MC9S08AC32CFGE vs MC9S08AC16MFDE Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S08AC32CFGE disebabkan oleh NXP Semiconductors dan MC9S08AC16MFDE disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MC9S08AC32CFGE - 8-bit S08 MCU 32KB Flash 40MHz LQFP-44 | NXP
MC9S08AC32CFGE ✓ Aktif
Pengandingan Spesifikasi
| Parametr | MC9S08AC32CFGE | MC9S08AC16MFDE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Aktif |
| Core Processor | S08 (HCS08) | — |
| Core Size | 8-Bit | — |
| Frekuensi Klock Maksimum | 40 MHz | — |
| Internal Bus Frequency | 20 MHz | 20 MHz |
| Flash Memory Size | 32 KB (32K x 8) | — |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| Number of I/O | 38 | — |
| Kemasan | 44-LQFP (10x10 mm) | QFN-48 (7x7 mm) with Exposed Pad |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Product Series | S08AC (Flexis series) | — |
| Program Memory Type | Flash | Flash |
| Life Cycle Stage | ACTIVE | — |
| RAM Size | [DATA_NEEDED: RAM size] | 1 KB |
| ADC Resolution | [DATA_NEEDED: ADC resolution] | — |
| Gambaran Suhu Operasi | [DATA_NEEDED: operating temperature range] | -40 C to +125 C |
| Status RoHS | RoHS Compliant | Compliant |
| Debug Interface | Background Debug Mode (BDM), 6-pin connector | Background Debug Mode (BDM) |
| Core Architecture | — | HCS08 (8-bit) CISC |
| Program Memory Size | — | 16 KB (16K x 8) |
| CPU Clock Speed | — | 40 MHz |
| Number of I/O Pins | — | 38 |
| Peripherals | — | TPM, ADC, SCI, SPI, I2C |
| Lead-Free | — | Yes |
| Status Lingkungan Hidup | — | Active |