H5AN4G6NBJR-VKC - 4Gb DDR4 SDRAM 2666Mbps x16 | SK Hynix
MPN: H5AN4G6NBJR-VKC ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $19.75 | $19.75 |
| 10 | $17.78 | $177.80 |
| 100 | $16 | $1,600.00 |
| 500 | $14.4 | $7,200.00 |
| 1,000 | $12.96 | $12,960.00 |
Drop-in alternatives for H5AN4G6NBJR-VKC — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
H5AN4G6NBJR-UHC
✅ Drop-In✓ In Stock
$8.09 / Unit
View Datasheet →H5AN4G6NBJR-RDC
✅ Drop-In✓ In Stock
$6.15 / Unit
View Datasheet →H5AN4G6NBJR-PBC
✅ Drop-In✓ In Stock
$6.6 / Unit
View Datasheet →H5AN4G6NMFR-TFC
✅ Drop-In📋 Reference alternative (not in catalog)
H5AN4G8NBJR-VKC
✅ Drop-In✓ In Stock
$2.4 / Unit
View Datasheet →H5AN8G6NDJR-VKC
✅ Drop-In📋 Reference alternative (not in catalog)
K4A4G165WD-BCTD
✅ Drop-In✓ In Stock
$19 / Unit
View Datasheet →H5AN4G6NBJR-VKC Maximum Ratings & Electrical Characteristics
| Memory Type | DDR4 SDRAM |
| Memory Size | 4 Gbit |
| Memory Organization | 256M x 16 |
| Data Rate | 2666 Mbps |
| Clock Frequency | 1.6 GHz (internal reference per distributor data) |
| Supply Voltage (VDD) | 1.2 V nominal (1.14 V to 1.26 V) |
| Operating Current | 38 mA (typical, per distributor data) |
| Interface | Parallel |
| Technology | CMOS |
| Operating Temperature | -40C to +95C |
| Package | FBGA-96 / TFBGA (PBGA96) |
| Body Size | 13 mm, 1.2 mm profile, 0.8 mm ball pitch |
| Mounting Type | Surface Mount |
| Termination | Dynamic on-chip termination (ODT) |
| Calibration | ZQ calibration; write leveling |
| Protection Functions | Asynchronous reset; CRC; data mask |
| Refresh | Auto self-refresh |
| RoHS Status | Compliant |
| Packaging | Tray |
H5AN4G6NBJR-VKC fbga-96 / tfbga (pbga96) Pin Configuration Guide
Complete pinout information for H5AN4G6NBJR-VKC (fbga-96 / tfbga (pbga96) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for H5AN4G6NBJR-VKC.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
H5AN4G6NBJR-VKC is suitable for 6 applications: Industrial Embedded Controllers, Networking and Communication Equipment, Set-Top Boxes and Smart TV Platforms, Automotive Infotainment (Non-Safety Modules), Test and Measurement Instruments, IoT Gateways and Edge Computing.
Industrial Embedded Controllers
The H5AN4G6NBJR-VKC fits industrial embedded controllers because its -40C to +95C operating range covers harsh factory environments and its auto self-refresh maintains data integrity without host intervention. Its 4Gb density in 256M x16 organization provides ample main memory for real-time control, protocol stacks, and logging on a single chip, reducing BOM count versus multiple smaller DRAMs. The 1.2V supply and 38 mA typical current keep power budgets low in fanless enclosures, while dynamic ODT and ZQ calibration ease signal integrity at 2666 Mbps on typical four-to-six-layer industrial PCBs. Place it on a fly-by routed command/address bus with the ZQ resistor nearby; at 2666 Mbps, length-match data strokes to within +/-25 mil and route over a solid ground plane.
Recommended
Networking and Communication Equipment
In routers, switches, and gateways, packet buffering and route-table storage demand high bandwidth and 4Gb-class density, which the H5AN4G6NBJR-VKC delivers at 2666 Mbps on a 16-bit bus. The CRC function adds link-integrity checking valued in always-on communication gear, and the asynchronous reset function allows clean reinitialization after watchdog events without power cycling. The FBGA-96 footprint is compact enough for space-constrained SFP-line-card and CPE board layouts. Because networking SoCs commonly train memory at boot via write leveling and ZQ calibration, both of which this part supports, bring-up is straightforward with vendor reference DDR4 controllers; budget 2666 Mbps timing margins on the fly-by CA bus and verify ODT settings against the SoC's DDR4 PHY programming guide.
Recommended
Set-Top Boxes and Smart TV Platforms
Set-top box and smart TV SoCs require 4Gb DDR4 main memory to hold 4K video frame buffers, middleware, and applications, and the H5AN4G6NBJR-VKC's x16 organization matches the wide single-chip memory buses typical of these SoCs. Its 2666 Mbps bandwidth sustains smooth UI rendering and video decode, while the 1.2V supply reduces standby power relevant to energy-regulated consumer products. The single FBGA-96 package also lowers cost versus two x8 chips. Its VKC speed grade aligns with common STB DDR4 controllers; designers should follow the SoC vendor's layout guide, keeping the DRAM within 2 inches of the SoC, using series damping on clock nets, and reserving the asynchronous reset line for the SoC's reset controller.
