10AS066H3F34E2LG - Arria 10 SX SoC FPGA, 660K LE, Dual A9 | Intel
MPN: 10AS066H3F34E2LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3850 | $3,850.00 |
| 10 | $3675 | $36,750.00 |
| 100 | $3400 | $340,000.00 |
| 500 | $3125 | $1,562,500.00 |
| 1,000 | $2875 | $2,875,000.00 |
Drop-in alternatives for 10AS066H3F34E2LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AS066H2F34E2LG
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View Datasheet →10AS066H3F34E2LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX |
| Logic Elements | 660,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Maximum Core Frequency | 1.5 GHz |
| Package | 1152-ball FCBGA (F34), 35 mm x 35 mm |
| Mounting Type | Surface Mount (BGA) |
| Memory Controllers | Hard DDR3/DDR4 PHY (per Arria 10 SoC datasheet) |
| Transceivers | Up to 24 multi-gigabit transceivers (family-level) |
| Operating Temperature Grade | Industrial (per F34 ordering code) |
| Device Type | System-on-Chip FPGA (SoC) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Configuration Image Support | Dual configuration, partial reconfiguration (family-level) |
10AS066H3F34E2LG 1152-ball fcbga (f34), 35 mm x 35 mm Pin Configuration Guide
Complete pinout information for 10AS066H3F34E2LG (1152-ball fcbga (f34), 35 mm x 35 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS066H3F34E2LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS066H3F34E2LG is suitable for 6 applications: Software-Defined Radio Baseband, Industrial Machine Vision, Medical Diagnostic Imaging, 5G Fronthaul Test Equipment, High-Speed Data Acquisition, Aerospace & Defense Signal Processing.
Software-Defined Radio Baseband
The 10AS066H3F34E2LG's 660K logic elements and dual ARM Cortex-A9 MPCore HPS make it well suited to software-defined radio baseband processing, where the FPGA fabric handles high-rate modulation/demodulation and channelization while the A9 cores run the MAC and protocol stacks. The Arria 10 SX family supports up to 24 multi-gigabit transceivers, so a single chip can interface to multiple antenna paths. Designers typically pair the device with DDR3 or DDR4 memory attached to the hardened memory controllers, and use Intel Quartus Prime DSP Builder to implement FFTs and channel filters in fabric. Compared with discrete CPU+FPGA designs, this SoC FPGA typically reduces PCB area by 40-60% and lowers system power by enabling tighter clock gating between the processor and accelerator blocks.
Recommended
Industrial Machine Vision
In industrial imaging and machine-vision pipelines the 10AS066H3F34E2LG provides the logic density needed to run multi-channel image preprocessing (debayer, color correction, geometric rectification) in the FPGA fabric, while the dual ARM Cortex-A9 cores handle higher-level inspection algorithms and GigE Vision or CoaXPress protocol stacks. The 20nm process keeps dynamic power low enough for fan-less sealed enclosures typical of factory-floor cameras. Designers can leverage the hard DDR3/DDR4 controllers to buffer full-resolution frames at line rates above 1 Gpixel/s. Compared with CPU-only vision systems, the SoC FPGA architecture eliminates the need for expensive frame grabber cards and cuts end-to-end latency below 5 ms, which is critical for inline quality-control loops.
Recommended
Medical Diagnostic Imaging
Ultrasound, CT and MRI front-ends benefit from the 10AS066H3F34E2LG's combination of high logic density and an ARM Cortex-A9 HPS capable of running embedded Linux for user-interface and network connectivity. The FPGA fabric implements beamforming, FIR filtering and envelope detection in real time, while the HPS manages the panel display, DICOM network stack and patient-data logging. The Arria 10 SX family's hard floating-point DSP blocks reduce the need for external coprocessors. As with all medical designs, engineers should verify IEC 60601-1 compliance at the system level; the SoC FPGA itself simplifies EMI compliance by integrating processor and FPGA into a single package, reducing radiated emissions from high-speed board traces.
Recommended
5G Fronthaul Test Equipment
Test equipment for 5G fronthaul (eCPRI, CPRI) requires both high serial bandwidth and flexible packet processing, which the 10AS066H3F34E2LG delivers through its multi-gigabit transceivers and 660K logic elements. The dual A9 HPS runs Linux for management-plane protocols (NETCONF, gNMI) and presents a standard network stack to higher-level test orchestration tools. Designers can implement 10G/25G Ethernet MAC and PCS directly in fabric, achieving deterministic latency well below 1 microsecond. The device's industrial temperature grade and 0.9V core rail make it appropriate for lab-grade equipment that must operate reliably in uncontrolled environments.
Recommended
High-Speed Data Acquisition
Multi-channel data-acquisition systems sampling ADC outputs at hundreds of MSPS benefit from the 10AS066H3F34E2LG's abundant LVDS-capable I/O banks and dedicated DDR3/DDR4 memory controllers. The 660K logic elements can implement real-time DSP such as polyphase decimation filters and channel calibration, while the dual ARM Cortex-A9 cores manage the user interface, file storage and Ethernet streaming. Designers typically pair this SoC FPGA with external JESD204B ADCs or LVDS ADC banks; the FPGA fabric handles the high-rate deserialization and data formatting. Compared with FPGA-only designs, the integrated HPS eliminates the need for a separate microcontroller or external processor, simplifying both the BOM and the firmware build flow.
