MPC8245LVV333D vs XPC8240LVV200E Karşılaştırma

Ayrıntılı yan yana karşılaştırma MPC8245LVV333D tarafından NXP Semiconductors ve XPC8240LVV200E tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.

NXP Semiconductors
MPC8245LVV333D MPC8245LVV333D - 333MHz PowerPC 603e Integrated Host Processor

MPC8245LVV333D - 333MHz PowerPC 603e Integrated Host Processor

MPC8245LVV333D Obsolete
NXP Semiconductors
XPC8240LVV200E XPC8240LVV200E - 200MHz PowerPC 603e MPU 352-TBGA | NXP

XPC8240LVV200E - 200MHz PowerPC 603e MPU 352-TBGA | NXP

XPC8240LVV200E Nrnd

Özellik Karşılaştırması

Parametre MPC8245LVV333D XPC8240LVV200E
Marka NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Yaşam Döngüsü Durumu Obsolete NRND
Manufacturer NXP USA Inc. (formerly Freescale / Motorola) NXP Semiconductors
Product Category Microprocessors (MPU) —
Core Architecture PowerPC 603e (Power Architecture technology) 32-bit RISC PowerPC
Core Count 1 —
Veri Bus Genişliği 32-bit —
Core Frequency 333 MHz —
Integrated Bridge PCI bridge + memory controller PCI bridge (PCI 2.2 compatible)
PCI Interface PCI 2.2 compliant, 32-bit, up to 66 MHz —
Memory Controller 64-bit SDRAM (PC133), ROM/Flash interface SDRAM, ROM/Flash, burst SRAM
Supply Voltage - Core 2.0 V (L suffix, low-voltage core) —
Supply Voltage - I/O 3.3 V —
İşletim Sıcaklığı 0 C to +105 C (junction) Extended (E suffix)
Paket / Kas 352-TBGA (35x35 mm) —
Montaj Türü Surface Mount (BGA) Surface Mount
RoHS Durumu [DATA_NEEDED: rohs status not confirmed in verified web data] RoHS Compliant
Lead-Free / BGA Solder [DATA_NEEDED: lead-free status not confirmed] —
Series — MPC82xx / PowerQUICC II
Core Processor — PowerPC 603e
Number of Cores — 1
Core Clock Speed — 200 MHz
Core Supply Voltage — 2.5 V
L1 Instruction Cache — 16 KB
L1 Data Cache — 16 KB
Local Bus Width — 64-bit 60x bus
Serial Interfaces — 2x UART, I2C
Debug Interface — JTAG / COP
Paket — 352-TBGA (35 x 35 mm)
Packaging — Tray
Lead Free Status — Lead Free

Dökümanlar & Kaynaklar

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