EPM9560RI208-20N - MAX 9000 CPLD 12K Gates 208-RQFP | Intel
부품 번호: EPM9560RI208-20N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EPM9560RI208-20N 개요
A CPLD (Complex Programmable Logic Device) is a programmable logic IC that combines multiple programmable logic array blocks and macrocells with a programmable interconnect matrix, allowing designers to implement custom digital logic without fabricating an ASIC. Within the semiconductor taxonomy, the MAX 9000 CPLD sits under programmable logic devices (PLDs), alongside FPGAs and simple PLDs (SPLDs), and is used for glue logic, bus interfacing, and state-machine control.
The MAX 9000 architecture is built on Altera's third-generation Multiple Array MatriX (MAX) architecture, fabricated on an advanced CMOS process with EEPROM configuration cells. This non-volatile EEPROM technology allows the device to retain its configuration without an external configuration memory, unlike SRAM-based FPGAs. The -20 speed grade provides a 20 ns pin-to-pin delay, while faster -15 and -10 grades reach 15 ns and 10 ns respectively, with counter speeds up to 144 MHz on the fastest grade.
Key features include 5.0 V in-system programmability via the built-in JTAG interface, 560 macrocells, and support for the MAX+PLUS II development system, which offers schematic, VHDL, Verilog HDL, and AHDL design entry, compilation, logic synthesis, simulation, timing analysis, and device programming in a single integrated toolchain.
Typical applications include industrial control glue logic, bus bridging and address decoding, telecommunications line-card control, test and measurement instrumentation, and legacy system maintenance where 5 V logic levels and non-volatile configuration are required.
When designing with the EPM9560RI208-20N, note that the 5.0 V core and I/O supply requires careful power distribution and decoupling, and that the RQFP package demands adequate thermal relief and copper area for reliable solder joints. Because the device is EEPROM-based, it can be reprogrammed in-system, simplifying field upgrades.
This page synthesizes distributor availability, drop-in speed-grade alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a single reference for sourcing and designing with the EPM9560RI208-20N.
드롭인 대체품: EPM9560RI208-20N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPM9560RI208-20N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Architecture, In-System Programmability, Configuration Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPM9560RI208-15N
✅ 드롭인✓ 재고 있음
$19.45 / 개
데이터시트 보기 →EPM9560RI208-10N
✅ 드롭인✓ 재고 있음
$61.75 / 개
데이터시트 보기 →EPM9560RI208-15
✅ 드롭인✓ 재고 있음
$20.1 / 개
데이터시트 보기 →EPM9560RI208-10
✅ 드롭인✓ 재고 있음
$67.8 / 개
데이터시트 보기 →EPM9560RI208-20
✅ 드롭인✓ 재고 있음
$21.1 / 개
데이터시트 보기 →EPM9560RI208-20N 최대 정격 & 전기적 특성
| Device Family | MAX 9000 |
| Usable Gates | 12,000 |
| Macrocells | 560 |
| Pin-to-Pin Delay | 20 ns (-20 speed grade) |
| Counter Speed | 100 MHz |
| 공급 전압 | 5.0 V |
| Configuration Technology | EEPROM (non-volatile) |
| In-System Programmability | Yes, via IEEE Std. 1149.1 JTAG |
| 패키지 | 208-pin RQFP |
| 실장 유형 | Surface Mount |
| 동작 온도 | Industrial (-40C to +85C) |
| Development Tool | MAX+PLUS II |
| Design Entry | Schematic, VHDL, Verilog HDL, AHDL |
| Packaging | Tray |
| Logic Architecture | Third-generation MAX (Multiple Array MatriX) |
| Fabrication Process | Advanced CMOS |
EPM9560RI208-20N 208-pin rqfp 핀 구성 가이드
EPM9560RI208-20N(208-pin rqfp 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPM9560RI208-20N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPM9560RI208-20N 적합 용도: 6 애플리케이션s: Industrial Control Glue Logic, Bus Bridging and Address Decoding, Telecommunications Line-Card Control, Test and Measurement Instrumentation, Legacy System Maintenance and Redesign, Automotive and Transportation Electronics.
