K9LCG08U1M - 64Gbit MLC NAND Flash | Samsung | SSD Storage
MPN: K9LCG08U1M ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $13.5 | $13.50 |
| 10 | $12.95 | $129.50 |
| 100 | $12.6 | $1,260.00 |
| 500 | $12.2 | $6,100.00 |
| 1,000 | $11.85 | $11,850.00 |
Drop-in alternatives for K9LCG08U1M — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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K9HCG08U1M
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View Datasheet →K9HQGY8S5M
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View Datasheet →K9F2808Q0B
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View Datasheet →K9LCG08U1M Maximum Ratings & Electrical Characteristics
| Memory Type | NAND Flash, MLC |
| Density | 64 Gbit (8 GB) |
| Organization | x8 I/O |
| Interface | Asynchronous multiplexed NAND I/O |
| Cell Type | MLC (2 bits per cell) |
| Package | BGA |
| Mounting Type | Surface Mount |
| RoHS Status | unknown |
| Ordering Codes | K9LCG08U1M-LCB0 / K9LCG08U1M-LCB00 / K9LCG08U1M-LCB |
K9LCG08U1M bga Pin Configuration Guide
Complete pinout information for K9LCG08U1M (bga package) with 48 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for K9LCG08U1M.
Refer to the datasheet for full pin configuration.
Estimated pin count: 48 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
K9LCG08U1M is suitable for 6 applications: Solid State File Storage, Industrial Embedded Storage, Set-Top Boxes and Consumer Electronics, Portable and Battery-Powered Devices, Storage Module and eMMC Subsystem Design, Data Logging and Event Recorders.
Solid State File Storage
The K9LCG08U1M's 64 Gbit MLC density in a compact BGA makes it a fit for solid state file storage systems where large non-volatile capacity per package is the priority. Supplier documentation explicitly positions it as an optimum solution for such applications. In a typical SSD or storage-module architecture, multiple NAND packages connect to a controller over the multiplexed NAND bus, with the controller handling BCH or LDPC ECC, interleaved multi-die operation, and wear leveling to manage MLC endurance. Because MLC stores two bits per cell, the cost per gigabyte is roughly half that of SLC, but the controller must budget for higher bit-error rates and longer program times. Designers should parallelize several packages to increase effective bandwidth beyond a single die's read throughput.
Recommended
Industrial Embedded Storage
Industrial controllers, gateways, and data loggers need reliable non-volatile code and data storage, and the K9LCG08U1M provides 8 GB of MLC NAND in a surface-mount BGA suitable for compact industrial boards. In these designs, the NAND typically stores the file system, firmware images, and logging data behind a controller implementing power-fail protection, bad-block remapping, and wear leveling. The MLC cell type keeps cost per bit low, which matters in cost-sensitive industrial volumes, but designers must verify the ordering code's temperature range in the Samsung datasheet and select a wide-temperature suffix for harsh environments. Decoupling capacitors on the NAND supply rail and clean power sequencing during brownout events are essential to prevent data corruption.
Recommended
Set-Top Boxes and Consumer Electronics
Set-top boxes, smart TVs, and networked consumer devices use high-density NAND like the K9LCG08U1M for channel databases, application storage, and DVR buffering. The 64 Gbit MLC device offers the capacity these platforms need at consumer price points, and its standard asynchronous NAND interface connects directly to mainstream SoCs with built-in NAND controllers and hardware ECC. The controller's LDPC or BCH engine handles MLC error rates, while firmware wear leveling sustains the write endurance demanded by DVR-style recording workloads. The BGA package supports the compact two-layer to four-layer PCB constructions typical of consumer hardware. Designers should confirm the speed-grade suffix timing matches the SoC NAND controller's supported interface timing modes before layout.
Recommended
Portable and Battery-Powered Devices
Portable applications requiring non-volatility - handheld terminals, test instruments, and mobile accessories - benefit from the K9LCG08U1M's combination of high density and low per-bit cost. Supplier listings describe the device as an optimum solution for portable applications requiring non-volatility. In battery-powered designs, the NAND's standby current draw is negligible relative to the system, and the asynchronous interface avoids the power cost of a high-speed memory bus. The BGA footprint keeps board area small for thin form factors. Because MLC program operations take longer than SLC, firmware should buffer writes in RAM and batch them to reduce erase cycles, directly extending battery-adjacent storage lifetime and improving perceived responsiveness of the device.
