EP1S60F1020 - Stratix 57K LEs, 1020-BGA FPGA | Altera
MPN: EP1S60F1020 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5413.87 | $5,413.87 |
| 10 | $5150 | $51,500.00 |
| 100 | $4750 | $475,000.00 |
| 500 | $4380 | $2,190,000.00 |
| 1,000 | $3995 | $3,995,000.00 |
Drop-in alternatives for EP1S60F1020 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S60F1020C6
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$105 / Unit
View Datasheet →EP1S60F1020C6N
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View Datasheet →EP1S60F1020I6
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View Datasheet →EP1S60F1020I6N
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$3650 / Unit
View Datasheet →EP1S40F1020C6
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$1380 / Unit
View Datasheet →EP1S30F1020C6
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View Datasheet →EP1S60F1020 Maximum Ratings & Electrical Characteristics
| Series | Stratix |
| Family | Altera Stratix (EP1S) |
| Process Technology | 0.13 um CMOS |
| Logic Elements (LEs) | 57,120 |
| Logic Array Blocks (LABs) | 5,712 |
| Total RAM Bits | 5,215,104 |
| User I/Os | 773 |
| Package | 1020-BGA (FineLine FBGA) |
| Core Voltage | 1.5 V |
| Operating Temperature (base part) | Commercial (0C to +85C) |
| Mounting Type | Surface Mount (BGA) |
| I/O Standard Support | LVDS, LVPECL, SSTL, HSTL, PCI/PCI-X |
| Configuration Memory | SRAM-based, requires external configuration device |
EP1S60F1020 1020-bga (fineline fbga) Pin Configuration Guide
Complete pinout information for EP1S60F1020 (1020-bga (fineline fbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S60F1020.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S60F1020 is suitable for 6 applications: High-End ASIC Prototyping, Communications Infrastructure (SONET/SDH, Base Station Baseband), High-Performance DSP for Video / Imaging Pipelines, Military / Aerospace Signal Processing, Multi-Channel Packet Processing / Storage Controllers, Test & Measurement Instrumentation Backplane.
High-End ASIC Prototyping
The EP1S60F1020 fits ASIC prototyping because it offers 57,120 LEs and 5,215,104 RAM bits - enough capacity to map large ASIC RTL blocks 1:1 without aggressive resource sharing. Its 1020-BGA footprint exposes 773 user I/Os, which lets prototype boards break out wide parallel buses (DDR2, RapidIO, parallel LVDS) to the target ASIC's IO pad ring. Compared with smaller Stratix parts (EP1S25/EP1S40), the EP1S60F1020 reduces multi-FPGAs partitioning overhead and shortens bring-up time. Quartus synthesis reports indicate that designs of 40-45k LEs fit comfortably, leaving room for instrumentation logic.
Recommended
Communications Infrastructure (SONET/SDH, Base Station Baseband)
The EP1S60F1020's 57,120 LEs and dedicated DSP blocks make it well suited to communications infrastructure such as SONET/SDH framers, channelized base-station baseband processing, and high-speed packet classification. The 773 user I/Os accommodate SFI-4 / XAUI / SPI-4 parallel interfaces to network processors, while 12 PLLs generate the multiple clock domains required for TDM framer and DSP cores. Its 5.2 Mbit TriMatrix RAM provides line-rate buffering for packet inspection and look-up tables. Industrial-grade -I6 variants support outdoor base-station deployments.
Recommended
High-Performance DSP for Video / Imaging Pipelines
The EP1S60F1020 serves high-throughput DSP workloads like HD video codecs, multi-channel image preprocessing, and radar signal processing because its 0.13um Stratix fabric integrates dedicated multiplier/accumulator blocks and 5.2 Mbit RAM, achieving tens of GMACs of throughput. With 773 user I/Os, the FPGA streams parallel video buses (BT.1120, Camera Link) directly into the fabric without external glueless FIFOs. Compared with EP1S30F1020 (32,470 LEs), the EP1S60F1020 supports full-HD multi-stream encoding. The 1020-BGA package's fine-pitch BGA preserves signal integrity at LVDS data rates above 1 Gbps.
Recommended
Military / Aerospace Signal Processing
The EP1S60F1020's industrial-grade -I6 variant and rugged FBGA package make it a candidate for military and aerospace signal processing such as electronic warfare receivers, radar preprocessing, and avionics databuses. Its 57,120 LEs handle real-time FFTs, channelization, and crypto offload, while the 1020-BGA mechanical form factor withstands vibration and thermal cycling better than ceramic QFP. Designers should verify the exact MIL-spec part variant (EP1S60F1020I6 with appropriate testing/inspection certificates) per program requirements. Alternative Atmel/Microsemi RTAX FPGAs offer rad-hard silicon for deep-space missions.
Recommended
Multi-Channel Packet Processing / Storage Controllers
Buffer-intensive designs like multi-gigabit Ethernet packet inspectors, RAID storage controllers, and SSD form-factor emulators fit the EP1S60F1020 because its 5,215,104 RAM bits provide enough on-chip packet descriptors, hash tables, and command queues to avoid external SRAM in many cases. The 773 user I/Os expose multiple SGMII / SERDES lanes and parallel flash interfaces simultaneously. Compared with EP1S25F1020 (24,060 LEs), the EP1S60F1020 sustains 10G line-rate classification. Quartus IP cores for DDR2 SDRAM controllers consume a fraction of the available LEs.
