A3PE3000L-FGG484 - ProASIC3L Low Power FPGA 3M Gates | Microchip
MPN: A3PE3000L-FGG484 ✓ Active| Qty | Unit Price | Extended |
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| 10 | $0 | $0.00 |
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| 500 | $0 | $0.00 |
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Drop-in alternatives for A3PE3000L-FGG484 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A3PE3000L-FG484
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$112 / Unit
View Datasheet →A3PE3000L-FG484I
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Contact for price
View Datasheet →A3PE3000L-FG484M
✅ Drop-In📋 Reference alternative (not in catalog)
A3PE3000L-1FGG484I
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$104.5 / Unit
View Datasheet →A3PE3000-1FGG484I
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$1336.6 / Unit
View Datasheet →A3PE3000L-FGG484 Maximum Ratings & Electrical Characteristics
| Family | ProASIC3L (Low Power Flash FPGA) |
| System Gates | 3,000,000 |
| Logic Cells | 75,264 |
| User I/O | 341 |
| Embedded RAM | 516,096 bits |
| Core Voltage | 1.2 V to 1.5 V |
| Process Technology | 130 nm flash |
| Configuration Technology | Nonvolatile flash, Instant On |
| Low Power Feature | Flash*Freeze technology |
| Package | 484-ball FBGA (FGG484), 23 x 23 x 2.44 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant (per Newark: RoHS Compliant: Yes) |
| Packaging | Tray |
| Security | Single-chip, flash-based, secure nonvolatile configuration |
A3PE3000L-FGG484 484-ball fbga (fgg484), 23 x 23 x 2.44 mm, 1.0 mm pitch Pin Configuration Guide
Complete pinout information for A3PE3000L-FGG484 (484-ball fbga (fgg484), 23 x 23 x 2.44 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE3000L-FGG484.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE3000L-FGG484 is suitable for 6 applications: Industrial Automation and Control, Battery-Powered Portable Instrumentation, Aerospace and Defense Secure Systems, Communications Line Cards and Networking, Medical Diagnostic Equipment, Secure Embedded Control and IoT Gateways.
Industrial Automation and Control
The A3PE3000L-FGG484's 75,264 logic cells and 341 user I/Os give industrial controllers enough fabric for multi-axis motor sequencing, fieldbus protocol bridging, and safety interlock logic in a single nonvolatile chip. Because configuration is stored in on-chip flash, the FPGA is Instant On and begins supervising I/O immediately at power-up - critical for machinery that must fail safe. The 1.2 V core option and Flash*Freeze mode cut power in standby, reducing cabinet thermal load. Place the device between a microcontroller and dense I/O (relays, encoders, sensors) using the 516,096-bit embedded RAM for line buffering, with VersaNet globals distributing a single low-skick clock across the logic.
Recommended
Battery-Powered Portable Instrumentation
For handheld test equipment, portable medical monitors, and battery-operated data loggers, static and dynamic power dominate battery life. The A3PE3000L-FGG484 addresses both: the 1.2 V core voltage reduces dynamic switching energy, while Flash*Freeze technology drops the fabric into an ultra-low static state that retains register and I/O context between measurements. Nonvolatile flash configuration eliminates the boot-time power spike of SRAM FPGAs, so the instrument wakes instantly from off-state. With 341 I/Os the device can drive displays, analog front ends, and radio interfaces from one chip; use the 516,096-bit RAM for sample buffering between wake events to further extend battery runtime.
Recommended
Aerospace and Defense Secure Systems
Defense and aerospace designers choose ProASIC3L flash FPGAs because the bitstream lives entirely on-chip: there is no external configuration flash to probe, no configuration readback path, and no bitstream on the bus at boot - a major anti-tamper advantage over SRAM FPGAs. The A3PE3000L-FG484M military-grade variant of this exact die is orderable for extended-temperature programs, and the commercial A3PE3000L-FGG484 fits avionics lab and ground equipment. The 3M-gate fabric implements encryption, bus interfaces (MIL-STD-1553, SpaceWire bridges), and glueless memory control, while single-chip operation reduces board count, mass, and failure points in constrained payloads.
Recommended
Communications Line Cards and Networking
In telecom and datacom line cards, the A3PE3000L-FGG484 works as a protocol bridge and traffic manager between PHYs, MACs, and backplanes. The 341 I/Os accommodate wide parallel POS-PHY-style data paths plus management interfaces, and the 516,096-bit embedded RAM implements FIFOs and rate-adaption buffers between clock domains. VersaNet low-skew global networks, described in Microchip's ProASIC3E fabric user guide, distribute the system reference clock across the fabric with minimum skew for reliable high-fanout timing. Because configuration is nonvolatile, cards initialize the moment shelf power arrives, simplifying hot-swap sequencing versus SRAM FPGA designs that must load bitstreams over a management bus.