Recommended
Storage Module and eMMC Subsystem Design
Designers building storage modules - raw-NAND cards, industrial SD-like modules, or custom eMMC-class subsystems - can build around multiple K9LCG08U1M packages. Density denoted by Samsung's K9 nomenclature allows parallel dies for capacity aggregation: a controller exposing an SD, eMMC, or SATA front end manages four to eight NAND packages with interleaving to multiply bandwidth. The MLC architecture's endurance is handled through dynamic and static wear leveling plus over-provisioning, typically 7% or more of capacity. The identical command set across Samsung's K9 family lets one firmware image support multiple bill-of-material densities, simplifying product SKUs. Verify ball-map compatibility when mixing K9LCG08U1M with other family parts on the same PCB footprint.
Recommended
Data Logging and Event Recorders
Event recorders, black-box loggers, and telemetry systems require storage that survives power loss and years of cyclic writing. The K9LCG08U1M's 8 GB MLC array supports extensive logging histories, and its non-volatile cells retain data without power indefinitely. A logging controller writes fixed-record blocks into NAND pages, using bad-block tables and wear leveling to spread erase cycles evenly; at moderate write rates this extends service life well beyond typical mission intervals. The multiplexed NAND interface needs only modest controller GPIO resources, suiting cost-sensitive recorder hardware. Because sudden power removal can corrupt an in-progress program operation, firmware must implement write-verify and journaling so that the last valid record is always recoverable.
Recommended
Recommended Products Summary
Engineering reference data for K9LCG08U1M — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | K9HCG08U1M | K9XXG08U0M | K9XXG08UXM | K9HQGY8S5M | K9F2808Q0B |
|---|---|---|---|---|---|---|
| Package | BGA | BGA | BGA | BGA | BGA | BGA |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics |
| Cell Type | MLC | MLC | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| I/O Organization | x8 | x8 | x8 | x8 | [DATA_NEEDED] | x8 |
| Interface | Asynchronous NAND | Asynchronous NAND | Asynchronous NAND | Asynchronous NAND | [DATA_NEEDED] | Asynchronous NAND |
| Typical Unit Price (qty 1) | $13.50 (as of 2026-09-04) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Target Application | Solid state file storage, portable non-volatile storage | High-density solid state storage | Embedded NAND storage | Embedded NAND storage | High-density NAND generation | Legacy code/data storage |
| Lifecycle Status | Active (independent distributor stock) | Active | Active | Active | Active | Legacy |
Key Differentiators
- 64 Gbit MLC density balances cost and capacity (vs K9F2808Q0B)
- Same-family migration path within Samsung K9 catalog (vs K9HCG08U1M)
- MLC cost structure versus higher-density newer generations (vs K9HQGY8S5M)
Design Notes
Never operate the K9LCG08U1M without ECC. As MLC NAND, raw bit-error rates are substantially higher than SLC, and the Samsung datasheet assumes controller-managed error correction (BCH or LDPC) sized for the device's page size. Additionally, always build to the complete ordering code (LCB0, LCB00, or LCB) rather than the bare base MPN, because timing and voltage grades are encoded in the suffix. Ordering on the base MPN alone risks receiving a speed grade incompatible with your controller timing configuration.
The BGA package requires reflow soldering - hand soldering is not feasible. Follow the Samsung datasheet reflow profile limits and inspect solder joints with X-ray or AOI, since NAND BGAs hide voids beneath the die area. Place 100 nF ceramic decoupling capacitors within 2-3 mm of each supply ball, plus bulk 10 uF capacitance per package. Keep the multiplexed command/data/address bus traces length-matched where multiple NAND packages share the bus, and add series termination on long I/O lines to control ringing at fast read cycles.
Implement power-fail protection in the storage firmware: an interrupted MLC program operation can corrupt the target page, so design the system to detect brownout (via a supply supervisor), flush controller RAM buffers, and mark the interrupted block for later verification and remapping. Estimated: NAND program current is modest, but simultaneous program across multiple stacked dies can create transient load steps - size the bulk capacitance for the aggregate inrush of all dies programming in interleaved mode.
On shared NAND buses with multiple K9-family packages, ensure only the selected device drives I/O during read cycles; contention from an un-tri-stated device corrupts data. Verify that pull-up resistors on R/B (ready/busy) lines are sized so rise times meet your controller's timing budget when several devices share one R/B line in stacked configurations.
Compliance Information
Compliance status not stated in the provided web data; obtain declarations from Samsung or the stocking distributor.
