EP3SE260H780C4L vs EP3SE260H780C3N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260H780C4L disebabkan oleh Intel dan EP3SE260H780C3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP3SE260H780C4L EP3SE260H780C3N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Aktif
Family Stratix III E —
Logic Elements 255,000 —
LABs/CLBs 10,200 —
Total RAM Bits 16,672,768 (16.7 Mbit) —
User I/O Count 488 —
Kemasan 780-ball FCBGA (HBGA 33x33 mm) 780-BBGA, FCBGA (H780)
Speed Grade C4 (middle/slow tier) —
Core Voltage 0.9 V (nominal) —
Suhu Hubungan Operasi 0C to +85C (commercial) —
Jenis Pemasangan Surface Mount (flip-chip BGA) Surface Mount
Aras MSL [DATA_NEEDED: MSL level] —
Status RoHS Compliant (lead-free per datasheet) Compliant (lead-free 'N' suffix)
Transceivers Up to 24 multi-gigabit transceivers [DATA_NEEDED: number of embedded transceivers and max data rate]
Memory Interface DDR3, DDR2, QDRII+, RLDRAM II controllers —
Configuration Mode PS, FPP, JTAG with EPCS/EPCQ —
Series — Stratix® III E
Logic Elements (LE) — 255,000
Embedded Memory (bits) — 16,672,768
Number of LABs/CLBs — 10,200
User I/Os — 488
Number of Pins / Balls — 780
Suhu Operasi — 0 °C to +85 °C (C grade, commercial)
Process Technology — 40 nm CMOS
Maximum Core Frequency — [DATA_NEEDED: maximum core frequency MHz]
Supply Voltage (VCCINT) — [DATA_NEEDED: VCCINT nominal V]
DSP Blocks — [DATA_NEEDED: number of DSP blocks and precision]
Tingkat sensitiviti Air Nama (MSL) — [DATA_NEEDED: MSL level per JEDEC J-STD-020]
Configuration Method — SRAM-based, configured via JTAG / passive / active serial / fast passive parallel
Design Toolchain — Altera Quartus II (legacy); Intel Quartus Prime

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