AS4C512M16D4A-62BIN - 8Gb DDR4 SDRAM 512Mx16 | Alliance Memory
부품 번호: AS4C512M16D4A-62BIN ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $12.5 | $12.50 |
| 10 | $11.2 | $112.00 |
| 100 | $9.8 | $980.00 |
| 500 | $8.9 | $4,450.00 |
| 1,000 | $8.1 | $8,100.00 |
AS4C512M16D4A-62BIN 개요
DDR4 SDRAM is a type of synchronous dynamic random-access memory that achieves higher speed and lower power consumption than previous generations. It uses a double data rate interface, transferring data on both edges of the clock, and operates at a lower voltage (1.2V) compared to DDR3 (1.5V). DDR4 is the standard memory technology for modern computing systems, servers, and embedded applications, offering improved bandwidth and efficiency.
Key features include a fast clock rate of 1600MHz, burst lengths of 8 and 4 (with burst chop), programmable CAS latency, and on-die termination (ODT) for signal integrity. The device supports auto-refresh and self-refresh modes, and includes a temperature sensor for thermal management. The 96-ball FBGA package provides a compact footprint with excellent thermal and electrical performance.
The AS4C512M16D4A-62BIN utilizes advanced DRAM process technology, achieving high density with low power consumption. It features a pseudo-open-drain (POD) interface, which reduces I/O power and improves signal integrity. The device includes a mode register for configuration, and supports various test modes for system validation.
Typical applications include networking equipment, industrial computing, automotive infotainment, and embedded systems requiring high-density, high-bandwidth memory. Its industrial temperature range and reliability make it ideal for harsh environments.
When designing with this device, ensure proper decoupling and signal integrity practices, including controlled impedance traces and termination. The device requires a stable 1.2V supply and a separate VPP supply of 2.5V for wordline boost.
드롭인 대체품: AS4C512M16D4A-62BIN — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: AS4C512M16D4A-62BIN (동일 폼 팩터 및 풋프린트) — 차이점: Data Rate, Package, Interface, Memory Size, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
AS4C512M16D4B-62BCNTR
✅ 드롭인✓ 재고 있음
$8.1 / 개
데이터시트 보기 →AS4C512M16D4D-62BINTR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
AS4C512M16D4A-62BCN
✅ 드롭인✓ 재고 있음
$7.2 / 개
데이터시트 보기 →MT40A512M16JY-07EAIT:B
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$8.1 / 개
데이터시트 보기 →K4A8G165WB-BIWE
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$14.22 / 개
데이터시트 보기 →H5AN8G6NDJR-XNC
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$55.6818 / 개
데이터시트 보기 →AS4C512M16D4A-62BIN 최대 정격 & 전기적 특성
| 메모리 유형 | DDR4 SDRAM |
| 메모리 크기 | 8 Gbit |
| 메모리 구성 | 512M x 16 |
| Clock Rate | 1600 MHz |
| 데이터 속도 | 3200 Mbps per pin |
| 공급 전압 | 1.14V ~ 1.26V (nominal 1.2V) |
| 동작 온도 | -40°C to +95°C |
| 패키지 | 96-FBGA (7.5x13mm) |
| 인터페이스 | POD (Pseudo Open Drain) |
| CAS 레이턴시 | Programmable (e.g., 22 cycles) |
| Burst Length | 8 (with burst chop 4) |
| Refresh | Auto-refresh and self-refresh |
| RoHS | Compliant |
| 실장 유형 | Surface Mount |
| Lead Free | Yes |
AS4C512M16D4A-62BIN 핀 구성
| 핀 A1 | VDD — Power supply (1.2V) |
| 핀 A2 | DQ0 — Data input/output 0 |
| 핀 A3 | DQ1 — Data input/output 1 |
| 핀 A4 | VSS — Ground |
| 핀 A5 | DQ2 — Data input/output 2 |
| 핀 A6 | DQ3 — Data input/output 3 |
| 핀 A7 | VDD — Power supply (1.2V) |
| 핀 A8 | DQ4 — Data input/output 4 |
| 핀 A9 | DQ5 — Data input/output 5 |
| 핀 A10 | VSS — Ground |
| 핀 A11 | DQ6 — Data input/output 6 |
| 핀 A12 | DQ7 — Data input/output 7 |
일반적인 애플리케이션
AS4C512M16D4A-62BIN 적합 용도: 6 애플리케이션s: Networking Equipment, Industrial Computing, Automotive Infotainment, Embedded Systems, Data Center and Cloud Computing, Test and Measurement.
Networking Equipment
The AS4C512M16D4A-62BIN provides high-bandwidth memory for routers, switches, and network appliances. Its 1600MHz clock rate and 8Gb density support high-throughput packet processing and buffering. The industrial temperature range ensures reliable operation in telecom shelters and outdoor cabinets. With a 1.2V supply, it reduces power consumption in always-on network infrastructure. The 96-ball FBGA package allows compact board designs, and the on-die termination improves signal integrity for high-speed data paths.
