung Electronics
Organization: 8G x 8
Package: TSOP-48 (PDSO48)
比較対象 K9UMGB8U7M →
Samsung Electronics
Memory Type: NAND Flash, MLC
Organization: x8 I/O
Package: BGA
比較対象 K9UMGB8U7M →
Samsung Electronics
Memory Type: MLC Large Block NAND Flash
Organization: 16G x 8 bit
Package: 48-pin TSOP1 dual stacked, 12 mm x 20 mm
比較対象 K9UMGB8U7M →
Samsung Electronics
Memory Type: NAND Flash (SLC)
Organization: x8 (multiplexed I/O)
Package: TSOP1-48
比較対象 K9UMGB8U7M →
Samsung Electronics
Memory Type: NAND Flash
比較対象 K9UMGB8U7M →

クイック比較ツール — 並列比較する代替部品を選択:

K9QDGB8U7M

✅ ドロップイン ⚠️ 仕様未検証
Samsung Electronics
📦 [DATA_NEEDED: Package Type]
Samsung Electronics · K9 NAND Flash · NAND Flash

✓ 在庫あり

価格はお問い合わせください

データシートを見る →

K9PDG08U5M

✅ ドロップイン ⚠️ 仕様未検証
Samsung Electronics
📦 [DATA_NEEDED: Package Type]
NAND Flash (SLC) · 4 Gbit · x8 (multiplexed I/O) · TSOP1-48 · Surface Mount

✓ 在庫あり

$4.2 / 個

データシートを見る →

K9MDG08U5M

✅ ドロップイン ⚠️ 仕様未検証
Samsung Electronics
📦 [DATA_NEEDED: Package Type]
MLC Large Block NAND Flash · 16 Gbit (2 GB) · 16G x 8 bit · MLC (2 bits per cell) · 2.7 V · 3.6 V · Asynchronous x8 multiplexed address/data · 48-pin TSOP1 dual stacked, 12 mm x 20 mm

✓ 在庫あり

$35.5 / 個

データシートを見る →

K9LCG08U1M

✅ ドロップイン ⚠️ 仕様未検証
Samsung Electronics
📦 [DATA_NEEDED: Package Type]
NAND Flash, MLC · 64 Gbit (8 GB) · x8 I/O · Asynchronous multiplexed NAND I/O · MLC (2 bits per cell) · BGA · Surface Mount

✓ 在庫あり

$11.85 / 個

データシートを見る →

K9HCG08U1M

✅ ドロップイン ⚠️ 仕様未検証
Samsung Electronics
📦 [DATA_NEEDED: Package Type]
MLC NAND Flash · 64 Gbit · 8G x 8 · 8 bit · Asynchronous NAND (multiplexed address/data/command)

✓ 在庫あり

価格はお問い合わせください

データシートを見る →

K9UMGB8U7M 最大定格&電気的特性

メモリタイプ NAND Flash
Manufacturer Samsung Electronics
Family K9U series NAND Flash

K9UMGB8U7M standard ピン配置ガイド

K9UMGB8U7M (standard パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。

K9UMGB8U7M の standard パッケージピン配置図

詳細なピン配置データはありません: K9UMGB8U7M.

詳細は データシート をご参照ください。

主な用途

K9UMGB8U7M の用途: 6 件s: Set-Top Box and Digital TV Firmware Storage, Industrial Embedded Controllers, Networking Equipment Boot Storage, Consumer Electronics Mass Storage, Solid-State Drive and Storage Module Design, Smart Home and IoT Hub Storage.

📺

Set-Top Box and Digital TV Firmware Storage

The K9UMGB8U7M fits set-top box and digital television designs that must store firmware, channel databases, and application images in non-volatile memory. Samsung K9-family NAND provides the standard asynchronous x8 command interface that mainstream STB SoCs boot from directly, and its page/block organization supports efficient in-field firmware updates with copy-back operations. Placed on the boot bus with the host's NAND controller handling ECC and bad-block management, the device delivers high-density storage at low cost per bit. Design consideration: verify the controller ECC strength matches the NAND generation's requirement, and reserve replacement blocks in the partition map for long-term reliability across thousands of program/erase cycles in fleet deployments.

