MPC8245LVV333D vs MPC8245LVV266D Karşılaştırma

Ayrıntılı yan yana karşılaştırma MPC8245LVV333D tarafından NXP Semiconductors ve MPC8245LVV266D tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.

NXP Semiconductors
MPC8245LVV333D MPC8245LVV333D - 333MHz PowerPC 603e Integrated Host Processor

MPC8245LVV333D - 333MHz PowerPC 603e Integrated Host Processor

MPC8245LVV333D Obsolete
NXP Semiconductors
MPC8245LVV266D MPC8245LVV266D - 266MHz PowerQUICC II MPU | NXP | Networking

MPC8245LVV266D - 266MHz PowerQUICC II MPU | NXP | Networking

MPC8245LVV266D ✗ Son Kullanım Zamanı

Özellik Karşılaştırması

Parametre MPC8245LVV333D MPC8245LVV266D
Marka NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Yaşam Döngüsü Durumu Obsolete Hayat Dönemi Sonu
Manufacturer NXP USA Inc. (formerly Freescale / Motorola) NXP USA Inc.
Product Category Microprocessors (MPU) —
Core Architecture PowerPC 603e (Power Architecture technology) —
Core Count 1 —
Veri Bus Genişliği 32-bit —
Core Frequency 333 MHz —
Integrated Bridge PCI bridge + memory controller —
PCI Interface PCI 2.2 compliant, 32-bit, up to 66 MHz —
Memory Controller 64-bit SDRAM (PC133), ROM/Flash interface DDR SDRAM
Supply Voltage - Core 2.0 V (L suffix, low-voltage core) —
Supply Voltage - I/O 3.3 V —
İşletim Sıcaklığı 0 C to +105 C (junction) 0C to +105C (industrial, 'D' suffix)
Paket / Kas 352-TBGA (35x35 mm) —
Montaj Türü Surface Mount (BGA) Surface Mount (BGA)
RoHS Durumu [DATA_NEEDED: rohs status not confirmed in verified web data] RoHS compliant (lead-free)
Lead-Free / BGA Solder [DATA_NEEDED: lead-free status not confirmed] —
Part Family — PowerQUICC II (MPC82xx)
Processor Core — PowerPC MPC603e (32-bit Power Architecture)
Core Clock Speed — 266 MHz
Performance — 505.4 MIPS
Number of Cores — 1
L1 Instruction Cache — 32 KB
L1 Data Cache — 32 KB
Core Voltage (Vcc) — 1.8 V
I/O Voltage — 3.3 V
Paket — 352-TBGA (35x35 mm)
Packaging — Tray
Integrated PCI Bridge — Yes, 32-bit / 66 MHz PCI
Yaşam Döngüsü Durumu — End of Life (per NXP product page)

Dökümanlar & Kaynaklar

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