MPC8245LVV333D vs XPC8240LVV200E 比較
詳細並排比較 MPC8245LVV333D 由 NXP Semiconductors 與 XPC8240LVV200E 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
MPC8245LVV333D - 333MHz PowerPC 603e Integrated Host Processor
MPC8245LVV333D Obsolete規格比較
| 參數 | MPC8245LVV333D | XPC8240LVV200E |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | Obsolete | NRND |
| Manufacturer | NXP USA Inc. (formerly Freescale / Motorola) | NXP Semiconductors |
| Product Category | Microprocessors (MPU) | — |
| Core Architecture | PowerPC 603e (Power Architecture technology) | 32-bit RISC PowerPC |
| Core Count | 1 | — |
| 資料匯流排寬度 | 32-bit | — |
| Core Frequency | 333 MHz | — |
| Integrated Bridge | PCI bridge + memory controller | PCI bridge (PCI 2.2 compatible) |
| PCI Interface | PCI 2.2 compliant, 32-bit, up to 66 MHz | — |
| Memory Controller | 64-bit SDRAM (PC133), ROM/Flash interface | SDRAM, ROM/Flash, burst SRAM |
| Supply Voltage - Core | 2.0 V (L suffix, low-voltage core) | — |
| Supply Voltage - I/O | 3.3 V | — |
| 工作溫度 | 0 C to +105 C (junction) | Extended (E suffix) |
| 封裝 / 外殼 | 352-TBGA (35x35 mm) | — |
| 安裝類型 | Surface Mount (BGA) | Surface Mount |
| RoHS 狀態 | [DATA_NEEDED: rohs status not confirmed in verified web data] | RoHS Compliant |
| Lead-Free / BGA Solder | [DATA_NEEDED: lead-free status not confirmed] | — |
| Series | — | MPC82xx / PowerQUICC II |
| Core Processor | — | PowerPC 603e |
| Number of Cores | — | 1 |
| Core Clock Speed | — | 200 MHz |
| Core Supply Voltage | — | 2.5 V |
| L1 Instruction Cache | — | 16 KB |
| L1 Data Cache | — | 16 KB |
| Local Bus Width | — | 64-bit 60x bus |
| Serial Interfaces | — | 2x UART, I2C |
| Debug Interface | — | JTAG / COP |
| 封裝 | — | 352-TBGA (35 x 35 mm) |
| Packaging | — | Tray |
| Lead Free Status | — | Lead Free |