EP1S80F1020I7NGA - Stratix FPGA, 79,040 LEs, 1020-FBGA | Intel
MPN: EP1S80F1020I7NGA ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $295 | $295.00 |
| 10 | $265 | $2,650.00 |
| 100 | $235 | $23,500.00 |
| 500 | $210 | $105,000.00 |
| 1,000 | $188 | $188,000.00 |
Drop-in alternatives for EP1S80F1020I7NGA — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP1S80F1020I7N
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View Datasheet →EP1S80F1020I7NGA Maximum Ratings & Electrical Characteristics
| Family | Stratix (EP1S) |
| Logic Elements | 79,040 |
| Total Memory Bits | 7,427,520 bits |
| DSP Blocks | 22 |
| Embedded Transceivers | 12 channels (600 Mbps to 3.1875 Gbps) |
| Maximum User I/O | 773 |
| Package | 1020-ball FineLine BGA (33 × 33 mm, 1.00 mm pitch) |
| Process Node | 0.13 µm CMOS |
| Operating Temperature | -40 °C to +100 °C (Industrial) |
| Supply Voltage (Core) | 1.5 V |
| I/O Standards Supported | LVTTL, LVCMOS, SSTL, LVDS, LVPECL, PCI, PCI-X, HSTL, LVDS, HyperTransport |
| Maximum Clock Frequency | Up to 420 MHz (device-dependent) |
| PLL Count | 12 (enhanced PLLs and fast PLLs) |
| Configuration Method | JTAG, EPC16/EPC8 serial or parallel configuration device, passive/active serial |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Moisture Sensitivity Level (MSL) | 3 (per JEDEC J-STD-020) |
EP1S80F1020I7NGA 1020-ball fineline bga (33 × 33 mm, 1.00 mm pitch) Pin Configuration Guide
Complete pinout information for EP1S80F1020I7NGA (1020-ball fineline bga (33 × 33 mm, 1.00 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S80F1020I7NGA.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S80F1020I7NGA is suitable for 6 applications: Telecommunications Backplane Switching, ASIC Prototyping and Emulation, Software-Defined Radio Baseband, Real-Time Video Transcoding, High-Speed Data Acquisition, Industrial Imaging and Machine Vision.
Telecommunications Backplane Switching
The EP1S80F1020I7NGA is a workhorse in first-generation telecom switching line cards and base-station backplanes, where its 12 multi-gigabit transceivers running up to 3.1875 Gbps support SerialLite, PCI Express PIPE, and Gigabit Ethernet backplane links. The 79,040 logic elements and 22 DSP blocks enable packet-classification and traffic-management engines directly on-chip, reducing the bill of materials. Industrial-grade operation (-40 °C to +100 °C) suits outdoor cabinet installations.
Recommended
ASIC Prototyping and Emulation
With 79,040 logic elements, 7.4 Mbits of block RAM, and a 1.5 V core, the EP1S80F1020I7NGA hosts pre-silicon ASIC prototypes and IP verification platforms at clock rates up to 420 MHz. Multi-FPGA partitioning tools map large ASICs across multiple EP1S80 devices, leveraging the 773 user I/O for high-speed chip-to-chip interconnect. Embedded transceivers drive prototype-to-prototype debug links.
Recommended
Software-Defined Radio Baseband
The 22 DSP blocks (each delivering up to eight 9-bit × 9-bit multiplies per cycle) and parallel LVDS channels make the EP1S80F1020I7NGA a strong fit for SDR baseband processing in military and tactical radio systems. Wide-bandwidth digital downconversion and channelisation fit within the 7.4 Mbit TriMatrix memory without external SRAM access. Industrial-temperature operation supports field-deployable radio equipment.
Recommended
Real-Time Video Transcoding
Broadcast video processing and transcoding cards leverage the EP1S80F1020I7NGA's 7.4 Mbit block RAM to buffer multi-stream SDI input and output channels at up to 1080p60. The 22 DSP blocks accelerate motion-compensated temporal filtering and DCT/iDCT paths, while LVDS channels connect to SDI deserialisers and HDMI transmitters. Industrial-grade operation supports broadcast studio equipment racks.
Recommended
High-Speed Data Acquisition
The EP1S80F1020I7NGA's 73 LVDS pairs aggregate multi-channel ADC outputs at up to 840 Mbps per channel in scientific instrumentation, ultrasound beamforming, and radar digitiser front-ends. The 7.4 Mbit block RAM buffers pre-trigger sample windows, while 12 PLLs provide sub-sample-aligned clock trees across the I/O banks. Industrial temperature and surface-mount BGA package suit OEM instrument chassis.