🏭

Industrial Embedded Controllers

Industrial PLCs, HMIs, and embedded controllers use the K9UMGB8U7M as low-cost non-volatile storage for application code, configuration data, and logging. Samsung K9-family NAND withstands the program/erase workload of periodic log writes when paired with a wear-leveling file system, and its standard interface integrates with common industrial SoCs. The part's non-volatile nature ensures configuration survives power loss, which is essential in factory automation. Design consideration: industrial environments see wide temperature swings and brown-outs, so enable write-protect during power-fail events and validate data retention over the full operating temperature using the reliability tables in the Samsung datasheet before deployment.

🌐

Networking Equipment Boot Storage

Routers, switches, and access points store bootloader and OS images in raw NAND such as the K9UMGB8U7M. The standard asynchronous NAND command interface supported by Samsung's K9 family works directly with the boot ROMs of common networking SoCs, while the device's page organization allows redundant image slots (A/B partitions) for fail-safe firmware upgrades. With the host implementing ECC and bad-block skipping, the NAND provides gigabit-class hardware with reliable field-updatable storage at minimal BOM cost. Design consideration: dual-image schemes should each fit within independently erased block groups so a failed update never corrupts both slots, and write-protect should gate the primary bootloader region.

📱

Consumer Electronics Mass Storage

Consumer products such as smart speakers, toys, appliances, and small displays use the K9UMGB8U7M to store media assets, voice models, and application data at the lowest cost per gigabyte. Samsung's K9-family NAND integrates with low-cost MCU host platforms, and its asynchronous interface requires no high-speed PHY design. Copy-back program operations reduce host CPU load when relocating data during garbage collection. Design consideration: consumer products typically see infrequent writes, so endurance is rarely the limiting factor - but cost-driven designs should size the partition table conservatively and include spare blocks, since consumer field conditions (power interruptions, heat buildup in enclosed housings) accelerate bad-block growth over product lifetime.

🖥️

Solid-State Drive and Storage Module Design

The K9UMGB8U7M can serve as a raw NAND component in SSD controllers and storage module designs, where multiple K9-family devices are combined under a dedicated NAND controller. Samsung K9 NAND's page/block architecture supports parallel channel architectures, and standard command timing simplifies controller firmware across device generations. In SSD applications, the controller performs aggressive ECC (BCH or LDPC), wear-leveling, and garbage collection that raw NAND requires. Design consideration: interleave multiple NAND dies across channels to hide program/erase latencies, and match the controller's supported ONFI timing modes to the Samsung datasheet specifications to avoid marginal read windows at maximum clock rates.

🧩

Smart Home and IoT Hub Storage

Smart home hubs, security gateways, and IoT edge devices use the K9UMGB8U7M to persist device provisioning data, firmware, and event buffers. Samsung K9-family NAND pairs well with mid-range IoT SoCs whose boot ROMs support the standard asynchronous NAND interface, and the device's non-volatile storage keeps security keys and network credentials intact through power cycles. Because IoT devices may write frequent sensor logs, the host's wear-leveling algorithm and the NAND's endurance rating jointly determine product lifetime. Design consideration: buffer log writes in RAM and commit in full pages to minimize program cycles, and reserve at least the datasheet-recommended spare-block ratio for long-term reliability in always-on deployments.

