EP1S60F1020I6GB - Stratix FPGA 57K LE, 1020-BGA, Industrial | Intel (Altera)
MPN: EP1S60F1020I6GB ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5413.87 | $5,413.87 |
| 10 | $5150 | $51,500.00 |
| 50 | $4900 | $245,000.00 |
| 100 | $4650 | $465,000.00 |
| 500 | $4200 | $2,100,000.00 |
Drop-in alternatives for EP1S60F1020I6GB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1S60F1020I6GB Maximum Ratings & Electrical Characteristics
| Family | Stratix (First-generation) |
| Logic Elements | 57,120 |
| Approximate Logic Array Blocks | 6,570 |
| Embedded Memory Bits | 5,215,104 |
| Maximum User I/O | 773 |
| Package | 1020-ball FCBGA (33 x 33 mm, 1.0 mm pitch) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +100C (industrial, I6 grade) |
| Supply Voltage | Multi-rail (core 1.5 V, I/O 1.5/1.8/2.5/3.3 V per bank) |
| Process Technology | 0.13 µm CMOS |
| DSP Blocks | Yes (9 x 9 multipliers with 36-bit accumulators) |
| PLLs | Yes (multiple, for clock management) |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG |
| MSL Level | 3 (168 hours, JEDEC J-STD-020) |
| RoHS Status | Compliant (GB suffix) |
| Lead-Free | Yes |
EP1S60F1020I6GB 1020-ball fcbga (33 x 33 mm, 1.0 mm pitch) Pin Configuration Guide
Complete pinout information for EP1S60F1020I6GB (1020-ball fcbga (33 x 33 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S60F1020I6GB.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S60F1020I6GB is suitable for 7 applications: Telecommunications Baseband Processing, ASIC Prototyping and Emulation, High-Speed Data Acquisition Front-End, Networking Switch Fabric and Line Cards, Industrial Motion Control and Servo Drives, Medical Imaging Pipeline Acceleration, Aerospace and Avionics Data Processing.
Telecommunications Baseband Processing
The EP1S60F1020I6GB's 57,120 logic elements and 5.2 Mbit embedded memory are well-matched to WCDMA and LTE baseband channel cards. Its DSP blocks implement 9 x 9 multipliers with 36-bit accumulators that fit the multiply-accumulate pipelines of chip-rate processing, scrambling, and Viterbi decoding without offloading to external DSP chips. The 1020-ball FCBGA's 773 user I/O exposes parallel ADC/DAC buses and CPRI/OBSAI links to RFICs, while PLLs drive the multi-rate baseband clock tree. Compared with a software-only DSP, the EP1S60F1020I6GB delivers deterministic sub-microsecond latency critical for closed-loop power control. Industrial I6 grade makes it suitable for outdoor macro-cell base stations where ambient air exceeds 85C.
Recommended
ASIC Prototyping and Emulation
Engineers use the EP1S60F1020I6GB as an ASIC prototyping vehicle because its high LE count, embedded TriMatrix memory, and dedicated DSP blocks approximate ASIC IP cores before tape-out. The 1020-ball FCBGA exposes abundant user I/O for prototyping ASIC pads including DDR SDRAM controllers, multi-channel DMA, and external bus interfaces, while industrial temperature lets the same board move from lab validation to field trial. Quartus II's incremental compilation partitions the ASIC RTL into Stratix design partitions that match the ASIC clock and pin timing. Compared with later Stratix II/V/10 families, the original Stratix suffices for ASICs of approximately 1M gates and below.
Recommended
High-Speed Data Acquisition Front-End
The EP1S60F1020I6GB pairs naturally with high-speed ADCs and DACs in data acquisition systems such as oscilloscopes, radar digitizers, and medical imaging front-ends. With 5.2 Mbit of on-chip memory it can buffer long ADC captures (16-bit samples at 200 MSPS for several milliseconds) without offloading to DDR, reducing FPGA-to-memory bandwidth pressure. LVDS-capable I/O banks interface directly to high-speed serial ADCs, while embedded DSP blocks perform real-time FFTs, channelization, and decimation. Industrial temperature operation permits the acquisition board to sit in chassis near hot RF front-ends without active cooling, reducing overall system cost.
Recommended
Networking Switch Fabric and Line Cards
In Ethernet switch fabric line cards the EP1S60F1020I6GB implements custom packet classification, deep queue management, and QoS scheduling. Its abundant I/O supports multiple SGMII/SERDES links to PHY chips, while on-chip TriMatrix memory provides large packet buffers and lookup tables. Compared with merchant network processors, the FPGA achieves deterministic latency for cut-through forwarding at 10 Gbps aggregate. Industrial temperature and lead-free packaging make the EP1S60F1020I6GB suitable for ruggedized networking equipment in industrial and outdoor telecom cabinets.
Recommended
Industrial Motion Control and Servo Drives
Servo and motion controllers use the EP1S60F1020I6GB for multi-axis control loops because its DSP blocks and high LE count support floating-point-equivalent fixed-point PI/PID loops at sub-microsecond rates. Industrial temperature (-40C to +100C) and GB lead-free finish match the harsh cabinet environment of machine tools, where ambient air near drives regularly exceeds 70C. The 1020-ball FCBGA's 773 user I/O supports multi-axis encoder feedback, PWM outputs to power stages, and EtherCAT/PROFIBUS connectivity. The legacy Stratix architecture remains supported by long-life industrial vendors who standardize on Altera tools.
Recommended
Medical Imaging Pipeline Acceleration
Ultrasound beamformers and MRI reconstruction engines use the EP1S60F1020I6GB for parallel channel processing: the 57,120 LEs handle 64-128 channels of digital down-conversion and beamforming in a single FPGA, while DSP blocks compute complex multiplications and accumulators at high speed. With 5.2 Mbit embedded memory, the part can buffer beamformed samples across an entire cardiac cycle before scan conversion. Industrial temperature permits the imaging PCB to sit inside the scanner chassis near gradient amplifiers without dedicated cooling. Compared with GPU acceleration, the FPGA gives deterministic real-time performance critical for live imaging.
