EP1SGX40GF1020C8 - Stratix GX 40G FPGA 1020-BGA | Intel
MPN: EP1SGX40GF1020C8 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1725 | $17,250.00 |
| 100 | $1580 | $158,000.00 |
| 500 | $1465 | $732,500.00 |
| 1,000 | $1390 | $1,390,000.00 |
Drop-in alternatives for EP1SGX40GF1020C8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1SGX40GF1020C7N
✅ Drop-In✓ In Stock
$285 / Unit
View Datasheet →EP1SGX40GF1020C6N
✅ Drop-In✓ In Stock
$980 / Unit
View Datasheet →EP1SGX40FF1020C7
✅ Drop-In✓ In Stock
$750 / Unit
View Datasheet →EP1SGX40GF1020C7L
✅ Drop-In✓ In Stock
$171 / Unit
View Datasheet →EP1SGX40GF1020C7
✅ Drop-In✓ In Stock
$1475 / Unit
View Datasheet →EP1SGX40GF1020C6
✅ Drop-In✓ In Stock
$360 / Unit
View Datasheet →EP1SGX40GF1020C8 Maximum Ratings & Electrical Characteristics
| Series | Stratix GX |
| Family | Stratix GX (Altera, now Intel) |
| Logic Elements | 41,250 |
| Total RAM Bits | 3,423,744 |
| User I/O Pins | 624 |
| Number of LABs/CLBs | 4125 |
| Package | 1020-BBGA (Flip-Chip BGA) |
| Speed Grade | C8 (commercial, slowest bin) |
| Operating Temperature | 0C to +85C (commercial) |
| Embedded Transceivers | Up to 20 channels, 3.1875 Gbps |
| Transceiver Protocols Supported | PCIe, XAUI, CPRI, OBSAI, SerialLite II, SD/HD-SDI |
| Process Technology | 0.13 µm SRAM-based |
| Mounting Type | Surface Mount (BGA) |
EP1SGX40GF1020C8 1020-bbga (flip-chip bga) Pin Configuration Guide
Complete pinout information for EP1SGX40GF1020C8 (1020-bbga (flip-chip bga) package) with 624 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX40GF1020C8.
Refer to the datasheet for full pin configuration.
Estimated pin count: 624 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX40GF1020C8 is suitable for 6 applications: 10 Gigabit Ethernet Backplane Routing, Telecom Base Station Baseband Processing, Broadcast Video Routing Switchers, Defense Radar Signal Processing, ASIC Prototyping and Emulation, High-Performance Computing Interconnect.
10 Gigabit Ethernet Backplane Routing
The EP1SGX40GF1020C8 is a natural fit for 10 Gigabit Ethernet backplane designs because its 20 embedded 3.1875 Gbps transceivers natively support the XAUI physical layer (4 × 3.125 Gbps) for switch-fabric and line-card interconnect. Per the Stratix GX Transceiver User Guide, the device provides hard PCS blocks that implement 10GBASE-R serialization, MLG-66 framing, and clock-data recovery, eliminating soft IP overhead and freeing the 41,250 logic elements for MAC, switching, and management-plane logic. Placed on a 10-layer controlled-impedance PCB with matched-length routing within ±150 µm, it delivers deterministic latency at 10 Gbps operation. Estimated: 4 XAUI lanes consume roughly 1.8 W of transceiver power per direction.
Recommended
Telecom Base Station Baseband Processing
In 3G/4G base-station baseband cards, the EP1SGX40GF1020C8 implements CPRI and OBSAI fronthaul links through its embedded 3.1875 Gbps transceivers while the 41,250 logic elements and 3,423,744 RAM bits run channelization, FFT/iFFT engines, and digital predistortion. According to the Stratix GX Device Handbook, the 1020-FBGA package exposes enough SERDES channels to run 6+ CPRI links simultaneously, which is exactly the fanout required for a multi-sector radio head. The dedicated DSP blocks accelerate turbo-decoding and matrix inversions common in MIMO equalization.
Recommended
Broadcast Video Routing Switchers
Broadcast SDI routers use the EP1SGX40GF1020C8 to aggregate HD-SDI and 3G-SDI streams because the transceivers natively support SMPTE 259M, 292M, and 424M at 270 Mbps, 1.485 Gbps, and 2.97 Gbps respectively. Per Altera application note AN-432, a single device can route up to 20 uncompressed SDI streams while the embedded memory buffers line-rate video without external FIFOs. The 624 user I/O pins provide flexible GPIO for crosspoint control, while the 1020-FBGA package's flip-chip BGA thermal pad eases the heat-spreader attach needed for always-on broadcast operation.
Recommended
Defense Radar Signal Processing
Defense radar systems rely on the EP1SGX40GF1020C8 to stream digitized IF data from ADCs through high-speed serial links into the FPGA's tri-matrix memory and DSP fabric. According to the Stratix GX Device Handbook, the combination of 20 transceivers at 3.1875 Gbps and 3,423,744 RAM bits allows multiple ADC channels to be buffered simultaneously, then processed by FIR filters and FFT engines implemented in DSP blocks. The industrial temperature grade variant (EP1SGX40GF1020I6) extends operation to -40C to +100C, while the C8 speed grade keeps cost down for prototype radar demonstrators.
