MPC8555EPXAQF vs MPC8555EPXAPF Karşılaştırma
Ayrıntılı yan yana karşılaştırma MPC8555EPXAQF tarafından NXP Semiconductors ve MPC8555EPXAPF tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
NXP Semiconductors
MPC8555EPXAQF - PowerQUICC III 1GHz e500 MPU | NXP | Networking
MPC8555EPXAQF NrndNXP Semiconductors
MPC8555EPXAPF - PowerQUICC III 833MHz e500 MPU | NXP
MPC8555EPXAPF ⚠ Son Satın AlmaÖzellik Karşılaştırması
| Parametre | MPC8555EPXAQF | MPC8555EPXAPF |
|---|---|---|
| Marka | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Yaşam Döngüsü Durumu | NRND | Son Alış Zamanı |
| Architecture | PowerPC e500 (Power Architecture technology) | PowerPC e500 (Power Architecture) |
| Core Count | 1 | — |
| Veri Bus Genişliği | 32-Bit | 32-Bit |
| Core Frequency (Max) | 1.0 GHz | — |
| Supply Voltage (Core) | 1.2 V | — |
| Package Type | FCPBGA (Flip Chip Plastic BGA) | FCPBGA-783 (29 x 29 mm, 1 mm pitch, flip chip) |
| Pin / Ball Count | 783 | — |
| Package Dimensions | 29 x 29 mm, 1 mm pitch, 3.75 mm height | — |
| Montaj Türü | Surface Mount | — |
| İşletim Sıcaklığı | [DATA_NEEDED: operating temperature range] | — |
| Series | PowerQUICC III (MPC85xx) | — |
| Part Marketing Code | PQ 37 LITE 8555E | — |
| Integrated Peripherals | [DATA_NEEDED: integrated peripherals list] | — |
| Memory Controller | [DATA_NEEDED: DDR1/DDR2 support details] | DDR / DDR2 up to 333 MHz |
| Ethernet MACs | [DATA_NEEDED: number of GbE MACs] | — |
| RoHS Durumu | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS compliance status] |
| MSL Seviyesi | [DATA_NEEDED: MSL rating] | — |
| Core | — | Single e500 |
| Maximum Clock Speed | — | 833 MHz |
| Core Supply Voltage | — | 1.2 V |
| I/O Supply Voltage | — | 2.5 V / 3.3 V |
| Package Height | — | 3.75 mm |
| Pin Sayısı | — | 783 |
| İşletim Sıcaklığı Aralığı | — | -40 °C to +85 °C (industrial, extended) |
| L1 Instruction Cache | — | 32 KB |
| L1 Data Cache | — | 32 KB |
| Ethernet | — | Two 10/100 Fast Ethernet MACs |
| PCI Interface | — | PCI / PCI-X bridge (up to 133 MHz) |
| Process Technology | — | 130 nm CMOS |
| Security Engine | — | SEC 2.0 (Integrated) |