Industrial Control Glue Logic
The EPM9560RI208-20N fits industrial control glue logic because its 12,000 usable gates and 560 macrocells can absorb address decoding, chip-select generation, and handshake logic that would otherwise require dozens of discrete 74-series ICs. Its industrial temperature grade of -40C to +85C and 5.0 V EEPROM-based configuration tolerate the electrical noise and temperature swings of factory-floor equipment. The device is typically placed between a microcontroller and peripheral ICs, implementing wait-state generation and bus arbitration at a 20 ns pin-to-pin delay. Unlike SRAM-based FPGAs, it needs no external configuration memory, so it boots instantly and cannot be corrupted by brownouts. The trade-off is higher static power than modern low-voltage CPLDs, but the 5 V interface simplifies level matching to legacy industrial buses.
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Bus Bridging and Address Decoding
The EPM9560RI208-20N is well suited to bus bridging and address decoding because its 560 macrocells can implement wide address comparators, wait-state generators, and protocol translators between 8-bit, 16-bit, and 32-bit buses. With a 20 ns pin-to-pin delay and 100 MHz counter speed, it handles legacy 5 V bus timing without external latches. Designers commonly place it between a host processor and peripherals such as UARTs, timers, and memory devices, using the JTAG interface for in-system reprogramming during development. The EEPROM configuration retains the bridge logic across power cycles, which is critical for systems that must boot deterministically. The main trade-off is that the 5.0 V supply and RQFP package require careful power distribution and board area compared with modern 1.8 V CPLDs.
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Telecommunications Line-Card Control
The EPM9560RI208-20N suits telecommunications line-card control because its 12,000 usable gates can implement channel supervision, alarm monitoring, and time-slot interchange glue logic on a single non-volatile device. The 5.0 V EEPROM-based MAX 9000 architecture is immune to configuration loss during the hot-swap and power-sequencing events common in telecom shelves, unlike SRAM FPGAs that need a configuration PROM. Its 20 ns pin-to-pin delay supports the control-path timing of E1/T1 and SONET overhead interfaces, while the 208-pin RQFP provides enough I/O for dense backplane connectors. The device is typically placed on the line card between the framer and the backplane interface, handling interrupt aggregation and register access. The trade-off is higher power than low-voltage CPLDs, requiring adequate thermal relief.
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Test and Measurement Instrumentation
The EPM9560RI208-20N fits test and measurement instrumentation because its 560 macrocells can implement trigger logic, pattern generation, and acquisition sequencing with deterministic 20 ns timing. The non-volatile EEPROM configuration means the instrument boots to a known state without a configuration load, which is important for automated test equipment that must start quickly and repeatably. Designers use the JTAG interface to update trigger algorithms in the field, and the 5.0 V I/O interfaces directly with legacy instrument backplanes and analog front-end control lines. The 100 MHz counter speed supports moderate-rate event counting and timestamping. The main trade-off is that the RQFP package and 5 V supply consume more board area and power than modern alternatives, so thermal and layout planning are required.
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Legacy System Maintenance and Redesign
The EPM9560RI208-20N is a key part for legacy system maintenance and redesign because it preserves the exact 208-pin RQFP footprint, 5.0 V interface, and MAX+PLUS II design flow of existing MAX 9000 designs. When an original board must be repaired or reproduced, using the same device avoids re-qualification and re-layout costs. The EEPROM configuration can be reprogrammed in-system via JTAG, so field upgrades do not require removing the part. Engineers can also migrate to faster pin-compatible grades such as the EPM9560RI208-15N or EPM9560RI208-10N if timing margins are tight. The trade-off is that the MAX 9000 family is obsolete, so long-term supply depends on residual inventory and should be managed with last-time-buy planning.
