K9QDGB8U7M - Samsung NAND Flash Memory | Samsung Electronics
MPN: K9QDGB8U7M ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
Drop-in alternatives for K9QDGB8U7M — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
K9HQGY8S5M
✅ Drop-In ⚠️ 参数待验证✓ In Stock
Contact for price
View Datasheet →K9PRGY8S7M
✅ Drop-In ⚠️ 参数待验证✓ In Stock
Contact for price
View Datasheet →K9PDG08U5M
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$4.2 / Unit
View Datasheet →K9MDG08U5M
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$35.5 / Unit
View Datasheet →K9PKGY8S7M-CCK0
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$9.4 / Unit
View Datasheet →K9QDGB8U7M Maximum Ratings & Electrical Characteristics
| Manufacturer | Samsung Electronics |
| Product Family | K9 NAND Flash |
| Memory Type | NAND Flash |
| Package Type | BGA (surface mount) |
| Mounting Type | Surface Mount |
K9QDGB8U7M bga (surface mount) Pin Configuration Guide
Complete pinout information for K9QDGB8U7M (bga (surface mount) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for K9QDGB8U7M.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
K9QDGB8U7M is suitable for 6 applications: Embedded Firmware Storage, Consumer Electronics Mass Storage, Industrial Control and HMI Storage, Networking Equipment Boot Storage, Automotive Infotainment and Telematics, IoT Gateways and Smart Home Hubs.
Embedded Firmware Storage
Samsung K9-family NAND such as the K9QDGB8U7M is widely used to store bootloaders, kernels, and root filesystems in embedded systems. The BGA package suits compact, soldered-down designs where field replacement is impossible, so data integrity mechanisms are essential. The host controller must supply ECC (BCH or LDPC per the generation) and a flash translation layer with wear-leveling, because raw NAND blocks have finite program/erase cycles. Placed on a dedicated NAND chip-select with ready/busy monitoring, the device provides non-volatile storage that survives power loss without battery backup. Designers should reserve spare blocks and implement bad-block skip to sustain reliability over the product lifetime.
Recommended
Consumer Electronics Mass Storage
In set-top boxes, smart TVs, and digital media devices, K9-family NAND flash provides affordable high-density storage for application code, channel databases, and recorded content metadata. The Samsung K9QDGB8U7M's BGA footprint integrates directly onto the main board, reducing connector cost versus removable cards. A NAND controller manages page programming with correct command sequencing and enforces the datasheet-specified program/erase timing. Because consumer workloads are write-light, endurance is rarely the limiting factor; instead, retention and ECC strength dominate. Designers benefit from Samsung's long-life K9 supply chain and documented controller reference designs when qualifying this device class.
Recommended
Industrial Control and HMI Storage
Industrial controllers and human-machine interfaces use NAND flash like the K9QDGB8U7M for configuration data, logging, and firmware images that must survive power interruptions and wide temperature swings. The soldered BGA package withstands vibration better than socketed solutions. Designers must implement power-fail recovery: complete atomic page writes, journal the file system, and validate block integrity at boot. Conformal-coated boards are compatible with the package surface. Selecting the correct operating-temperature grade from the Samsung datasheet is critical, as commercial grades may not cover the -40C to +85C industrial envelope required on factory floors.
Recommended
Networking Equipment Boot Storage
Routers, switches, and access points rely on NAND flash such as the K9QDGB8U7M to hold bootloader, OS image, and configuration files. The device's non-volatile storage enables dual-image (A/B) firmware schemes: the network device validates a new image in NAND before switching the active boot slot, enabling safe over-the-network upgrades. Read latency and interface bandwidth influence boot time; verifying the device's toggle/ONFI timing parameters against the controller is essential. Redundant ECC and bad-block tables stored in reserved blocks protect configuration integrity across years of continuous 24/7 operation in telecommunications cabinets.
Recommended
Automotive Infotainment and Telematics
Automotive head units and telematics control units use NAND flash families like the Samsung K9 line for navigation maps, media caching, and firmware. When an automotive-qualified variant is required, designers should verify the exact grade suffix, since standard K9 parts may not be AEC-Q100 qualified. The BGA package supports the compact, thermally demanding layouts typical of dashboard electronics, where sustained temperatures reach 85C ambient. Controllers must manage aggressive write workloads (map updates, logs) with robust wear-leveling, and power-fail protection circuits must guard against ignition transients corrupting in-flight page programs.
Recommended
IoT Gateways and Smart Home Hubs
IoT gateways use NAND flash like the K9QDGB8U7M to store device certificates, firmware, and locally cached sensor data between cloud synchronizations. The soldered-down BGA package prevents tampering compared with removable SD cards, supporting secure-boot chains that hash the stored image at every startup. Storage sizing must account for log rotation and firmware staging: over-provisioning spare area extends endurance under small, frequent writes typical of telemetry. Pairing the NAND with a low-power controller that supports partial-page programming and deep power-down modes helps keep gateway standby current within battery or energy-harvesting budgets.
Recommended
Recommended Products Summary
Engineering reference data for K9QDGB8U7M — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | K9HQGY8S5M | K9PRGY8S7M | K9PDG08U5M |
|---|---|---|---|---|
| Package | BGA (surface mount) | BGA | BGA | BGA |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics |
| Memory Type | NAND Flash (K9 family) | NAND Flash (K9 family) | NAND Flash (K9 family) | NAND Flash (K9 family) |
| Density | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Interface | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Supply Voltage | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| ECC Requirement | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Operating Temperature | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Long-established K9 family supply chain (vs K9PDG08U5M)
- Speed-grade suffix option (vs K9PRGY8S7M-CCK0)
- Soldered BGA form factor (vs K9XXG08U0M (TSOP))
Design Notes
Verify VCC and VCCQ rails and their power-ramp/sequencing requirements from the official Samsung K9QDGB8U7M datasheet before power design. NAND flash requires the supply to reach operating voltage within the datasheet-specified ramp rate; slow or unstable power-up can leave internal bad-block tables uninitialized. Add bulk capacitance near the device because program operations draw short current pulses, and ensure power-fail protection so an interrupted page program does not corrupt adjacent pages.
For BGA NAND flash, fan out data, command/address, and control lines with matched lengths where the controller runs toggle-DDR or ONFI timing; follow Samsung's layout guidelines for via-in-pad or dog-bone fanout of the ball array. Keep the ready/busy line short and pull it up with the specified resistor value. Provide solid ground return under the package to reduce simultaneous-switching noise on the data bus during high-speed reads.
The most common K9-family NAND integration errors are: operating without datasheet-specified ECC strength, ignoring bad-block management (initial bad blocks shipped from the factory are marked in the first pages of each block and must be scanned and skipped), and assuming cross-generation command-set compatibility. Samsung NAND generations change page size, timing, and ECC requirements - always re-qualify controller firmware when substituting any K9-family part number.
Compliance Information
Compliance status not found in verified data as of 2026-09-04. Request Samsung's official material declaration and environmental reports for the exact part number and date code.
