MPC8245LVV333D vs MPC8245LVV266D Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC8245LVV333D disebabkan oleh NXP Semiconductors dan MPC8245LVV266D disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
MPC8245LVV333D MPC8245LVV333D - 333MHz PowerPC 603e Integrated Host Processor

MPC8245LVV333D - 333MHz PowerPC 603e Integrated Host Processor

MPC8245LVV333D Obsolete
NXP Semiconductors
MPC8245LVV266D MPC8245LVV266D - 266MHz PowerQUICC II MPU | NXP | Networking

MPC8245LVV266D - 266MHz PowerQUICC II MPU | NXP | Networking

MPC8245LVV266D ✗ Akhir Hayat

Pengandingan Spesifikasi

Parametr MPC8245LVV333D MPC8245LVV266D
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup Obsolete Akhir Hidup
Manufacturer NXP USA Inc. (formerly Freescale / Motorola) NXP USA Inc.
Product Category Microprocessors (MPU) —
Core Architecture PowerPC 603e (Power Architecture technology) —
Core Count 1 —
Lebar Bus Data 32-bit —
Core Frequency 333 MHz —
Integrated Bridge PCI bridge + memory controller —
PCI Interface PCI 2.2 compliant, 32-bit, up to 66 MHz —
Memory Controller 64-bit SDRAM (PC133), ROM/Flash interface DDR SDRAM
Supply Voltage - Core 2.0 V (L suffix, low-voltage core) —
Supply Voltage - I/O 3.3 V —
Suhu Operasi 0 C to +105 C (junction) 0C to +105C (industrial, 'D' suffix)
Kemasan / Case 352-TBGA (35x35 mm) —
Jenis Pemasangan Surface Mount (BGA) Surface Mount (BGA)
Status RoHS [DATA_NEEDED: rohs status not confirmed in verified web data] RoHS compliant (lead-free)
Lead-Free / BGA Solder [DATA_NEEDED: lead-free status not confirmed] —
Part Family — PowerQUICC II (MPC82xx)
Processor Core — PowerPC MPC603e (32-bit Power Architecture)
Core Clock Speed — 266 MHz
Performance — 505.4 MIPS
Number of Cores — 1
L1 Instruction Cache — 32 KB
L1 Data Cache — 32 KB
Core Voltage (Vcc) — 1.8 V
I/O Voltage — 3.3 V
Kemasan — 352-TBGA (35x35 mm)
Packaging — Tray
Integrated PCI Bridge — Yes, 32-bit / 66 MHz PCI
Status Lingkungan Hidup — End of Life (per NXP product page)

Laporan Datasheet & Sumber

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