MC9S08AC32CFGE vs MC9S08AC16MFDE Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng MC9S08AC32CFGE sa pamamagitan ng NXP Semiconductors at MC9S08AC16MFDE sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

NXP Semiconductors
MC9S08AC32CFGE MC9S08AC32CFGE - 8-bit S08 MCU 32KB Flash 40MHz LQFP-44 | NXP

MC9S08AC32CFGE - 8-bit S08 MCU 32KB Flash 40MHz LQFP-44 | NXP

MC9S08AC32CFGE ✓ Nakahanda
NXP Semiconductors
MC9S08AC16MFDE MC9S08AC16MFDE - 8-bit S08 MCU, 16KB Flash, 40MHz | NXP

MC9S08AC16MFDE - 8-bit S08 MCU, 16KB Flash, 40MHz | NXP

MC9S08AC16MFDE ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro MC9S08AC32CFGE MC9S08AC16MFDE
Brand NXP Semiconductors NXP Semiconductors
Kategorya Microcontrollers Microcontrollers
Katayuan ng Lifecycle Aktibo Aktibo
Core Processor S08 (HCS08) —
Core Size 8-Bit —
Maksimum na Taktiko ng Oras 40 MHz —
Internal Bus Frequency 20 MHz 20 MHz
Flash Memory Size 32 KB (32K x 8) —
Supply Voltage Range 2.7 V to 5.5 V 2.7 V to 5.5 V
Number of I/O 38 —
Packhaging 44-LQFP (10x10 mm) QFN-48 (7x7 mm) with Exposed Pad
Uri ng Pagpapasok Surface Mount Surface Mount
Product Series S08AC (Flexis series) —
Program Memory Type Flash Flash
Life Cycle Stage ACTIVE —
RAM Size [DATA_NEEDED: RAM size] 1 KB
ADC Resolution [DATA_NEEDED: ADC resolution] —
Hanay ng Temperature na Operasyon [DATA_NEEDED: operating temperature range] -40 C to +125 C
Tindminan RoHS RoHS Compliant Compliant
Debug Interface Background Debug Mode (BDM), 6-pin connector Background Debug Mode (BDM)
Core Architecture — HCS08 (8-bit) CISC
Program Memory Size — 16 KB (16K x 8)
CPU Clock Speed — 40 MHz
Number of I/O Pins — 38
Peripherals — TPM, ADC, SCI, SPI, I2C
Lead-Free — Yes
Katayuan ng Lifecycle — Active

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita