A54SX72A-2FG256I - SX-A Antifuse FPGA 108K Gates | Microchip
MPN: A54SX72A-2FG256I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $262 | $2,620.00 |
| 100 | $238 | $23,800.00 |
| 500 | $216 | $108,000.00 |
| 1,000 | $198 | $198,000.00 |
Drop-in alternatives for A54SX72A-2FG256I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A54SX72A-2FGG256I
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View Datasheet →A54SX72A-2FG256I Maximum Ratings & Electrical Characteristics
| Family | SX-A (Antifuse FPGA) |
| System Gates | 108000 gates |
| Typical Gates | 72K gates |
| Logic Modules (Cells) | 4024 |
| User I/O | 203 |
| Core Supply Voltage | 2.5 V |
| Maximum Toggle Frequency | 294 MHz |
| Process Technology | 0.25 um / 0.22 um CMOS |
| Programmable Type | One-Time Programmable (Antifuse) |
| Speed Grade | -2 |
| Operating Temperature | -40C to +85C (Industrial) |
| Package | 256-Ball FBGA (17x17x1.97 mm) |
| Mounting Type | Surface Mount |
| Dedicated Clock Networks | CLKA, CLKB, QCLK (quadrant) |
| Configuration | Inherent (antifuse, no boot PROM) |
| RoHS Status | Compliant |
A54SX72A-2FG256I 256-ball fbga (17x17x1.97 mm) Pin Configuration Guide
Complete pinout information for A54SX72A-2FG256I (256-ball fbga (17x17x1.97 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A54SX72A-2FG256I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A54SX72A-2FG256I is suitable for 6 applications: Industrial Automation and Control, Communications and Networking Line Cards, Avionics and Defense Systems, Test and Measurement Equipment, Design-Secure Single-Chip Logic Integration, Low-Power Embedded Systems.
Industrial Automation and Control
The A54SX72A-2FG256I fits factory automation boards that must integrate PLC glue logic, encoder interfaces, and fieldbus protocol bridging into one device. Its 108K system gates and 203 user I/Os absorb multiple 74xx-class devices and CPLDs, while the industrial -40C to +85C rating covers unconditioned cabinet environments. Because the antifuse configuration needs no boot PROM, the FPGA is active within nanoseconds of power-up, supporting deterministic start-up of safety-adjacent control sequences. Place the 2.5V core rail with local 0.1 uF and bulk 10 uF decoupling; the very low static current means thermal design is trivial compared with SRAM FPGAs of similar capacity, simplifying sealed, fanless enclosure designs.
Recommended
Communications and Networking Line Cards
Networking line cards benefit from the A54SX72A-2FG256I's combination of ~294 MHz toggle capability, three clock domains (CLKA, CLKB, quadrant QCLK), and 203 I/Os for backplane and PHY interfacing. The -2 speed grade provides the faster worst-case timing corners needed for pipeline stages in framing, multiplexing, and protocol adaptation logic. Because the antifuse fabric has no configuration readback path, the device provides inherent bitstream security - valuable in carrier equipment subject to design-theft concerns. Its instant-on operation also means links initialize without waiting for FPGA configuration, reducing overall system boot time in chassis-based platforms with watchdog timing constraints.
Recommended
Avionics and Defense Systems
Avionics and defense subsystems adopt the A54SX72A-2FG256I where one-time-programmable, configuration-free logic reduces single points of failure: there is no external configuration flash to corrupt under vibration or radiation events. The A temperature-screened sibling A54SX72A-FGG256A and military-grade A54SX72A-FGG256M occupy the same 256-ball FBGA footprint, allowing a single PCB layout to serve commercial, automotive-screened, and full military build standards. With 72K usable gates, the device integrates ARINC/MIL-STD bus glue logic, discrete-to-digital conversion, and voter circuits. Designers should verify screening level requirements early, since antifuse parts cannot be reprogrammed after assembly-level changes.
Recommended
Test and Measurement Equipment
Bench instruments and automated test equipment use the A54SX72A-2FG256I as timing-generator, trigger-matrix, and bus-interface logic. The 294 MHz toggle capability supports high-resolution event timing, while three clock networks allow independent timebases for measurement channels and host interface logic. Industrial temperature rating and instant-on antifuse configuration eliminate instrument warm-up delays caused by FPGA boot, so measurements begin as soon as power is applied. The low static power of antifuse fabric keeps self-heating minimal, protecting measurement accuracy in the 17x17 mm FBGA. Integrate the device with precision ADC front ends and MCU host controllers to consolidate acquisition logic into one secure, single-chip solution.
