EP1SGX40DF1020C7ES - Stratix GX FPGA, 41.25K Cells, FBGA-1020 | Altera
MPN: EP1SGX40DF1020C7ES ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1725 | $17,250.00 |
| 100 | $1580 | $158,000.00 |
| 500 | $1450 | $725,000.00 |
| 1,000 | $1325 | $1,325,000.00 |
Drop-in alternatives for EP1SGX40DF1020C7ES — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP1SGX40DF1020C7
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View Datasheet →EP1SGX40DF1020C5ES
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View Datasheet →EP1SGX40DF1020C6
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View Datasheet →EP1SGX40CF1020I5
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View Datasheet →EP1SGX40DF1020C7ES Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Logic Elements | 41,250 |
| Logic Family | CMOS |
| Process Technology | 130 nm |
| Supply Voltage | 1.5 V (core) |
| Package | FBGA-1020 (33 x 33 mm, 1.0 mm pitch) |
| Terminal Form | Ball |
| Package Shape | Square |
| Number of Pins/Terminals | 1020 |
| Operating Temperature | 0 C to 85 C (32 F to 185 F) |
| Temperature Grade | Commercial (speed grade C7) |
| Mounting Type | Surface Mount (BGA) |
| Combinatorial Delay | 9.48 ns per CLB |
| Maximum Clock Frequency | 4385.97 MHz (internal) |
| Manufacturer | Altera (now Intel PSG) |
EP1SGX40DF1020C7ES square Pin Configuration Guide
Complete pinout information for EP1SGX40DF1020C7ES (square package) with 1020 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX40DF1020C7ES.
Refer to the datasheet for full pin configuration.
Estimated pin count: 1020 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX40DF1020C7ES is suitable for 6 applications: Broadband Line-Card Backplane Aggregation, SONET/SDH Framer and Mapper ASIC Replacement, Military Secure Communications, High-Performance ASIC Prototyping, Image and Video Processing Pipelines, Industrial Test and Measurement Instrumentation.
Broadband Line-Card Backplane Aggregation
The EP1SGX40DF1020C7ES is well suited to broadband line-card backplane aggregation because its 41,250 logic elements and integrated MultiTrack interconnect can implement multiple SERDES channels, framer/mapper logic, and traffic-manager datapaths on a single device. Its built-in high-speed serial transceivers support protocols such as Serial RapidIO, SPI-4.2, and proprietary backplane fabrics at multi-gigabit line rates, eliminating external PHY components and reducing BOM cost. The FBGA-1020 package exposes the full pin count required for several parallel external memory interfaces (DDR, QDR) alongside the serial links. Performance consideration: at 0.85 V core and 1.5 V supply rails, board designers must allocate a substantial power plane and thermal dissipation area, as the 33 x 33 mm package dissipates noticeably more power than smaller BGA options.
Recommended
SONET/SDH Framer and Mapper ASIC Replacement
The EP1SGX40DF1020C7ES excels in SONET/SDH framer and mapper ASIC replacement designs where the Stratix GX SERDES channels replace dedicated serializer/deserializer chips and the 41,250 LEs implement pointer-processing, payload mapping, and overhead insertion. Embedded TriMatrix memory blocks provide the wide bus structures needed for STS/AU cross-connect tables without consuming logic resources. Compared with discrete ASIC plus FPGA designs, the integrated platform reduces board area, BOM, and qualification effort. The 130 nm process and C7 speed grade give deterministic routing delays critical for jitter budgets in telecom line cards, while the 1020-ball BGA preserves all I/O for tributary interfaces.
Recommended
Military Secure Communications
The EP1SGX40DF1020C7ES is used in military secure-communications platforms because its high logic density supports bulk encryption, protocol wrapping, and signal-processing in a single device, while the integrated SERDES channels interface with tactical radio links and fiber-optic network backbones. The 130 nm CMOS process and commercial temperature range are commonly accepted for ruggedized enclosures with thermal management. Performance consideration: military programs typically require long lifecycle support, so engineers should pair the EP1SGX40 with Altera's extended-lifecycle program and verify NRND timelines. The 1020-ball FBGA footprint supports cryptographic accelerator co-processors and secure key-store memory on shared address/data buses.
Recommended
High-Performance ASIC Prototyping
The EP1SGX40DF1020C7ES serves as a high-performance ASIC prototyping vehicle for complex SoC designs targeting wireline or signal-processing applications. The 41,250 logic elements, embedded memory, and DSP blocks approximate a mid-density ASIC gate count, while the MultiTrack interconnect preserves timing semantics during RTL bring-up. Engineers map multiple clock domains and observe real-world timing closure before committing to mask sets, saving NRE cost on respins. Performance consideration: the FBGA-1020 package and 1.5 V core rail demand a multilayer PCB with split power planes and impedance-controlled SERDES routing, but this matches production ASIC package conventions, easing migration.