Recommended
Automotive Infotainment (Non-Safety Modules)
The -40C to +95C temperature rating of the H5AN4G6NBJR-VKC makes it a candidate for automotive infotainment head units and telematics modules where the cabin environment, rather than under-hood extremes, defines the thermal envelope. Its 4Gb capacity supports map data caching, HMI graphics frame buffers, and voice processing, and the CRC and data mask functions improve data path robustness on electrically noisy vehicles. Note this commercial-grade part is not AEC-Q100 qualified, so it should be used where the OEM specification permits industrial/consumer grading. At 2666 Mbps and up to +95C ambient, perform a derating analysis: reduced timing margins at temperature extremes may require lowering the speed grade or adding thermal spreading copper on the board.
Recommended
Test and Measurement Instruments
Bench instruments such as data loggers, spectrum analyzers, and logic analyzers use 4Gb DDR4 as deep capture memory, and the H5AN4G6NBJR-VKC's 2666 Mbps rate sustains the sustained-write throughput these front ends generate. The 256M x16 organization simplifies wide FIFO-style buffering with a single chip, and ZQ calibration keeps output impedance accurate over warm-up drift. The asynchronous reset input lets the instrument firmware reinitialize the memory subsystem after a mode change without disturbing other rails. In instrument designs, memory sits far from enclosures with good airflow, easing thermal design; the key effort is signal integrity - route the clock first, keep strobe-to-data length matching tight, and use on-board termination controlled via dynamic ODT during burst transfers.
Recommended
IoT Gateways and Edge Computing
Edge AI and IoT gateway SoCs typically need 2 GB to 4 GB class DRAM, and boards built from multiple H5AN4G6NBJR-VKC devices (or a single device in lighter nodes) benefit from its 4Gb density per FBGA-96 package, minimizing board area. The 1.14V low end of the supply range supports battery-backed and power-cycled edge nodes, and the 38 mA typical current helps meet sleep-state power targets when the controller places the part into self-refresh. Features like write leveling and dynamic ODT reduce bring-up risk on cost-sensitive four-layer gateway PCBs. For reliability in always-on deployments, enable periodic auto refresh and monitor case temperature: above +95C the part exits its specified range, so provide ventilation or derate the maximum data rate in sealed outdoor enclosures.
Recommended
Recommended Products Summary
Engineering reference data for H5AN4G6NBJR-VKC — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | H5AN4G6NBJR-UHC | H5AN4G6NMFR-TFC | K4A4G165WD-BCTD |
|---|---|---|---|---|
| Package | FBGA-96 (TFBGA) | FBGA-96 - same | FBGA-96 - same | FBGA-96 - same |
| Brand | SK Hynix | SK Hynix | SK Hynix | Samsung Electronics |
| Density | 4 Gbit | 4 Gbit | 4 Gbit | 4 Gbit |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Max Data Rate | 2666 Mbps | Lower speed grade (2133-class) | [DATA_NEEDED] | 2666 Mbps |
| Supply Voltage | 1.14 V - 1.26 V | 1.14 V - 1.26 V | 1.2 V class | 1.2 V class |
| Operating Temperature | -40C to +95C | -40C to +95C | [DATA_NEEDED] | 0C to +95C (commercial) |
| Lifecycle Status | Active | Active | Active | Active |
Key Differentiators
- Full 2666 Mbps speed grade in the BJR family (vs H5AN4G6NBJR-UHC)
- Wide industrial temperature support at high speed (vs K4A4G165WD-BCTD)
- x16 organization for minimal chip count (vs H5AN4G8NBJR-VKC)
Design Notes
The H5AN4G6NBJR-VKC uses a JEDEC-standard DDR4 x16 96-ball footprint (13 mm body, 0.8 mm ball pitch). Design the land pattern with 0.30-0.35 mm solder-mask-defined pads, and keep the fly-by command/address routing topology with the clock last in the chain. Maintain a solid, unbroken reference plane under all DDR4 nets; at 2666 Mbps, any plane split in the routing region creates impedance discontinuities that fail margin tests during read/write leveling.
Budget two rails: 1.2V VDD (1.14V-1.26V per datasheet) and a VTT termination rail set to VDD/2. Estimated: with 38 mA typical device current, per-device dynamic power is modest, but VTT current in multi-chip buses can equal or exceed core current - size the VTT LDO (e.g., a DDR termination regulator) for the full instantaneous termination load. Decouple each supply pin pair with 0.1uF ceramics plus bulk capacitance near the ball field.
Do not assume speed-grade interchangeability within the H5AN4G6NBJR family: UHC, RDC, and PBC variants drop onto the same footprint but run at lower speed grades than the VKC's 2666 Mbps. Also verify the memory controller's MRS, ODT, and ZQ programming tables against the series datasheet; x16 parts have different pin functions than x8 variants (H5AN4G8NBJR), so x8/x16 swaps are footprint-compatible but not functionally drop-in.
Use the device's write leveling and ZQ calibration during controller training, as specified in the SK Hynix series datasheet. Length-match DQS to its data byte group tightly (within +/-25 mil typical for 2666 Mbps) and keep CA/CS skew managed by the fly-by topology. Enable dynamic ODT for writes to reduce reflections without external termination resistors, saving board area and VTT power.
Compliance Information
RoHS compliance stated in JLCPCB listing. Part is a commercial/consumer-temperature family part (BJR series); no AEC-Q100 qualification indicated in provided data.
