H5AN4G8NBJR-PBC vs H5AN4G8NBJR-UHCR Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci H5AN4G8NBJR-PBC disebabkan oleh SK hynix dan H5AN4G8NBJR-UHCR disebabkan oleh SK hynix. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

SK hynix
H5AN4G8NBJR-UHCR H5AN4G8NBJR-UHCR - 4Gb DDR4 SDRAM 2400 | SK hynix

H5AN4G8NBJR-UHCR - 4Gb DDR4 SDRAM 2400 | SK hynix

H5AN4G8NBJR-UHCR ✓ Aktif

Pengandingan Spesifikasi

Parametr H5AN4G8NBJR-PBC H5AN4G8NBJR-UHCR
Merek SK hynix SK hynix
Kategori Memory ICs Memory ICs
Status Lingkungan Hidup Aktif Aktif
Memory Density 4 Gbit —
Organisasi 512M x 8 512M x 8
Jenis Ingatan DDR4 SDRAM DDR4 SDRAM
Jenis Antaramuka Parallel, JEDEC DDR4 —
Supply Voltage VDD 1.2 V —
Supply Voltage VDDQ 1.2 V —
Speed Grade PBC UH (DDR4-2400 class, PC2400)
Clock Frequency [DATA_NEEDED: Clock Frequency] —
CAS Latency (CL) [DATA_NEEDED: CAS Latency] —
Kemasan 78-ball FBGA 78-ball FBGA (11 mm x 7.5 mm)
Jenis Pemasangan Surface Mount Surface Mount (BGA solder-down)
Normal Operating Case Temperature 0C to 85C —
Extended Temperature Range up to 95C case (with increased refresh) Up to +95C case temperature (per datasheet conditions)
Lead Free Yes Yes
Boson Bebas Yes Yes
Refresh 8n prefetch, standard/auto refresh per DDR4 JEDEC [DATA_NEEDED: refresh rate 1x/2x specification]
Density — 4 Gbit
Tegangan Pemberi Arus — 1.2 V (VDD)
Antaramuka — DDR4 SSTL12
Internal Prefetch — 8n
Operating Case Temperature — -40C to +85C (industrial range)
Status RoHS — Compliant
Packaging Suffix — -R = Tape and Reel
Latensi CAS — [DATA_NEEDED: CL value for UH grade]

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