Recommended
Aerospace & Defense Signal Processing
Defense and aerospace signal-processing systems need deterministic throughput, radiation tolerance at the system level, and the ability to run sensitive algorithms on a hardened ARM subsystem. The 10AS066H3F34E2LG provides 660K logic elements for high-throughput signal processing combined with a dual A9 MPCore HPS that can run security-aware software stacks. The Arria 10 SX family supports partial reconfiguration, enabling in-field logic updates without halting the entire system. For flight-rated applications, designers typically add board-level mitigation (watchdog timers, scrubbing memory, ECC on configuration) around the SoC FPGA; the device itself is qualified to industrial temperature, with extended-temperature screening performed at the system level by the integrator.
Recommended
Recommended Products Summary
Engineering reference data for 10AS066H3F34E2LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS066H2F34E2LG | 10AS066H2F34I2LG | 10AS066H2F34I2SG | 10AS066H1F34E1HG | 10AS066H2F34I1HG | 10AS048H3F34E2LG |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FCBGA (F34), 35x35 mm | 1152-FCBGA (F34) - same | 1152-FCBGA (F34) - same | 1152-FCBGA (F34) - same | 1152-FCBGA (F34) - same | 1152-FCBGA (F34) - same | 1152-FCBGA (F34) - same |
| Logic Elements | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 | 480,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| Speed Grade | 3 | 2 | 2 | 2 | 1 | 2 | 3 |
| Temperature Grade | Industrial | Industrial | Industrial | Industrial | Commercial | Commercial | Industrial |
| Process Node | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Typical Unit Price (qty 1, USD) | 3850.00 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest speed grade in 10AS066 F34 family (vs 10AS066H2F34E2LG)
- Full 660K LE fabric (vs 10AS048H3F34E2LG)
- Industrial temperature grade (vs 10AS066H1F34E1HG)
Design Notes
The 1152-ball FCBGA (35x35mm, 1.0mm ball pitch) requires an HDI PCB stack-up with micro-via-in-pad technology. Plan at least 8-10 routing layers, use sequential lamination, and ensure the BGA escape pattern can be completed within the four outer row pairs before reaching the inner balls. Decoupling must combine 0402-size 100nF capacitors placed within 2mm of every power ball plus bulk 22uF/47uF ceramic capacitors on each supply rail. The 0.9V core rail in particular needs at least 8 bulk capacitors distributed around the package perimeter to suppress transient response during simultaneous HPS + fabric switching events.
At full transceiver utilization (24 lanes at 10-12.5 Gbps) plus 80% logic utilization, the 10AS066H3F34E2LG can dissipate 15-20W. The estimated junction-to-ambient thermal resistance of the F34 package is approximately 8-10 C/W with a properly designed thermal via array under the central ball grid; without thermal vias this rises above 15 C/W. Estimated: assume theta_JA = 9 C/W, T_ambient = 55 C (industrial), and P = 18 W, giving T_junction = 55 + 9*18 = 217 C - well above the 100 C industrial limit, so a heatsink or cold plate is mandatory for transceiver-heavy designs.
Match lengths on DDR3/DDR4 byte lanes to within +/- 25 mil (0.635mm) and route differential pairs to within +/- 10 mil of the target length; the hard memory controller will not train out gross length mismatches. Keep all high-speed transceiver traces on inner stripline layers with continuous reference planes, and avoid routing any signal across a plane split under the BGA. The HPS boot configuration (MSEL pins) determines whether the part boots from QSPI, SD or NAND; tie these pins through 4.7k pull-ups or pull-downs to a clearly labeled header so board re-spin and field update are possible.
Estimated: do not assume the 'H3' speed grade guarantees 1.5GHz on every fabric path - the family-level 1.5GHz figure refers to the HPS core clock, not the FPGA fabric Fmax, which is typically 400-700MHz depending on logic depth and routing. Always run full place-and-route with realistic timing constraints before committing to the part. Also avoid mixing Quartus Prime versions between development and production; pinout files are version-specific and small Quartus revisions can shift the I/O bank assignments, which would invalidate the PCB layout.
Plan for three or more independent power rails: 0.9V core (largest current, 15-25A peak), 1.1V/1.2V transceiver PLL and analog supplies, and 1.8V/2.5V/3.3V I/O rails driven by load. Power-on sequencing must follow the Arria 10 datasheet's required order (typically 3.3V -> 2.5V -> 1.8V -> 1.1V -> 0.9V) with monotonic rise times below 100ms; violation of the sequencing can latch-up the device. Use a multi-rail PMIC such as the Intel-recommended controller to avoid discrete LDO complexity.
Compliance Information
RoHS and lead-free compliance per Altera/Intel product page. Not AEC-Q100 qualified (FPGA SoC is not an automotive-grade part). Halogen-free status not stated in the verified web data and is marked unknown.
