MPC8555EPXAQF vs MPC8555EPXAPF Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC8555EPXAQF disebabkan oleh NXP Semiconductors dan MPC8555EPXAPF disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MPC8555EPXAQF - PowerQUICC III 1GHz e500 MPU | NXP | Networking
MPC8555EPXAQF NrndNXP Semiconductors
MPC8555EPXAPF - PowerQUICC III 833MHz e500 MPU | NXP
MPC8555EPXAPF ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | MPC8555EPXAQF | MPC8555EPXAPF |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Masa Terakhir Dibeli |
| Architecture | PowerPC e500 (Power Architecture technology) | PowerPC e500 (Power Architecture) |
| Core Count | 1 | — |
| Lebar Bus Data | 32-Bit | 32-Bit |
| Core Frequency (Max) | 1.0 GHz | — |
| Supply Voltage (Core) | 1.2 V | — |
| Package Type | FCPBGA (Flip Chip Plastic BGA) | FCPBGA-783 (29 x 29 mm, 1 mm pitch, flip chip) |
| Pin / Ball Count | 783 | — |
| Package Dimensions | 29 x 29 mm, 1 mm pitch, 3.75 mm height | — |
| Jenis Pemasangan | Surface Mount | — |
| Suhu Operasi | [DATA_NEEDED: operating temperature range] | — |
| Series | PowerQUICC III (MPC85xx) | — |
| Part Marketing Code | PQ 37 LITE 8555E | — |
| Integrated Peripherals | [DATA_NEEDED: integrated peripherals list] | — |
| Memory Controller | [DATA_NEEDED: DDR1/DDR2 support details] | DDR / DDR2 up to 333 MHz |
| Ethernet MACs | [DATA_NEEDED: number of GbE MACs] | — |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS compliance status] |
| Aras MSL | [DATA_NEEDED: MSL rating] | — |
| Core | — | Single e500 |
| Maximum Clock Speed | — | 833 MHz |
| Core Supply Voltage | — | 1.2 V |
| I/O Supply Voltage | — | 2.5 V / 3.3 V |
| Package Height | — | 3.75 mm |
| Kiraan Pin | — | 783 |
| Gambaran Suhu Operasi | — | -40 °C to +85 °C (industrial, extended) |
| L1 Instruction Cache | — | 32 KB |
| L1 Data Cache | — | 32 KB |
| Ethernet | — | Two 10/100 Fast Ethernet MACs |
| PCI Interface | — | PCI / PCI-X bridge (up to 133 MHz) |
| Process Technology | — | 130 nm CMOS |
| Security Engine | — | SEC 2.0 (Integrated) |