추천
Industrial Computing
In industrial PCs and embedded systems, the AS4C512M16D4A-62BIN offers reliable memory for real-time control and data acquisition. Its -40°C to +95°C range withstands factory floor temperatures, and the 8Gb capacity supports complex applications like machine vision and robotics. The 1.2V operation minimizes heat generation, crucial for sealed enclosures. The device's high speed enables fast data logging and processing, while the FBGA package provides robustness against vibration and shock.
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Automotive Infotainment
The AS4C512M16D4A-62BIN supports automotive infotainment systems requiring high memory bandwidth for navigation, multimedia, and connectivity. Its industrial temperature range covers cabin and some under-hood environments. The 8Gb density allows storing large maps and media buffers. The low 1.2V supply reduces power draw from the vehicle battery. The device's high speed enables smooth graphics rendering and fast boot times. The FBGA package is AEC-Q100 not qualified, but suitable for non-safety-critical infotainment.
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Embedded Systems
For embedded systems like single-board computers and IoT gateways, the AS4C512M16D4A-62BIN provides high-density memory in a compact package. Its 512M x 16 organization simplifies interfacing with 16-bit memory controllers. The 1.2V supply is compatible with modern low-power SoCs. The industrial temperature range allows deployment in outdoor and harsh environments. The device's high speed supports real-time processing and data-intensive applications. The FBGA package is ideal for space-constrained designs.
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Data Center and Cloud Computing
In data centers, the AS4C512M16D4A-62BIN can be used in servers and storage systems for high-speed caching and buffering. Its 1600MHz clock rate and 8Gb density provide the bandwidth needed for virtualization and big data analytics. The 1.2V supply reduces power consumption in large-scale deployments. The industrial temperature range is suitable for data center environments with controlled cooling. The device's reliability and long lifecycle make it a cost-effective solution for cloud infrastructure.
추천
Test and Measurement
The AS4C512M16D4A-62BIN is used in test and measurement equipment like oscilloscopes and logic analyzers for high-speed data acquisition. Its 1600MHz clock rate enables capturing fast signals, and the 8Gb capacity stores long waveforms. The industrial temperature range ensures accuracy in lab and field environments. The 1.2V supply reduces noise, critical for precise measurements. The FBGA package allows compact instrument designs, and the device's high reliability supports continuous operation.
추천
추천 제품 요약
엔지니어링 참조 데이터: AS4C512M16D4A-62BIN — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | AS4C512M16D4B-62BCNTR | AS4C512M16D4D-62BINTR | MT40A512M16JY-07EAIT:B |
|---|---|---|---|---|
| Package | 96-FBGA (7.5x13mm) | 96-FBGA (7.5x13mm) | 96-FBGA (7.5x13mm) | 96-FBGA (7.5x13mm) |
| Brand | Alliance Memory | Alliance Memory | Alliance Memory | Micron Technology |
| Memory Size | 8 Gbit | 8 Gbit | 8 Gbit | 8 Gbit |
| Organization | 512M x 16 | 512M x 16 | 512M x 16 | 512M x 16 |
| Clock Rate | 1600 MHz | 1600 MHz | 1600 MHz | 1600 MHz |
| Supply Voltage | 1.2V | 1.2V | 1.2V | 1.2V |
| Operating Temperature | -40 to 95°C | 0 to 95°C | -40 to 95°C | -40 to 95°C |
| RoHS | Compliant | Compliant | Compliant | Compliant |
주요 차별점
- Industrial temperature range (vs AS4C512M16D4B-62BCNTR)
- Same package and pinout as commercial version (vs AS4C512M16D4B-62BCNTR)
- Cross-brand availability (vs MT40A512M16JY-07EAIT:B)
설계 노트
The AS4C512M16D4A-62BIN requires a 1.2V VDD supply and a 2.5V VPP supply for wordline boost. Use low-impedance decoupling capacitors (e.g., 0.1uF and 1uF) close to each VDD and VPP pin to minimize voltage ripple. Ensure the power supply can handle peak current during refresh and activate operations. Refer to the datasheet for recommended power-up sequencing.
For high-speed DDR4 signals, maintain controlled impedance of 40-50 ohms for DQ/DQS and 50-60 ohms for address/command lines. Keep trace lengths matched within +/- 0.5mm for data groups and +/- 1mm for address/command. Use ground planes and avoid vias on high-speed traces where possible. Place the device close to the controller to minimize propagation delay.
The industrial temperature range of -40 to 95°C requires adequate thermal management. The 96-ball FBGA package has a thermal resistance of approximately 20°C/W (theta_JA). For high ambient temperatures, ensure airflow or a heatsink is provided. Monitor the device temperature using the internal temperature sensor and adjust refresh rate if needed.
규정 준수 정보
RoHS compliant per distributor data. Not AEC-Q100 qualified. Lead-free per datasheet.