Recommended
Design-Secure Single-Chip Logic Integration
For systems where intellectual-property protection is paramount, the A54SX72A-2FG256I offers architectural security that SRAM FPGAs cannot match: configuration is stored as physical antifuse connections, so there is no bitstream in external memory to intercept and no readback mechanism to attack. OEMs consolidating multiple ASSP and glue-logic functions into a single chip use the 108K system gates to create proprietary integration that competitors cannot clone by dumping configuration data. The 256-ball FBGA (17x17 mm) provides a compact footprint for embedded controllers, and the very low quiescent current suits battery-backed and always-on secure modules where standby power is budgeted in milliwatts.
Recommended
Low-Power Embedded Systems
Battery-backed and energy-harvesting embedded systems choose the A54SX72A-2FG256I because antifuse FPGAs draw near-zero static current - unlike SRAM FPGAs, which dissipate continuous standby power to retain configuration. The 2.5V core and absence of a configuration flash further cut BOM count and quiescent load. With 72K usable gates, designers can implement power-sequencing controllers, interface bridging, and wake-up logic that remains active while main processors sleep. The industrial temperature grade covers outdoor telemetry nodes, and the 17x17 mm 256-ball FBGA suits compact layouts. Estimated dynamic power should be modeled with Microchip's power tools since antifuse devices have no configuration-related baseline draw.
Recommended
Recommended Products Summary
Engineering reference data for A54SX72A-2FG256I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A54SX72A-2FGG256I | A54SX72A-FGG256I | A54SX72A-1FGG256 | A54SX72A-FGG256M |
|---|---|---|---|---|---|
| Package | 256-Ball FBGA (17x17 mm) | 256-Ball FBGA - same | 256-Ball FBGA - same | 256-Ball FBGA - same | 256-Ball FBGA - same |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 108K | 108K | 108K | 108K | 108K |
| User I/O | 203 | 203 | 203 | 203 | 203 |
| Speed Grade | -2 | -2 | Standard | -1 | Standard |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | Commercial range [DATA_NEEDED: exact range] | Military grade |
| Core Supply Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Packaging Type | RoHS (non-G suffix) / Tray | RoHS green / Tray | RoHS green / Tray | RoHS green / Tray | RoHS green / Tray |
Key Differentiators
- Fastest widely stocked -2 speed grade in the 256 FBGA industrial option (vs A54SX72A-1FGG256)
- Configuration-free instant-on operation (vs SRAM FPGAs of similar density)
- Trade-off: one-time programmability (vs A54SX72A-2FGG256I (same die))
Design Notes
The A54SX72A-2FG256I is one-time programmable: antifuse interconnect is permanently set at programming time. Complete RTL simulation, static timing analysis against the -2 speed file in the Microchip Libero SoC flow, and board-level signal-integrity review BEFORE programming production devices. Reserve margin in module utilization and I/O count for late design changes, since a design fix requires a new programmed device. There is no in-system reconfiguration path and no bitstream readback - which is a security feature but eliminates field updates.
Power the 2.5V core rail with local 0.1 uF ceramic decoupling at VDD ball pairs and bulk 10 uF near the device. Estimated: antifuse FPGAs have near-zero static current because there is no configuration SRAM to retain; dynamic current scales with toggle rate and should be modeled with Microchip power estimation tools using your post-place-and-route netlist. Verify the I/O bank supply rails in the SX-A datasheet power section before finalizing the power tree, and sequence supplies per the datasheet recommendation.
For the 256-ball FBGA (1.0 mm pitch, 17x17 mm), use a conventional BGA fanout with via-in-pad or dog-bone escapes on the outer two ball rows and route inner rows to internal layers. Dedicated clock pins CLKA, CLKB, and QCLK must be driven from clean, low-jitter sources with series termination near the driver; per Microchip application notes on A54SX72A quadrant clocks, QCLK resources clock only the quadrant they serve - partition your clocking plan accordingly. Follow JTAG ball connections per the SX-A datasheet for boundary-scan chain integrity.
Compliance Information
Newark listing states 'ROHS COMPLIANT: YES' for the A54SX72A-2FG256I (256 PBGA 17x17x1.97 mm, tray). The G-suffix variants (e.g., A54SX72A-2FGG256I) are the explicitly RoHS-green packaging options.
