MPC8555EPXAQF vs MPC8555EPXAPF Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MPC8555EPXAQF sa pamamagitan ng NXP Semiconductors at MPC8555EPXAPF sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MPC8555EPXAQF - PowerQUICC III 1GHz e500 MPU | NXP | Networking
MPC8555EPXAQF NrndNXP Semiconductors
MPC8555EPXAPF - PowerQUICC III 833MHz e500 MPU | NXP
MPC8555EPXAPF ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | MPC8555EPXAQF | MPC8555EPXAPF |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | NRND | Huling Pagbili |
| Architecture | PowerPC e500 (Power Architecture technology) | PowerPC e500 (Power Architecture) |
| Core Count | 1 | — |
| Width ng Data Bus | 32-Bit | 32-Bit |
| Core Frequency (Max) | 1.0 GHz | — |
| Supply Voltage (Core) | 1.2 V | — |
| Package Type | FCPBGA (Flip Chip Plastic BGA) | FCPBGA-783 (29 x 29 mm, 1 mm pitch, flip chip) |
| Pin / Ball Count | 783 | — |
| Package Dimensions | 29 x 29 mm, 1 mm pitch, 3.75 mm height | — |
| Uri ng Pagpapasok | Surface Mount | — |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | — |
| Series | PowerQUICC III (MPC85xx) | — |
| Part Marketing Code | PQ 37 LITE 8555E | — |
| Integrated Peripherals | [DATA_NEEDED: integrated peripherals list] | — |
| Memory Controller | [DATA_NEEDED: DDR1/DDR2 support details] | DDR / DDR2 up to 333 MHz |
| Ethernet MACs | [DATA_NEEDED: number of GbE MACs] | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS compliance status] |
| Level ng MSL | [DATA_NEEDED: MSL rating] | — |
| Core | — | Single e500 |
| Maximum Clock Speed | — | 833 MHz |
| Core Supply Voltage | — | 1.2 V |
| I/O Supply Voltage | — | 2.5 V / 3.3 V |
| Package Height | — | 3.75 mm |
| Bilang ng Pin | — | 783 |
| Hanay ng Temperature na Operasyon | — | -40 °C to +85 °C (industrial, extended) |
| L1 Instruction Cache | — | 32 KB |
| L1 Data Cache | — | 32 KB |
| Ethernet | — | Two 10/100 Fast Ethernet MACs |
| PCI Interface | — | PCI / PCI-X bridge (up to 133 MHz) |
| Process Technology | — | 130 nm CMOS |
| Security Engine | — | SEC 2.0 (Integrated) |