What is the K9UMGB8U7M?
The K9UMGB8U7M is a Samsung Electronics K9U-series NAND flash memory device intended for non-volatile mass storage in embedded and consumer systems. Samsung's K9 family uses the industry-standard asynchronous NAND command interface with CLE, ALE, WE, RE, and CE control signals. Exact density, organization, and package data for this MPN should be confirmed against the official Samsung datasheet, as verified distributor data was limited at the time of verification (2026-09-04).
Where can I buy K9UMGB8U7M online?
The K9UMGB8U7M can be sourced through authorized Samsung semiconductor distributors and franchised memory distributors such as DigiKey, Mouser, Arrow, and Avnet, as well as on XAIPART by requesting a quote. Because high-density NAND is a volatile commodity, availability shifts weekly; checking Octopart for aggregated distributor inventory is recommended. For volume pricing above 1000 units, Samsung regional sales offices or memory brokers typically provide the most competitive quotes as of the current sourcing date.
What is the price of K9UMGB8U7M?
Verified unit pricing for the K9UMGB8U7M was not available in the retrieved distributor data as of 2026-09-04. NAND flash pricing varies significantly with spot-market conditions, density, and order quantity, and Samsung typically quotes this class of component through distributor channels rather than fixed public price lists. Request a quote from XAIPART or check DigiKey and Mouser for the latest published price tiers before finalizing your BOM cost estimates.
What is the lead time for K9UMGB8U7M?
The exact lead time for the K9UMGB8U7M is not published in the verified data and must be confirmed with your distributor at order time. Raw NAND components from Samsung typically range from stock to 16 weeks depending on market conditions and density tier. During memory-market upcycles, allocation is common for high-density parts, so buyers designing new products should secure a supply agreement or buffer stock early in the program lifecycle.
What is the difference between K9UMGB8U7M and K9QDGB8U7M?
Both the K9UMGB8U7M and K9QDGB8U7M belong to Samsung's K9U-family NAND flash naming scheme, sharing the same suffix structure and general interface architecture. The generation/density letter in the MPN differs, indicating a different die generation and possibly different capacity or process node. Because both come from the same Samsung family, the command set and control-signal interface are typically very similar, but pin-level package compatibility and timing must be confirmed from each part's datasheet before substitution.
K9UMGB8U7M vs K9PDG08U5M - which should I choose?
Choose based on generation and interface requirements: the K9UMGB8U7M belongs to the K9U naming series, while the K9PDG08U5M is from the K9P series with an x8 data interface indicated by the 08 field. If your host controller was designed against the K9U timing and command profile, the K9UMGB8U7M integrates with fewer timing adjustments. For new designs, the newer generation part generally offers better endurance and process maturity. Always compare page size, block size, and ECC requirements in both datasheets before deciding.
Can K9QDGB8U7M replace K9UMGB8U7M?
Potentially, yes - the K9QDGB8U7M is a same-brand Samsung part from the same K9U family naming structure, which typically implies a closely related command interface and pinout. However, drop-in replacement status requires verifying three things from both datasheets: identical package outline and pin map, matching supply voltage, and compatible page/block organization with your ECC scheme. Since these parts may differ in die generation and capacity, validate timing parameters and bad-block behavior on hardware before production substitution.
Is K9UMGB8U7M the same as K9MDG08U5M?
No, they are not the same part. The K9UMGB8U7M and K9MDG08U5M are both Samsung K9-family NAND flash devices, but the generation letter (U versus M) and interface field (GB8U7M versus G08U5M) indicate different die generations and possibly different data-interface widths. Samsung uses these letter fields to encode density, generation, and interface options, so the two parts are electrically related but not identical. Treat them as related alternatives, not equivalents, until pin maps and timing are compared datasheet-to-datasheet.
Where to download the K9UMGB8U7M datasheet PDF?