Recommended
Industrial Imaging and Machine Vision
Multi-camera image-processing pipelines on the EP1S80F1020I7NGA exploit the LVDS channels for direct MIPI-CSI and sub-LVDS sensor interfaces, while the DSP blocks accelerate convolutional pre-filters and Bayer demosaic. The 1020-FBGA's thermal envelope supports up to ~10 W dissipation without external heatsinks in factory-floor machine-vision enclosures. Industrial-temperature operation tolerates shop-floor ambient swings.
Recommended
Recommended Products Summary
Engineering reference data for EP1S80F1020I7NGA — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S80F1020I7N | EP1S80F1020C7NGA | EP1S80F1020C7GA | EP1S80F1020C7 | EP1S80F1020C6N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 1020-ball FineLine BGA (33 × 33 mm) | 1020-ball FineLine BGA - same | 1020-ball FineLine BGA - same | 1020-ball FineLine BGA - same | 1020-ball FineLine BGA - same | 1020-ball FineLine BGA - same |
| Logic Elements | 79,040 | 79,040 | 79,040 | 79,040 | 79,040 | 79,040 |
| Total Memory Bits | 7,427,520 | 7,427,520 | 7,427,520 | 7,427,520 | 7,427,520 | 7,427,520 |
| DSP Blocks | 22 | 22 | 22 | 22 | 22 | 22 |
| Embedded Transceivers | 12 (up to 3.1875 Gbps) | 12 | 12 | 12 | 12 | 12 |
| Speed Grade | 7 (fastest available) | 7 | 7 | 7 | 7 | 6 (slower) |
| Operating Temperature Range | -40 °C to +100 °C (Industrial) | -40 °C to +100 °C (Industrial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Approximate 1k-piece Price (USD) | 188.00 | 185.00 | 170.00 | 172.00 | 168.00 | 160.00 |
Key Differentiators
- Largest Stratix I7 device in 1020-FBGA at speed grade 7 (vs EP1S80F1020C7NGA)
- Full speed grade 7 with all 12 transceivers active (vs EP1S80F1020C6N)
- Highest-density Stratix FPGA in the 1020-FBGA package (vs EP1S60F1020C7N)
Design Notes
The 1020-ball FineLine BGA at 1.00 mm pitch requires via-in-pad with filled and plated-over copper, or dog-bone fanout with 8-mil micro-vias on a 4-layer high-density interconnect (HDI) stack-up. Use 0.5 oz copper on outer layers for controlled-impedance routing of LVDS pairs (100 Ω differential) and transceiver channels (50 Ω single-ended with AC coupling capacitors). Decoupling should follow the Stratix Power Distribution Network guide: 0402 ceramic caps of 0.1 µF, 1 µF, and 10 µF placed within 100 mils of every VCCINT and VCCIO pin, plus bulk tantalum or polymer capacitors at the regulator outputs. Avoid routing signals beneath the BGA shadow unless on inner ground layers.
Estimated: at typical Stratix core activity (≈ 60 % logic toggling) with all 12 transceivers active at 3 Gbps, total power consumption reaches approximately 9–11 W. The 33 × 33 mm 1020-FBGA's theta_JA is around 10 °C/W with a properly soldered thermal pad and 2 oz copper thermal islands on both sides of the PCB; the junction temperature rise is therefore ≈ 100 °C above ambient. Industrial-temperature operation (-40 °C to +100 °C) requires ambient to stay below 0 °C below the +100 °C junction limit when operating at maximum power. A 4–6 layer PCB with dedicated thermal copper pours under the BGA thermal balls is required for reliable operation above 8 W.
Do not omit configuration memory for production builds — JTAG-only programming is not allowed in factory flow. The EP1S80F1020I7NGA supports MSL 3 moisture-sensitive handling per JEDEC J-STD-020; bake at 125 °C for 24 hours before assembly if the tray has been open beyond the floor-life. Unused transceiver channels must be powered down in the Quartus II assignment editor to suppress residual leakage and avoid supply-current drift. LVDS and LVTTL inputs must observe 1.5 V VCCIO at all banks; mixing 2.5 V and 1.5 V standards on the same bank without reference-voltage planning is a common cause of I/O failure.
Multi-gigabit transceiver channels (SERDES) require matched-length differential pairs with intra-pair skew under 5 mil and pair-to-pair skew under 20 mil. AC-coupling capacitors (0.1 µF X7R 0402) must be placed close to the receiver pins, not the transmitter pins, to comply with the Stratix AC-coupling topology. Maintain a continuous reference ground plane under all SERDES traces; reference-plane splits across transceiver regions cause severe jitter and return-loss degradation. Channel simulation using Intel's HSPICE models and the Quartus II IBIS-AMI models is recommended above 2.5 Gbps.
Compliance Information
RoHS and lead-free compliance per Intel (Altera) product page. Halogen-free status not explicitly published in verified sources and recorded as unknown. AEC-Q100 is not applicable for FPGAs; consult Intel industrial-grade qualification documentation for IEC 60749 / JESD22 reliability data.