추천
Automotive and Transportation Electronics
The EPM9560RI208-20N can serve automotive and transportation electronics where 5 V logic and non-volatile configuration are required, such as body-control modules, dashboard controllers, and legacy powertrain interfaces. Its industrial temperature grade of -40C to +85C covers many under-hood and cabin environments, and the EEPROM configuration survives the cold-crank and load-dump events that can reset SRAM-based logic. The 12,000 usable gates and 560 macrocells implement multiplexed switch inputs, lamp drivers, and CAN gateway glue logic at a 20 ns pin-to-pin delay. The device is typically placed between a vehicle network controller and discrete I/O. The trade-off is that the part is not AEC-Q100 qualified, so automotive use requires additional qualification evidence from the system integrator.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPM9560RI208-20N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPM9560RI208-15N | EPM9560RI208-10N | EPM9560RI208-20 |
|---|---|---|---|---|
| Package | 208-pin RQFP | 208-pin RQFP - same | 208-pin RQFP - same | 208-pin RQFP - same |
| Brand | Intel | Intel | Intel | Intel |
| Pin-to-Pin Delay | 20 ns | 15 ns | 10 ns | 20 ns |
| Usable Gates | 12,000 | 12,000 | 12,000 | 12,000 |
| Macrocells | 560 | 560 | 560 | 560 |
| Supply Voltage | 5.0 V | 5.0 V | 5.0 V | 5.0 V |
| Temperature Grade | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) |
| Configuration Technology | EEPROM (non-volatile) | EEPROM (non-volatile) | EEPROM (non-volatile) | EEPROM (non-volatile) |
| JTAG ISP | Yes (IEEE Std. 1149.1) | Yes (IEEE Std. 1149.1) | Yes (IEEE Std. 1149.1) | Yes (IEEE Std. 1149.1) |
주요 차별점
- Non-volatile EEPROM configuration (vs SRAM-based FPGAs)
- Pin-compatible speed-grade upgrade path (vs EPM9560RI208-15N)
- 5.0 V interface compatibility (vs EPM9560RI208-10N)
- Industrial temperature grade (vs EPM9560RC208-20)
설계 노트
The EPM9560RI208-20N requires a well-regulated 5.0 V supply with adequate decoupling. Place at least one 0.1 uF ceramic capacitor per power pin pair as close to the device as possible, plus bulk 10 uF to 47 uF capacitors near the package corners. Estimated: at a typical 5 V CPLD operating current of a few hundred milliamps, a 100 mV supply droop corresponds to roughly 0.5 W of additional dissipation in the regulator, so verify the regulator's thermal margin. Follow the MAX 9000 datasheet power-supply recommendations for decoupling network values.
The 208-pin RQFP package requires careful PCB layout to avoid solder-joint defects. Use a solder-mask-defined pad geometry per the datasheet land pattern, provide thermal relief on ground pins, and keep the exposed copper balanced to prevent package warping during reflow. Route JTAG signals (TCK, TMS, TDI, TDO) as short, controlled-impedance traces and keep them away from high-speed switching nodes. Provide test points for all JTAG pins to support in-system programming and boundary-scan test.
A common pitfall with the EPM9560RI208-20N is assuming SRAM-FPGA-like configuration behavior. Because the MAX 9000 uses EEPROM cells, the device retains its design without a configuration PROM, but it must still be programmed before first use. Ensure the JTAG chain is correctly terminated and that the programming file targets the -20 speed grade; using a -15 or -10 timing model can cause over-constraining or under-constraining of the fitter. Also verify that the obsolete lifecycle status is reflected in your last-time-buy and obsolescence plan.
규정 준수 정보
Compliance data for the EPM9560RI208-20N was not present in the verified web data. The device is obsolete and predates current RoHS/REACH documentation practices; confirm compliance with the distributor or manufacturer before use in regulated markets.