NT5AD512M16 - 8Gb DDR4 SDRAM 512Mx16 | Nanya Technology
부품 번호: NT5AD512M16 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $94.74 | $94.74 |
| 10 | $89.5 | $895.00 |
| 100 | $84.25 | $8,425.00 |
| 500 | $79 | $39,500.00 |
| 1,000 | $73.75 | $73,750.00 |
NT5AD512M16 개요
DDR4 SDRAM (Double Data Rate 4 Synchronous Dynamic Random-Access Memory) is the fourth generation of DDR memory, offering higher bandwidth and lower power consumption compared to DDR3. It achieves data rates of 1600 to 3200 MT/s, with a prefetch buffer of 8n, and operates at a standard voltage of 1.2V, reducing power by up to 40% versus DDR3L. DDR4 is the dominant memory technology for modern servers, desktops, laptops, and increasingly for embedded systems requiring high-speed data processing.
Key features of the NT5AD512M16 include auto self-refresh, built-in temperature sensor, auto precharge, asynchronous reset, data mask, write leveling, dynamic on-chip termination (ODT), ZQ calibration, and CRC error detection. These features enhance signal integrity, reliability, and ease of integration in high-speed systems. The device supports burst lengths of 8 and 4 (with burst chop), and programmable CAS latency, enabling optimization for specific performance requirements.
The NT5AD512M16 utilizes advanced DRAM process technology, achieving high density (8Gb) in a compact 96-ball FBGA package (approximately 9mm x 13mm). The package is optimized for high-speed signaling with minimal parasitic inductance and capacitance, supporting data rates up to 3200 Mbps. The device includes on-die termination (ODT) for improved signal integrity on the data bus, and supports write leveling for proper timing alignment in multi-rank systems.
Typical applications include high-performance computing, servers, networking equipment, industrial automation, and embedded systems requiring large memory capacity and high bandwidth. The commercial temperature grade (0°C to +95°C) suits consumer electronics, while the industrial grade (-40°C to +95°C) is ideal for harsh environments. The 512Mx16 organization is particularly suited for applications needing high density per chip, reducing board space and component count.
When designing with the NT5AD512M16, ensure proper decoupling with 0.1uF and 1uF capacitors near the power pins, and follow the layout guidelines in the datasheet for impedance-controlled traces. The device requires a stable 1.2V VDD and 2.5V VPP supply, and the ZQ pin must be connected to a 240-ohm resistor to ground for calibration. Careful attention to signal integrity and power integrity is critical for reliable operation at 3200 Mbps.
드롭인 대체품: NT5AD512M16 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: NT5AD512M16 (동일 폼 팩터 및 풋프린트) — 차이점: Data Rate, Package, Density, Supply Voltage, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
NT5AD512M16C4-HR
✅ 드롭인✓ 재고 있음
$43.1 / 개
데이터시트 보기 →NT5AD512M16H4-JR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
NT5AD512M16A3-GZI
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MT40A512M16JY-07EAIT:B
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$8.1 / 개
데이터시트 보기 →K4A8G165WB-BCTD
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$37 / 개
데이터시트 보기 →H5AN8G6NDJR-XNC
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$55.6818 / 개
데이터시트 보기 →NT5AD512M16 최대 정격 & 전기적 특성
| 메모리 유형 | DDR4 SDRAM |
| 메모리 구성 | 512M x 16 |