Download the K9UMGB8U7M datasheet PDF from the official Samsung Semiconductor website (semiconductor.samsung.com) under the NAND flash product section, which hosts current K9-family documents. Aggregator sites such as AllDatasheet and Datasheet Archive also index Samsung K9-series datasheets, including the related K9WBG08U1M-P document which describes the family's x8-bit NAND architecture in 67 pages. Always prefer the Samsung official source for the latest revision and errata.
Where can I find the K9UMGB8U7M pinout?
The pinout of the K9UMGB8U7M is published in the official Samsung datasheet PDF available from semiconductor.samsung.com. K9-family NAND devices typically provide pins for the 8-bit I/O bus (I/O0 through I/O7), command latch enable (CLE), address latch enable (ALE), chip enable, write enable, read enable, ready/busy, write protect, and power pins. The precise pin numbering depends on the package variant, so consult the package-specific pin configuration diagram in the datasheet rather than assuming a generic layout.
What are the key specifications of K9UMGB8U7M that engineers should know?
Engineers evaluating the K9UMGB8U7M should know that it is a Samsung K9U-family NAND flash memory device with an industry-standard asynchronous NAND interface. The three most critical datasheet parameters to verify are: memory density and page/block organization, which determine your ECC and file-system design; supply voltage, typically a single VCC rail in this family; and program/erase endurance, which drives wear-leveling requirements. Exact numeric values were not verifiable in retrieved web data as of 2026-09-04, so obtain the official Samsung datasheet before finalizing your design.
Does K9UMGB8U7M require external ECC?
Yes, raw NAND flash such as the K9UMGB8U7M requires the host controller to implement error-correction code, since the device itself does not correct bit errors. Samsung K9-family datasheets specify ECC requirements per page, typically several bits of correction per a fixed number of bytes, which increases with multi-level cell technology. Your host MCU, SoC, or NAND controller must implement the required ECC strength (for example Hamming or BCH codes) plus bad-block management and wear-leveling for reliable long-term operation.
Is K9UMGB8U7M suitable for industrial applications?
It can be, provided the operating temperature grade and endurance match your environment. Samsung K9-family NAND parts are widely used in industrial embedded controllers, networking boot storage, and set-top boxes. For industrial designs, verify that the specific ordering suffix of the K9UMGB8U7M covers your required temperature range, and confirm program/erase endurance supports your write workload. For harsh environments, consider adding underfill and reviewing the reliability section of the Samsung datasheet, which covers data retention over temperature and time.
What is the best Samsung equivalent for K9UMGB8U7M?
The closest Samsung equivalents are same-family K9-series parts such as the K9QDGB8U7M, and adjacent-generation x8 NAND devices including the K9PDG08U5M, K9MDG08U5M, K9LCG08U1M, and K9HCG08U1M. Because these come from the same Samsung K9 product family, they share the standard asynchronous NAND command interface. True drop-in status depends on matching package outline, pin map, and page/block organization from each datasheet. Among them, the K9QDGB8U7M is the most direct candidate given its identical U7M suffix structure.
When should I choose K9UMGB8U7M over a managed NAND or eMMC solution?
Choose raw NAND like the K9UMGB8U7M when your design already includes a host controller capable of ECC, bad-block management, and wear-leveling, and when you need the lowest cost per gigabyte. Choose managed NAND or eMMC (such as Samsung KLM-series) when you want the memory controller integrated, shortening software development and avoiding NAND-specific firmware work. Raw NAND suits high-volume cost-sensitive products with mature controller platforms; managed solutions suit faster time-to-market and lower engineering risk.
Is K9UMGB8U7M still in production and RoHS compliant?
The K9UMGB8U7M is listed as an active Samsung product family member, but its exact lifecycle status should be confirmed on the Samsung Semiconductor product page, as mature NAND generations occasionally enter last-time-buy status. RoHS compliance for Samsung K9-series memory is standard for current production, but the compliance certificate for this exact MPN suffix should be downloaded from Samsung's environmental documentation portal. Verify both lifecycle and compliance directly with Samsung or your distributor before committing to new designs, as of 2026-09-04.