Recommended
Image and Video Processing Pipelines
The EP1SGX40DF1020C7ES handles real-time image and video processing pipelines by dedicating DSP blocks to filter kernels, motion estimation, and color-space conversion while logic elements manage line buffers and DMA controllers. Its embedded memory provides the large contiguous buffers needed for HD video line-store and frame-store without external SRAM. The high pin count of FBGA-1020 supports multiple parallel camera interfaces (LVDS, sub-LVDS, HiSPi) plus DDR2/QDR memory channels. Performance consideration: at typical 200-300 MHz fabric speeds, the EP1SGX40 sustains multi-channel HD-SDI processing; the C7 speed grade provides timing margin for critical datapath loops.
Recommended
Industrial Test and Measurement Instrumentation
The EP1SGX40DF1020C7ES fits industrial test and measurement instrumentation such as protocol analyzers, BERT testers, and high-speed digitizers because the integrated SERDES captures and replays multi-gigabit signals with deterministic latency. The 41,250 LEs implement protocol decoding, pattern generation, and statistical analysis logic, while embedded memory stores captured trace data. The commercial 0-85 C operating range is acceptable for bench and lab instruments with controlled thermal environments. Performance consideration: the FBGA-1020 package and high pin count enable front-panel display, USB, Ethernet, and parallel test-head interfaces on the same device, simplifying instrument architecture and reducing cost of ownership.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX40DF1020C7ES — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX40DF1020C7 | EP1SGX40DF1020C6ES | EP1SGX40DF1020C5ES | EP1SGX40DF1020C6 | EP1SGX40CF1020I5 | EP1SGX40CF672I5 |
|---|---|---|---|---|---|---|---|
| Package | FBGA-1020 (33 x 33 mm) | FBGA-1020 - same | FBGA-1020 - same | FBGA-1020 - same | FBGA-1020 - same | FBGA-1020 - same | FBGA-672 - different |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Family | Stratix GX | Stratix GX | Stratix GX | Stratix GX | Stratix GX | Stratix GX | Stratix GX |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 |
| Speed Grade | C7 | C7 | C6 | C5 | C6 | I5 | I5 |
| Operating Temperature | 0 to 85 C | 0 to 85 C | 0 to 85 C | 0 to 85 C | 0 to 85 C | -40 to 100 C (industrial) | -40 to 100 C (industrial) |
| Pinout Variant | DF (enhanced differential/serial) | DF | DF | DF | DF | CF (conventional) | CF (conventional) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Highest speed grade available in the EP1SGX40 family (vs EP1SGX40DF1020C5ES)
- DF pinout exposes maximum SERDES channel count (vs EP1SGX40CF1020I5)
- Engineering-sample marking availability (vs EP1SGX40DF1020C7)
Design Notes
The FBGA-1020 package uses a 1.0 mm ball pitch and a 33 x 33 mm body, which requires a multilayer PCB with microvia (laser-drilled) technology. Stack-up should include dedicated ground and power planes beneath the device; surface traces cannot cross the BGA field without escaping to inner layers. Use a 1-2-1 or 1-2-1-2-1 microvia stack-up for signal escape, and verify via-in-pad plating per IPC-6012 Class 3 for high-reliability programs.
SERDES channels require 100-ohm differential routing with intra-pair skew under 1 ps and length matching to within 5 mils across all lanes. Use stripline geometry between continuous reference planes and avoid routing over plane splits. AC-coupling capacitors (typically 100 nF) must be placed close to each transmitter with short, symmetrical stubs to maintain return loss across the operating band.
Estimated: a fully-utilized Stratix GX EP1SGX40 dissipates between 8 W and 15 W depending on toggle rate and SERDES utilization. With a typical theta-JA of 14-18 C/W for the FBGA-1020 package, junction temperature can reach 100-150 C above ambient without thermal management. A thermal pad connected to an internal copper plane and forced airflow (>= 200 LFM) is required for sustained operation; consult the Stratix GX thermal model for board-specific derating curves.
Do not confuse the DF1020 package (enhanced differential pinout for high-speed serial channels) with the CF1020 package (conventional pinout for parallel-intensive designs). The two share the same BGA ball count but have different ball-map assignments; routing a board for one variant and populating the other will produce non-functional hardware. Confirm the package suffix carefully against the design's pin assignment file before PCB fabrication.
Decouple every power pin (VCCINT, VCCIO, VCCAUX, VCC_PLL) with a 0.1 uF X7R ceramic capacitor placed within 100 mils of the BGA ball, plus bulk capacitors (10-22 uF tantalum or polymer) on each supply rail. The Stratix GX family requires power-on sequencing (VCCINT before VCCIO) to prevent latch-up; use a power supervisor with sequenced enable outputs to enforce the correct order.
Compliance Information
RoHS, REACH, lead-free, and halogen-free status were not present in the verified web data and are marked unknown. AEC-Q100 is not applicable for FPGAs (automotive qualification is typically tracked under a separate Altera/Intel automotive grade program). Conflict-minerals compliance assumed per Altera corporate policy.