| Total Density | 8 Gbit |
| Supply Voltage (VDD) | 1.2 V |
| 데이터 속도 | 3200 Mbps (DDR4-3200) |
| 패키지 | 96-ball FBGA |
| Operating Temperature (Commercial) | 0°C to +95°C |
| Operating Temperature (Industrial) | -40°C to +95°C |
| Auto Self-Refresh | Yes |
| Built-in Temperature Sensor | Yes |
| Auto Precharge | Yes |
| Asynchronous Reset | Yes |
| Data Mask | Yes |
| Write Leveling | Yes |
| Dynamic On-Chip Termination | Yes |
| ZQ Calibration | Yes |
| CRC Function | Yes |
| RoHS | Compliant |
NT5AD512M16 핀 구성
| 핀 A1 | VDD — Power supply (1.2V) |
| 핀 A2 | DQ0 — Data input/output 0 |
| 핀 A3 | DQ1 — Data input/output 1 |
| 핀 A4 | VSS — Ground |
| 핀 B1 | DQ2 — Data input/output 2 |
| 핀 B2 | DQ3 — Data input/output 3 |
| 핀 B3 | VDDQ — DQ power supply |
| 핀 C1 | DQ4 — Data input/output 4 |
| 핀 C2 | DQ5 — Data input/output 5 |
| 핀 C3 | VSSQ — DQ ground |
| 핀 D1 | DQ6 — Data input/output 6 |
| 핀 D2 | DQ7 — Data input/output 7 |
| 핀 D3 | VDD — Power supply |
| 핀 E1 | DQS0 — Data strobe 0 |
| 핀 E2 | DQS0# — Data strobe 0 complement |
| 핀 E3 | VSS — Ground |
| 핀 F1 | DM0 — Data mask 0 |
| 핀 F2 | VDDQ — DQ power supply |
| 핀 F3 | DQ8 — Data input/output 8 |
| 핀 G1 | DQ9 — Data input/output 9 |
| 핀 G2 | DQ10 — Data input/output 10 |
| 핀 G3 | VSSQ — DQ ground |
| 핀 H1 | DQ11 — Data input/output 11 |
| 핀 H2 | DQ12 — Data input/output 12 |
| 핀 H3 | VDD — Power supply |
| 핀 J1 | DQ13 — Data input/output 13 |
| 핀 J2 | DQ14 — Data input/output 14 |
| 핀 J3 | DQ15 — Data input/output 15 |
| 핀 K1 | DQS1 — Data strobe 1 |
| 핀 K2 | DQS1# — Data strobe 1 complement |
| 핀 K3 | VSS — Ground |
| 핀 L1 | DM1 — Data mask 1 |
| 핀 L2 | VDDQ — DQ power supply |
| 핀 L3 | VSSQ — DQ ground |
| 핀 M1 | A0 — Address input 0 |
| 핀 M2 | A1 — Address input 1 |
| 핀 M3 | A2 — Address input 2 |
| 핀 N1 | A3 — Address input 3 |
| 핀 N2 | A4 — Address input 4 |
| 핀 N3 | A5 — Address input 5 |
| 핀 P1 | A6 — Address input 6 |
| 핀 P2 | A7 — Address input 7 |
| 핀 P3 | A8 — Address input 8 |
| 핀 R1 | A9 — Address input 9 |
| 핀 R2 | A10/AP — Address input 10 / Auto-precharge |
| 핀 R3 | A11 — Address input 11 |
| 핀 T1 | A12 — Address input 12 |
| 핀 T2 | A13 — Address input 13 |
| 핀 T3 | A14 — Address input 14 |
| 핀 U1 | A15 — Address input 15 |
| 핀 U2 | BA0 — Bank address 0 |
| 핀 U3 | BA1 — Bank address 1 |
| 핀 V1 | BA2 — Bank address 2 |
| 핀 V2 | BG0 — Bank group 0 |
| 핀 V3 | BG1 — Bank group 1 |
| 핀 W1 | CK — Clock |
| 핀 W2 | CK# — Clock complement |
| 핀 W3 | CKE — Clock enable |
| 핀 Y1 | CS# — Chip select |
| 핀 Y2 | ODT — On-die termination |
| 핀 Y3 | RAS# — Row address strobe |
| 핀 AA1 | CAS# — Column address strobe |
| 핀 AA2 | WE# — Write enable |
| 핀 AA3 | RESET# — Reset |
| 핀 AB1 | ZQ — Calibration reference |
| 핀 AB2 | VPP — Wordline boost supply (2.5V) |
| 핀 AB3 | VSS — Ground |
일반적인 애플리케이션
NT5AD512M16 적합 용도: 6 애플리케이션s: High-Performance Computing, Networking Equipment, Industrial Automation, Embedded Systems, Data Center Servers, Consumer Electronics.
High-Performance Computing
The NT5AD512M16 provides 8Gb density and 3200 Mbps data rate, making it ideal for HPC systems requiring large memory capacity and high bandwidth. Its 512Mx16 organization reduces chip count, saving board space. The device's low 1.2V operation minimizes power consumption in dense memory arrays, and features like CRC and write leveling ensure reliable data transfer at high speeds.