エンジニアリング参考データ: K9UMGB8U7M — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose the K9UMGB8U7M when your design already has a host controller with NAND ECC, bad-block management, and wear-leveling firmware, and when lowest cost per gigabyte is the priority - typical for set-top boxes, networking boot storage, and high-volume consumer products. Choose the K9QDGB8U7M first when dual-sourcing within the same K9U family, since its identical suffix structure suggests the closest pin and protocol match; validate package outline and page/block organization from both datasheets. Choose adjacent-generation parts (K9PDG08U5M, K9MDG08U5M, K9LCG08U1M, K9HCG08U1M) only when a second die generation is acceptable and your controller timing is configurable. If your team lacks NAND firmware expertise or time-to-market is tight, choose a managed NAND or eMMC solution instead, accepting higher unit cost for integrated error correction and a standard block-device interface. Always confirm exact specifications against the official Samsung datasheet before committing.

代替品との比較

パラメータ この製品 K9QDGB8U7M K9PDG08U5M K9MDG08U5M
Brand Samsung Electronics Samsung Electronics Samsung Electronics Samsung Electronics
Product Family K9U series NAND Flash K9U series NAND Flash K9P series NAND Flash K9M series NAND Flash
External ECC Required Yes (raw NAND) Yes (raw NAND) Yes (raw NAND) Yes (raw NAND)

主な差別化要因

  • Latest-generation K9U family naming (vs K9HCG08U1M)
  • Identical suffix structure to K9QDGB8U7M (vs K9QDGB8U7M)
  • Raw NAND cost structure (vs K9PDG08U5M)

設計ノート

Raw NAND such as the K9UMGB8U7M does not perform error correction internally. The host controller must implement the ECC strength specified for this NAND generation in the Samsung datasheet - under-specified ECC is the single most common cause of field data corruption in raw-NAND designs. Additionally, implement bad-block management from the factory-marked bad-block table and re-evaluate blocks after every erase cycle. Never assume a block is good simply because it passed at production test.

Decouple the NAND VCC rail with at least a 0.1uF ceramic capacitor placed within 5 mm of the device power pin, plus bulk capacitance near the board entry point. Program and erase operations draw short current bursts that can droop a weak supply rail and cause program failures. If the shared rail serves other peripherals, ensure the worst-case simultaneous programming current (per datasheet ICC values) is budgeted in the power supply design.

Keep the NAND control lines (CLE, ALE, WE, RE, CE, R/B) as a routed group with matched lengths where practical, and avoid routing them adjacent to switching regulator nodes that can capacitively couple glitches onto WE or RE. Enable the write-protect pin during power-up and power-down sequencing to prevent spurious program commands while VCC is unstable. For high-vibration products, confirm the package solder-joint reliability per the Samsung package reliability report.

コンプライアンス情報

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
鉛フリー
Unknown
ハロゲンフリー
Unknown
紛争鉱物
Unknown

Compliance status for the exact K9UMGB8U7M suffix was not found in the retrieved web data. Obtain the compliance certificate from Samsung's environmental documentation portal or your distributor.

データ検証日: 2026-09-04 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

関連検索

K9UMGB8U7M datasheet Samsung K9UMGB8U7M K9UMGB8U7M NAND flash specifications K9UMGB8U7M pinout package K9UMGB8U7M equivalent substitute K9UMGB8U7M vs K9QDGB8U7M K9UMGB8U7M drop-in replacement buy K9UMGB8U7M price Samsung K9U series NAND flash set-top box raw NAND flash external ECC requirement what is the best Samsung equivalent for K9UMGB8U7M K9UMGB8U7M lead time stock availability

関連部品&用語

Samsung Electronics K9UMGB8U7M K9QDGB8U7M K9PDG08U5M K9MDG08U5M K9LCG08U1M K9HCG08U1M NAND flash flash memory non-volatile memory memory IC semiconductor raw NAND ECC (error correction code) wear-leveling bad-block management K9U series asynchronous NAND interface RoHS set-top box embedded storage SSD controller surface mount package
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