EP1SGX40GF1020C7ES - Stratix GX FPGA, 41.25K LE, FBGA-1020 | Altera
MPN: EP1SGX40GF1020C7ES ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1750 | $17,500.00 |
| 25 | $1650 | $41,250.00 |
| 100 | $1480 | $148,000.00 |
| 500 | $1320 | $660,000.00 |
Drop-in alternatives for EP1SGX40GF1020C7ES — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1SGX40GF1020C7
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View Datasheet →EP1SGX40FF1020C7
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View Datasheet →EP1SGX40DF1020C7
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View Datasheet →EP1SGX40DF1020C7ES
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View Datasheet →EP1SGX40DF1020C7N
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View Datasheet →EP1SGX40GF1020C7ES Maximum Ratings & Electrical Characteristics
| Manufacturer | Altera (now Intel) |
| Family | Stratix GX |
| Series | EP1SGX40 |
| Logic Elements (LE) | 41,250 |
| Process Technology | 130 nm CMOS |
| Supply Voltage | 1.5 V |
| Embedded Memory | 3,744 Kbit |
| Number of Transceiver Channels | 4 |
| Transceiver Data Rate | 500 Mbps to 3.1875 Gbps |
| Total Serial Bandwidth | Up to 12.75 Gbps full-duplex |
| User I/O Pins | 624 |
| Package Type | FC-FBGA (FineLine Ball Grid Array) |
| Pin/Ball Count | 1020 |
| Package Dimensions | 33 mm × 33 mm |
| Ball Pitch | 1.00 mm |
| Operating Temperature | 0 °C to +85 °C (commercial) |
| RoHS Status | Compliant |
| Logic Family | CMOS |
EP1SGX40GF1020C7ES 33 mm × 33 mm Pin Configuration Guide
Complete pinout information for EP1SGX40GF1020C7ES (33 mm × 33 mm package) with 624 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX40GF1020C7ES.
Refer to the datasheet for full pin configuration.
Estimated pin count: 624 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX40GF1020C7ES is suitable for 6 applications: Multi-Gigabit Serial Backplane, PCI Express Endpoint / Root Complex, SONET/SDH Framer Equipment, Custom Protocol Bridge / ASIC Prototype, High-Speed Data Acquisition System, Industrial Imaging and Video Processing.
Multi-Gigabit Serial Backplane
The EP1SGX40GF1020C7ES is a strong fit for multi-gigabit serial backplane designs because its 4 embedded CDR-based transceiver channels operate full-duplex from 500 Mbps to 3.1875 Gbps, providing up to 12.75 Gbps of aggregate serial bandwidth per device. The 1020-ball FBGA package and 624 user I/O pins allow designers to implement full custom PCS logic alongside the on-chip PCS/PMA blocks. In a typical backplane application, the FPGA sits on a line card and bridges custom ASIC logic to XAUI, Serial RapidIO, or proprietary 8b/10b-encoded lanes; the 41,250 logic elements are sufficient to absorb link-layer encapsulation, buffer management, and forward-error-correction logic. PCB layout must use matched-length differential pairs on the transceiver balls with a continuous ground reference plane.
Recommended
PCI Express Endpoint / Root Complex
The EP1SGX40GF1020C7ES supports PCI Express Gen1 (2.5 Gbps) endpoints and root-complex designs via its embedded transceivers and Altera-provided PCIe hard IP core. Each transceiver channel locks to the 2.5 Gbps PCIe rate with no external SerDes required, and the 41,250 logic elements plus 3,744 Kbit of TriMatrix memory are sufficient to implement transaction layer, data link layer, and a meaningful application layer. The 1020-ball FBGA package allows 624 user I/O pins for card-edge connectivity, board management controllers, and sideband signals. Designers should validate reference-clock jitter against the PCIe CEM specification and follow Altera's Stratix GX PCIe Hardware Implementation Guide.
Recommended
SONET/SDH Framer Equipment
Telecom framer and mapper equipment targeting OC-48/STM-16 (2.488 Gbps) line rates benefits from the EP1SGX40GF1020C7ES transceiver fabric because each channel locks to the SONET line rate directly. The 41,250 logic elements can host framer/mapper state machines, pointer-processing engines, and overhead extraction logic, while the 3,744 Kbit of TriMatrix memory acts as the framer's payload buffer. The commercial 0 °C to +85 °C operating range is acceptable for central-office equipment housed in climate-controlled enclosures. Designers should route the recovered clock output to the line-side jitter attenuator and follow Altera's SONET reference design for jitter compliance.
Recommended
Custom Protocol Bridge / ASIC Prototype
The EP1SGX40GF1020C7ES is widely deployed as an ASIC prototype vehicle and as a production bridge between mismatched serial protocols (for example, Serial RapidIO to Gigabit Ethernet, or XAUI to proprietary backplane). The 4 transceiver channels can be configured as two independent protocol bridges simultaneously, and the 41,250 logic elements implement the full translation state machine plus payload buffering. The 1020-ball FBGA keeps the prototype and production designs on the same PCB, allowing engineers to validate firmware against real silicon before committing to an ASIC tape-out.