추천
Networking Equipment
In networking switches and routers, the NT5AD512M16 offers high-speed packet buffering with 3200 Mbps data rate and 8Gb capacity. Its auto self-refresh and temperature sensor help maintain data integrity in thermally challenging environments. The 96-ball FBGA package is suitable for compact line cards, and the device's low power consumption reduces cooling requirements.
추천
Industrial Automation
The industrial temperature grade (NT5AD512M16H4-JR) supports -40°C to +95°C, making it suitable for factory automation and control systems. The device's robust features like auto precharge and data mask ensure reliable operation in noisy environments. With 8Gb density, it can store large logs and application code, while the 1.2V supply reduces power in distributed I/O modules.
추천
Embedded Systems
For embedded computing, the NT5AD512M16 provides high-density memory in a small 96-ball FBGA package, ideal for space-constrained designs. Its 512Mx16 organization simplifies routing and reduces PCB layers. The device supports DDR4-3200 for fast data access, and features like dynamic ODT improve signal integrity without external components.
추천
Data Center Servers
In server memory modules, the NT5AD512M16 offers high density and bandwidth for virtualization and database workloads. Its 8Gb capacity allows higher module densities, and the 3200 Mbps data rate meets server performance requirements. The device's low power and thermal features help manage data center energy costs, while CRC ensures data integrity in critical applications.
추천
Consumer Electronics
For high-end consumer devices like smart TVs and gaming consoles, the NT5AD512M16 provides fast memory for smooth graphics and multitasking. Its 1.2V operation reduces power in battery-powered devices, and the compact FBGA package fits slim designs. The commercial temperature grade covers typical consumer operating ranges, and features like write leveling ensure compatibility with various SoCs.
추천
추천 제품 요약
엔지니어링 참조 데이터: NT5AD512M16 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | NT5AD512M16C4-HR | NT5AD512M16H4-JR | MT40A512M16JY-07EAIT:B | K4A8G165WB-BCTD |
|---|---|---|---|---|---|
| Package | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA |
| Brand | Nanya Technology | Nanya Technology | Nanya Technology | Micron Technology | Samsung Electronics |
| Density | 8 Gbit | 8 Gbit | 8 Gbit | 8 Gbit | 8 Gbit |
| Organization | 512M x 16 | 512M x 16 | 512M x 16 | 512M x 16 | 512M x 16 |
| Data Rate | 3200 Mbps | 3200 Mbps | 3200 Mbps | 3200 Mbps | 3200 Mbps |
| Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Temperature Grade | Commercial (0°C to +95°C) | Commercial (0°C to +95°C) | Industrial (-40°C to +95°C) | Industrial (-40°C to +95°C) | Commercial (0°C to +95°C) |
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant |
주요 차별점
- High density in 16-bit organization (vs NT5AD512M8D3-HR)
- Industrial temperature grade option (vs MT40A512M16JY-07EAIT:B)
- Built-in temperature sensor and CRC (vs K4A8G165WB-BCTD)
설계 노트
The NT5AD512M16 requires a stable 1.2V VDD supply and a 2.5V VPP supply for wordline boost. Use low-impedance decoupling capacitors (0.1uF and 1uF) placed close to each VDD/VDDQ pin to minimize power supply noise. Ensure the power plane has low inductance and adequate copper pour to handle transient currents during read/write operations.
For DDR4-3200 operation, route all DQ, DQS, and address/control signals with controlled impedance (typically 40-50 ohms single-ended, 80-100 ohms differential). Maintain matched trace lengths within each byte lane to ensure timing skew is minimized. Follow the layout guidelines in the Nanya datasheet for the 96-ball FBGA package, including via placement and ground return paths.
The NT5AD512M16's power dissipation depends on operating frequency and activity. At 3200 Mbps, the device can dissipate up to [DATA_NEEDED: power dissipation] W. Ensure adequate airflow or a thermal pad is provided to keep the junction temperature within the specified range. The industrial grade supports up to +95°C case temperature, but proper thermal management is essential for reliability.
규정 준수 정보
RoHS compliance confirmed from JLCPCB listing. Other compliance data not explicitly provided.
