MPC8245LVV333D vs MPC8245LVV266D Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng MPC8245LVV333D sa pamamagitan ng NXP Semiconductors at MPC8245LVV266D sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

NXP Semiconductors
MPC8245LVV333D MPC8245LVV333D - 333MHz PowerPC 603e Integrated Host Processor

MPC8245LVV333D - 333MHz PowerPC 603e Integrated Host Processor

MPC8245LVV333D Obsolete
NXP Semiconductors
MPC8245LVV266D MPC8245LVV266D - 266MHz PowerQUICC II MPU | NXP | Networking

MPC8245LVV266D - 266MHz PowerQUICC II MPU | NXP | Networking

MPC8245LVV266D ✗ Tapus ng Buhay

Pagsanggunian na paghahambing

Parametro MPC8245LVV333D MPC8245LVV266D
Brand NXP Semiconductors NXP Semiconductors
Kategorya Microcontrollers Microcontrollers
Katayuan ng Lifecycle Obsolete Tapus ng Buhay
Manufacturer NXP USA Inc. (formerly Freescale / Motorola) NXP USA Inc.
Product Category Microprocessors (MPU) —
Core Architecture PowerPC 603e (Power Architecture technology) —
Core Count 1 —
Width ng Data Bus 32-bit —
Core Frequency 333 MHz —
Integrated Bridge PCI bridge + memory controller —
PCI Interface PCI 2.2 compliant, 32-bit, up to 66 MHz —
Memory Controller 64-bit SDRAM (PC133), ROM/Flash interface DDR SDRAM
Supply Voltage - Core 2.0 V (L suffix, low-voltage core) —
Supply Voltage - I/O 3.3 V —
Temperature na Operasyon 0 C to +105 C (junction) 0C to +105C (industrial, 'D' suffix)
Packhaging / Kaso 352-TBGA (35x35 mm) —
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount (BGA)
Tindminan RoHS [DATA_NEEDED: rohs status not confirmed in verified web data] RoHS compliant (lead-free)
Lead-Free / BGA Solder [DATA_NEEDED: lead-free status not confirmed] —
Part Family — PowerQUICC II (MPC82xx)
Processor Core — PowerPC MPC603e (32-bit Power Architecture)
Core Clock Speed — 266 MHz
Performance — 505.4 MIPS
Number of Cores — 1
L1 Instruction Cache — 32 KB
L1 Data Cache — 32 KB
Core Voltage (Vcc) — 1.8 V
I/O Voltage — 3.3 V
Packhaging — 352-TBGA (35x35 mm)
Packaging — Tray
Integrated PCI Bridge — Yes, 32-bit / 66 MHz PCI
Katayuan ng Lifecycle — End of Life (per NXP product page)

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