Recommended
High-Speed Data Acquisition System
In high-speed data acquisition systems, the EP1SGX40GF1020C7ES serves as the digital back-end that aggregates multiple LVDS or serial data streams from front-end ADCs and routes them to host processors. The 4 transceiver channels can ingest Aurora or proprietary serial links from remote ADCs at up to 3.1875 Gbps each, and the 41,250 logic elements perform decimation, triggering, and packetization. The 624 user I/O pins support parallel LVDS interfaces to legacy front-ends as well as memory bus interfaces to external DDR or QDR SRAM. Designers should pay attention to the I/O bank VCCIO voltage (typically 3.3 V) when mixing LVDS and LVCMOS signalling on the same bank.
Recommended
Industrial Imaging and Video Processing
The EP1SGX40GF1020C7ES is also deployed in industrial imaging platforms where Camera Link, CoaXPress, or proprietary gigabit serial interfaces feed the FPGA. The transceiver fabric receives high-speed pixel data, while the DSP blocks and TriMatrix memory implement image processing pipelines such as Bayer demosaicing, color correction, and compression. The 41,250 logic elements are well matched to multi-stream HD video processing, and the 1020-ball FBGA supports the wide parallel buses needed to drive external DDR2 memory for frame buffers. Industrial designers should validate against the commercial 0-85 °C operating range or migrate to an I-grade variant for harsh environments.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX40GF1020C7ES — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX40GF1020C7 | EP1SGX40FF1020C7 | EP1SGX40DF1020C7 | EP1SGX40DF1020C7ES | EP1SGX40DF1020C7N |
|---|---|---|---|---|---|---|
| Package | FC-FBGA-1020 (33×33 mm, 1.00 mm pitch) | FC-FBGA-1020 (same) | FC-FBGA-1020 (same) | FC-FBGA-1020 (same) | FC-FBGA-1020 (same) | FC-FBGA-1020 (same) |
| Brand | Altera (now Intel) | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 |
| Transceiver Channels | 4 | 4 | 4 | 4 | 4 | 4 |
| Transceiver Data Rate (per channel) | 500 Mbps – 3.1875 Gbps | 500 Mbps – 3.1875 Gbps | 500 Mbps – 3.1875 Gbps | 500 Mbps – 3.1875 Gbps | 500 Mbps – 3.1875 Gbps | 500 Mbps – 3.1875 Gbps |
| Embedded Memory (Kbit) | 3,744 | 3,744 | 3,744 | 3,744 | 3,744 | 3,744 |
| User I/O Pins | 624 | 624 | 624 | 624 | 624 | 624 |
| Supply Voltage (core) | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0 °C to +85 °C (commercial) | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C |
Key Differentiators
- ES packaging suffix matches C7 silicon exactly (vs EP1SGX40GF1020C7)
- All listed alternatives share the same FC-FBGA-1020 footprint (vs EP1SGX40FF1020C7 / EP1SGX40DF1020C7)
- Stratix GX is the only Altera family with this FBGA-1020 + 4-channel transceiver combination at 41,250 LE (vs EP1S80F1020C7 (Stratix, non-GX))
Design Notes
The 1020-ball FBGA package on a 1.00 mm pitch requires microvia or via-in-pad PCB technology to fan out cleanly. Use a 4-layer or 6-layer stack-up with a continuous ground reference plane directly beneath the package to control impedance for the high-speed transceiver balls. Match differential pair lengths to within 150 µm for 3.125 Gbps operation and route the transceiver balls on the outermost signal layers to minimize via stubs.
Provide a clean 1.5 V core supply with a peak current of approximately 4-6 A depending on utilization and transceiver activity. Decouple each power pin with 0.1 µF and 10 µF ceramic capacitors placed as close as possible to the balls. Use separate regulator rails for VCCINT (1.5 V core), VCCIO (per-bank I/O voltage), and VCCA_PLL/VCCCH_PLL for transceiver analog supplies to minimize jitter coupling from switching logic into the CDR circuitry.
Although the 33×33 mm FBGA offers a relatively large thermal pad, sustained high transceiver utilization (4 channels at 3.1875 Gbps simultaneously) can drive junction temperatures up. Reference the Stratix GX Device Family Data Sheet thermal table and apply sufficient airflow (typically 200 LFM minimum) when operating at full transceiver bandwidth. Estimated: at 4×3.1875 Gbps full-duplex with 90% logic utilization, expect approximately 8-10 W device dissipation; verify with the Altera PowerPlay Early Power Estimator before mechanical design freeze.
Compliance Information
RoHS compliance and Pb-free reflow per JEDEC J-STD-020 confirmed by Altera product declaration for the EP1SGX40 family. REACH, halogen-free, and conflict-minerals statements should be requested from the authorized distributor at the time of order. AEC-Q100 is not applicable for an FPGA in this package.
