MPC8245LVV333D vs XPC8240LVV200E Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC8245LVV333D disebabkan oleh NXP Semiconductors dan XPC8240LVV200E disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
MPC8245LVV333D MPC8245LVV333D - 333MHz PowerPC 603e Integrated Host Processor

MPC8245LVV333D - 333MHz PowerPC 603e Integrated Host Processor

MPC8245LVV333D Obsolete
NXP Semiconductors
XPC8240LVV200E XPC8240LVV200E - 200MHz PowerPC 603e MPU 352-TBGA | NXP

XPC8240LVV200E - 200MHz PowerPC 603e MPU 352-TBGA | NXP

XPC8240LVV200E Nrnd

Pengandingan Spesifikasi

Parametr MPC8245LVV333D XPC8240LVV200E
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup Obsolete NRND
Manufacturer NXP USA Inc. (formerly Freescale / Motorola) NXP Semiconductors
Product Category Microprocessors (MPU) —
Core Architecture PowerPC 603e (Power Architecture technology) 32-bit RISC PowerPC
Core Count 1 —
Lebar Bus Data 32-bit —
Core Frequency 333 MHz —
Integrated Bridge PCI bridge + memory controller PCI bridge (PCI 2.2 compatible)
PCI Interface PCI 2.2 compliant, 32-bit, up to 66 MHz —
Memory Controller 64-bit SDRAM (PC133), ROM/Flash interface SDRAM, ROM/Flash, burst SRAM
Supply Voltage - Core 2.0 V (L suffix, low-voltage core) —
Supply Voltage - I/O 3.3 V —
Suhu Operasi 0 C to +105 C (junction) Extended (E suffix)
Kemasan / Case 352-TBGA (35x35 mm) —
Jenis Pemasangan Surface Mount (BGA) Surface Mount
Status RoHS [DATA_NEEDED: rohs status not confirmed in verified web data] RoHS Compliant
Lead-Free / BGA Solder [DATA_NEEDED: lead-free status not confirmed] —
Series — MPC82xx / PowerQUICC II
Core Processor — PowerPC 603e
Number of Cores — 1
Core Clock Speed — 200 MHz
Core Supply Voltage — 2.5 V
L1 Instruction Cache — 16 KB
L1 Data Cache — 16 KB
Local Bus Width — 64-bit 60x bus
Serial Interfaces — 2x UART, I2C
Debug Interface — JTAG / COP
Kemasan — 352-TBGA (35 x 35 mm)
Packaging — Tray
Lead Free Status — Lead Free

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