Recommended
Test & Measurement Instrumentation Backplane
The EP1S60F1020 functions as a high-density logic backbone in bench-top test and measurement gear, such as logic-analyzer capture boards, protocol exercisers, and ATE pin electronics. Its 773 user I/Os fan out to dozens of DUT channels simultaneously, while the 5,215,104 RAM bits hold deep capture buffers (millions of samples) on-chip. Compared with the EP1S40F1020 (41,250 LEs), the EP1S60F1020 doubles the on-chip trigger logic and pattern-generation capacity. The 1020-FBGA exposes enough parallel LVDS pairs for timing-resolved multi-channel measurements at sub-nanosecond resolution.
Recommended
Recommended Products Summary
Engineering reference data for EP1S60F1020 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S60F1020C6 | EP1S60F1020I6 | EP1S40F1020C6 | EP1S30F1020C6 |
|---|---|---|---|---|---|
| Brand | Altera (now Intel FPGA) | Altera (now Intel FPGA) | Altera (now Intel FPGA) | Altera (now Intel FPGA) | Altera (now Intel FPGA) |
| Package | 1020-BGA (FineLine FBGA) | 1020-BGA (FineLine FBGA) - same | 1020-BGA (FineLine FBGA) - same | 1020-BGA (FineLine FBGA) - same | 1020-BGA (FineLine FBGA) - same |
| Logic Elements | 57,120 LEs | 57,120 LEs | 57,120 LEs | 41,250 LEs (-28%) | 32,470 LEs (-43%) |
| Total RAM Bits | 5,215,104 bits | 5,215,104 bits | 5,215,104 bits | 3,423,744 bits (-34%) | 2,215,296 bits (-58%) |
| User I/Os | 773 | 773 | 773 | 773 (same ball-out) | 773 (same ball-out) |
| Temperature Grade (base) | Commercial (unsuffixed) | Commercial 0C to +85C | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C |
| Speed Grade (base) | [DATA_NEEDED: unsuffixed] | -6 | -6 | -6 | -6 |
| Lead-Free / RoHS | [DATA_NEEDED] | Depends on suffix (C6N = lead-free) | Depends on suffix (I6N = lead-free) | Depends on suffix | Depends on suffix |
| Lifecycle Status (2026) | Last-time-buy / EOL | Last-time-buy / EOL | Last-time-buy / EOL | Last-time-buy / EOL | Last-time-buy / EOL |
| Approx. Unit Price (USD, as of 2026-09-07) | ~$3,660 - $5,414 | $3,659.92 (Heisener) | $5,413.87 (Heisener) | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Largest density and highest I/O count in the Stratix family (vs EP1S40F1020C6)
- Industrial temperature grade in the same package (vs EP1S60F1020C6)
- TriMatrix memory architecture with three block sizes (vs Smaller Stratix (EP1S10/EP1S20))
Design Notes
The 1020-FineLine-BGA package has a 1.00 mm ball pitch and demands a multilayer PCB with at least a 6-layer stack-up. Use continuous ground and power planes directly under the BGA to provide low-impedance returns for high-speed signals, and route differential pairs (LVDS/LVPECL) with controlled 100 ohm differential impedance. Microvia / via-in-pad technology is recommended to escape the inner balls; tented vias should be avoided under the BGA. Decoupling: place 0.1uF X7R 0402 caps within 2mm of every VCCIO/VCCINT ball group, with bulk 22uF/47uF tantalum or polymer capacitors on each power plane.
Estimated: at typical utilization (50% LEs, 75% RAM, full I/O switching) the EP1S60F1020 VCCINT (1.5V) draws approximately 1.5-2.0 A, and VCCIO banks each draw 0.1-0.5 A depending on bank voltage and toggle rate. The total supply budget for a fully utilized EP1S60F1020 with VCCINT + 4 VCCIO banks is approximately 8-12 W. Provide a switch-mode regulator with 1.5V/3A capability for VCCINT, plus separate LDO regulators for each VCCIO bank (1.5V/1.8V/2.5V/3.3V) to allow independent shutdown sequencing. Use Altera's PowerPlay early-power-estimator spreadsheet to refine the budget for your design.
Three common pitfalls when designing with the EP1S60F1020: (1) the Stratix SRAM configuration bitstream is volatile, so an external configuration device (EPC16 / EPC64) is mandatory for production - do not rely on JTAG-only configuration in the field; (2) the base part EP1S60F1020 without a C6/I6/C7/I7 suffix is rarely stocked and frequently ambiguous - always order an explicit C6 or I6 suffix to avoid logistics confusion; (3) Quartus-II software must match the device variant (the bitstream is variant-specific) - generating a C6 bitstream will not run on an I6 silicon even though the pinout is identical.
Configure the 12 PLLs with conservative loop-bandwidth settings (1-3 MHz) to minimize reference-clock spurs. When using external DDR/DDR2 SDRAM controllers, route the byte lanes with matched length (+/-25 mil) and place the address/control traces on a different layer to reduce crosstalk. Enable I/O delay chains for source-synchronous interfaces (LVDS, SSTL) and verify timing closure with TimeQuest timing analyzer at the -6 speed grade corner. Leave one global clock network and 1-2 unused PLL outputs for design ECO flexibility.
Compliance Information
Lead-free/RoHS status depends on the suffix letter: 'N' suffix (e.g. EP1S60F1020C6N, EP1S60F1020I6N) indicates lead-free/RoHS compliant per Altera/Intel nomenclature. Base part EP1S60F1020 has no explicit compliance suffix. AEC-Q100 is not applicable (FPGA, not automotive-grade IC). Conflict-mineral compliance status was not present in the verified web data.