Recommended
Medical Diagnostic Equipment
Benchtop analyzers, imaging front ends, and patient-monitoring hardware benefit from the A3PE3000L-FGG484's combination of instant-on operation and deterministic logic. Sensor arrays and actuator banks connect through the 341 I/Os without external glue logic, and the flash fabric holds its configuration through power cycles, so calibration sequencing logic is active from the first millisecond of power-up. Flash*Freeze mode lets the system drop the digital section to microwatt-class static draw between sampling windows, extending standby operation in battery-backup scenarios required in clinical settings. Nonvolatile single-chip configuration also removes the system-level single point of failure of an external boot flash in devices where uptime matters.
Recommended
Secure Embedded Control and IoT Gateways
The ProASIC3L's flash architecture provides inherent design protection for IoT gateways and secure embedded controllers: the FPGA configuration cannot be cloned by reading an external flash, and intellectual property embedded in the fabric stays on-chip. The A3PE3000L-FGG484 implements secure boot support logic, sensor-fusion preprocessing, and multiple UART/SPI/I2C-style interfaces across its 341 I/Os, aggregating edge devices toward a network processor. With a 1.2 V core option the gateway's standby draw stays low, and Flash*Freeze suspends the fabric while the host sleeps. The 516,096-bit RAM buffers burst traffic between slow edge interfaces and fast uplinks without external FIFO chips.
Recommended
Recommended Products Summary
Engineering reference data for A3PE3000L-FGG484 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE3000L-FG484 | A3PE3000L-FG484I | A3PE3000L-FG484M | A3PE3000L-1FGG484I | A3PE3000-1FGG484 |
|---|---|---|---|---|---|---|
| Package | 484-FBGA (FGG484), 23 x 23 mm, 1.0 mm pitch | 484-FBGA (FG484) - same footprint | 484-FBGA (FG484) - same footprint | 484-FBGA (FG484) - same footprint | 484-FBGA (FGG484) - same footprint | 484-FBGA (FGG484) - same footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| User I/O | 341 | 341 | 341 | 341 | 341 | 341 |
| Embedded RAM | 516,096 bits | 516,096 bits | 516,096 bits | 516,096 bits | 516,096 bits | 516,096 bits |
| Core Voltage | 1.2 V to 1.5 V (low power) | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.5 V (ProASIC3E standard) |
| Flash*Freeze Low Power Mode | Yes | Yes | Yes | Yes | Yes | No |
| Temperature Grade | Commercial | Commercial | Industrial | Military | Industrial | Commercial |
| Speed Grade | Standard | Standard | Standard | Standard | -1 (faster) | -1 (faster) |
| Pricing Tier 1 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Low-power flash fabric with Flash*Freeze (vs A3PE3000-1FGG484)
- Extended temperature availability on identical footprint (vs A3PE3000L-FG484I)
- Nonvolatile single-chip security (vs A3PE3000-1FGG484)
- Faster timing closure option without relayout (vs A3PE3000L-1FGG484I)
Design Notes
Take advantage of the dual core-voltage capability: run VCC at 1.2 V for minimum dynamic power, or 1.5 V for maximum performance margin. Estimated: at this fabric size, static current scales strongly with core voltage, so a 20% supply reduction yields substantial standby savings even before engaging Flash*Freeze. Design the core rail with a regulator that supports both setpoints if you may re-target speed grades later. During Flash*Freeze, I/O states are retained; verify your board-level pull resistors do not fight retained outputs and waste the saved power.
The FGG484 is a 23 x 23 mm, 1.0 mm-pitch BGA with 484 balls; route with via-in-pad or dog-bone fanout on at least a 6-layer stack. The dense center columns typically carry power/ground - dedicate inner layers to solid VCC/GND planes to minimize di/dt droop on the core rail and give the VersaNet global clock network a quiet reference. Keep 1.2 V core decoupling (multiple 100 nF ceramics plus bulk capacitance) on the die-side of the board; per Microchip power-up requirements, sequence or monitor the core rail per the ProASIC3L datasheet power-supply section.
Do not treat this part as interchangeable with any cross-brand FPGA: the pinout and flash configuration architecture are Microchip-proprietary, and SRAM FPGA substitutes require external boot flash and PCB redesign. Also verify speed grade in Libero SoC timing closure - the -1 (faster) A3PE3000L-1FGG484I exists precisely because the standard grade may not close timing at high clock rates. Finally, distinguish FG from FGG suffixes when qualifying: FGG denotes Pb-free finish (RoHS), FG does not - check your end-product compliance requirement before purchase.
With 341 user I/Os spread across multiple banks, group interfaces by I/O bank voltage and keep simultaneously switching outputs on a bank whose ground return path is short. Use the VersaNet low-skew global networks for clocks, resets, and high-fanout control signals, as recommended in Microchip's ProASIC3E fabric user guide - routing these on general fabric adds skew. For memory interfaces implemented in the 516,096-bit RAM subsystem, apply length matching on address/control groups within the 1.0 mm-pitch breakout region constraints.
Compliance Information
Newark listing states 'RoHS Compliant: Yes'; FGG suffix denotes Pb-free ball/lead finish per Microchip naming. REACH, halogen-free, and conflict-minerals declarations not present in verified data.