Recommended
Aerospace and Avionics Data Processing
Although not formally DO-254 qualified, the EP1S60F1020I6GB has been used in non-flight-critical avionics subsystems such as data concentrators, flight-data recorders, and IFE video pipelines. Industrial temperature and high logic density suit avionics bays where ambient air reaches 90C and where deterministic FPGA latency is preferred over CPUs for safety-critical I/O. Embedded TriMatrix memory stores configuration and lookup tables; the 1020-ball FCBGA footprint provides ample I/O for ARINC 429, MIL-STD-1553, and Ethernet buses. Designers should verify DO-254 compliance and consider dedicated MIL/Aero Altera variants when available.
Recommended
Recommended Products Summary
Engineering reference data for EP1S60F1020I6GB — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S60F1020C7N | EP1S60F1020C6N | EP1S60F1020C5N | EP1S60F1020C7 | EP1S60F1020C6 | EP1S40F1020I6 |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1020-ball FCBGA (33x33 mm, 1.0 mm pitch) | 1020-ball FCBGA - same | 1020-ball FCBGA - same | 1020-ball FCBGA - same | 1020-ball FCBGA - same | 1020-ball FCBGA - same | 1020-ball FCBGA - same |
| Logic Elements | 57,120 | 57,120 | 57,120 | 57,120 | 57,120 | 57,120 | 41,250 (-28%) |
| Embedded Memory Bits | 5,215,104 | 5,215,104 | 5,215,104 | 5,215,104 | 5,215,104 | 5,215,104 | 3,423,744 (-34%) |
| User I/O | 773 | 773 | 773 | 773 | 773 | 773 | [DATA_NEEDED] |
| Temperature Grade | Industrial (-40C to +100C, I6) | Commercial (0C to +85C, C7) | Commercial (0C to +85C, C6) | Commercial (0C to +85C, C5) | Commercial (0C to +85C, C7) | Commercial (0C to +85C, C6) | Industrial (-40C to +100C, I6) |
| Speed Grade | I6 (industrial) | C7 (faster) | C6 | C5 (slower) | C7 (faster) | C6 | I6 (industrial) |
| Lead-Free / RoHS | Yes (GB suffix) | Yes | Yes | Yes | Yes | Yes | Varies |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Industrial temperature grade with RoHS-compliant GB finish (vs EP1S60F1020C7N)
- Same silicon density and resources as the entire Stratix EP1S60 family (vs EP1S40F1020I6)
- Single die covers entire 1020-ball FCBGA (vs EP1S60F1020C7)
Design Notes
Estimated: at typical Stratix EP1S60 power dissipation of 4-6 W in the 1020-ball FCBGA with theta_JA of approximately 8-10 C/W on a 6-layer PCB with 1 oz copper, the junction will rise 32-60 C above ambient. Provide continuous thermal copper under the BGA with thermal vias to internal ground planes. Industrial I6 grade permits junction up to 100 C, so at 70 C ambient the design margin is tight; add airflow or attach a heatsink if your design exceeds 4 W worst-case dynamic power.
The 1020-ball FCBGA at 1.0 mm pitch requires 6 or more PCB layers with microvias (0.1 mm or smaller) for fan-out escape. Use Intel/Altera's Stratix BGA escape guidelines in the device handbook: ball-to-pad fan-out on top layer, via-in-pad not required but staggered microvias improve yield. Place 0.1 uF X7R decoupling capacitors on every VCC/VCCIO/VCCPD ball group, with at least one bulk capacitor (10-22 uF) per supply plane. Route differential pairs (LVDS) with controlled 100 ohm impedance.
The EP1S60F1020I6GB requires multiple sequenced supply rails (VCCINT 1.5 V core, VCCIO 1.5-3.3 V per I/O bank, VCCPD 3.3 V pre-driver, VCCA_PLL analog, VCCBAT battery). Sequence VCCINT first, then VCCPD, then VCCIO per Altera's Power-Up Sequencing recommendation. Use a multi-rail controller with PG (Power Good) feedback. During power-down, de-sequence in reverse order. Place a Schottky diode on VCCBAT to permit retention of configuration RAM during brief VCCINT dropouts.
Do not attempt to program EP1S60 bitstreams into EP1S40 silicon: although both share the same 1020-ball FCBGA, the EP1S40 has approximately 28% fewer logic elements and the bitstream will not load. Verify the bitstream target device ID before configuration. Also note that the I6 suffix denotes industrial temperature (-40C to +100C) while C5/C6/C7 denote commercial (0C to +85C) - do not substitute industrial for commercial where thermal margin is critical.
Distribute clocks using dedicated global clock networks driven by the EP1S60 PLL outputs, not general-purpose routing. Place JTAG pins (TCK, TMS, TDI, TDO, TRST) on dedicated board test points for in-system programming access. Route configuration signals (DATA, DCLK, nCONFIG, nSTATUS, CONF_DONE) with short, well-matched tracks to support up to 100 MHz Fast Passive Parallel configuration. Respect I/O bank VCCIO constraints: LVDS receivers must share a bank with 2.5 V VCCIO.
Compliance Information
RoHS and lead-free per the GB suffix in the part number (compliant with the original EU RoHS directive). AEC-Q100 not applicable - FPGAs are not automotive-grade qualified per industry convention; no AEC-Q100 variant of Stratix exists. Halogen-free status not stated in the provided data - marked unknown. Conflict-minerals declaration status: per Intel/Altera standard product compliance policy.