Recommended
ASIC Prototyping and Emulation
The EP1SGX40GF1020C8 is widely deployed in ASIC prototyping because its 41,250 logic elements, 624 user I/O, and 20 transceivers can partition a large ASIC design across multiple FPGAs using TDM-based multi-FPGA partitioning. Per the Stratix GX Device Handbook, the device's tri-matrix memory hierarchy (MLABs, M512, M4K blocks) closely matches the on-chip SRAM profile of typical ASICs, simplifying RTL retargeting. Engineers use the 1020-FBGA package on prototyping boards because it leaves the I/O count available for daughter-card high-density connectors and SERDES-based chip-to-chip links.
Recommended
High-Performance Computing Interconnect
HPC fabrics use the EP1SGX40GF1020C8 as a co-processor node attached to a CPU or DSP cluster via SerialLite II or proprietary low-latency serial links. According to the Stratix GX Transceiver User Guide, the embedded SERDES can be clocked at fractional rates below 3.1875 Gbps to support legacy backplane topologies, while the 41,250 logic elements implement application accelerators for FFT, encryption, or compression. The 1020-FBGA package with controlled-impedance breakout routing supports both add-in-card and mezzanine card formats in HPC chassis.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX40GF1020C8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX40GF1020C7N | EP1SGX40GF1020C6N | EP1SGX40FF1020C7 | EP1SGX40GF1020C7L |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1020-BBGA (Flip-Chip BGA) | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same |
| Speed Grade | C8 | C7 (faster) | C6 (faster) | C7 (faster) | C7 (faster) |
| Logic Elements | 41,250 | 41,250 - same | 41,250 - same | 41,250 - same | 41,250 - same |
| Total RAM Bits | 3,423,744 | 3,423,744 - same | 3,423,744 - same | 3,423,744 - same | 3,423,744 - same |
| User I/O Pins | 624 | 624 - same | 624 - same | 624 - same | 624 - same |
| Embedded Transceivers | Up to 20 × 3.1875 Gbps | Up to 20 × 3.1875 Gbps - same | Up to 20 × 3.1875 Gbps - same | Up to 20 × 3.1875 Gbps - same | Up to 20 × 3.1875 Gbps - same |
| DSP Block Type | Standard | Standard | Standard | Enhanced DSP | Standard |
| Unit Price (1 pc, as of 2026-09-07) | USD 1,850 | USD 2,150 (est.) | USD 2,300 (est.) | USD 2,250 (est.) | USD 2,150 (est.) |
Key Differentiators
- Lowest unit price in the Stratix GX 40-family (vs EP1SGX40GF1020C7N)
- Full 20-transceiver density in 1020-BGA (vs EP1SGX40FF1020C7)
- Commercial temperature grade for cost-optimized builds (vs EP1SGX40GF1020I6)
Design Notes
Per Altera application note AN-432, the EP1SGX40GF1020C8 1020-FBGA layout requires a minimum 10-layer PCB stackup with dedicated ground planes adjacent to each signal layer to control crosstalk on the 20 high-speed serial channels. Estimated: with 1.6 mm total board thickness and 50 Ω controlled impedance on top-side microstrip, the transceiver trace length from BGA ball to AC-coupling capacitor should not exceed 25 mm to maintain 3.1875 Gbps signal integrity, with intra-pair skew held below 1 ps (about 150 µm).
The 1020-FBGA flip-chip BGA package requires a heat-spreader or heatsink directly attached to the package top, not just PCB copper. According to the Stratix GX Device Handbook, a fully-loaded EP1SGX40GF1020C8 with 20 active transceivers dissipates 12 to 18 W depending on toggle rate, and the package theta-JA without heatsink is approximately 14 C/W. Estimated: without active airflow at 25C ambient, junction temperature rise above ambient is roughly 170 to 250 C, which exceeds the 125C commercial limit; therefore a heat-spreader plus 200 LFM airflow is mandatory for production builds.
Do not omit AC-coupling capacitors on any of the 20 transceiver channels—the EP1SGX40GF1020C8's PMA layer requires a 100 nF X7R AC-coupling cap in series on every TX and RX differential pair. Per the Stratix GX Transceiver User Guide, missing capacitors cause link training failures that mimic silicon defects; also ensure the reference clock input to each transceiver bank is AC-coupled with a 10 nF cap and routed on a dedicated clock layer to avoid reference-clock jitter degradation. Estimated: a 50 ppm reference clock jitter translates to roughly 0.5 UI of deterministic jitter at 3.1875 Gbps.
According to Altera AN-432, the EP1SGX40GF1020C8 1020-FBGA BGA escape routing must use microvia or staggered-via structures with continuous reference planes to maintain 50 Ω impedance on all 20 differential pairs. Estimated: with 0.1 mm BGA pitch and 8 mil microvias, the loss budget through the package and breakout is approximately 1.2 dB at 3 GHz, leaving roughly 7 dB margin to the Transmitter Compliance Transfer Function. Use 3D EM simulation (HFSS or CST) for channel compliance sign-off.
Compliance Information
RoHS and lead-free status not stated in the verified distributor pages; Intel product discontinuation notice should be consulted for the final compliance declaration.
