EP20K100FC324-3V - APEX 20K FPGA, 100K Gates, 324-BGA | Altera
MPN: EP20K100FC324-3V ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $71.2 | $712.00 |
| 100 | $64 | $6,400.00 |
| 500 | $58.5 | $29,250.00 |
| 1,000 | $53 | $53,000.00 |
Drop-in alternatives for EP20K100FC324-3V — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K100FC324-2X
✅ Drop-In✓ In Stock
$110.11 / Unit
View Datasheet →EP20K100FC324-1X
✅ Drop-In📋 Reference alternative (not in catalog)
EP20K100FC324-2
✅ Drop-In✓ In Stock
$18.9 / Unit
View Datasheet →EP20K100FC324-1V
✅ Drop-In✓ In Stock
$118.4 / Unit
View Datasheet →EP20K100FC324-2V
✅ Drop-In✓ In Stock
$8.15 / Unit
View Datasheet →EP20K100FC324-3
✅ Drop-In✓ In Stock
$42.1 / Unit
View Datasheet →EP20K100FC324-3V Maximum Ratings & Electrical Characteristics
| Series | APEX-20K® |
| Family | APEX 20K |
| Number of Logic Elements / Cells | 4,160 |
| Total System Gates | 100,000 |
| Total RAM Bits | 53,248 |
| Number of LABs / CLBs | 416 |
| Number of I/O | 252 |
| Voltage - Supply | 1.71 V to 1.89 V (core 2.5 V) |
| Operating Temperature | 0 °C to 85 °C (TJ) |
| Mounting Type | Surface Mount |
| Package / Case | 324-BGA (FineLine) |
| Supplier Device Package | 324-FBGA (19 x 19 mm) |
| Technology | 0.22 µm CMOS |
| Pin-to-Pin Delay | 3.6 ns |
EP20K100FC324-3V 324-fbga (19 x 19 mm) Pin Configuration Guide
Complete pinout information for EP20K100FC324-3V (324-fbga (19 x 19 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K100FC324-3V.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP20K100FC324-3V is suitable for 6 applications: Communications Line Card Design, Industrial Motor Control and Drive, DSP Co-Processing Accelerator, PCI Bridge and Embedded Processor Glue, Legacy System Sustainment and Industrial Retrofit, Telecommunications Backplane Switching.
Communications Line Card Design
The EP20K100FC324-3V's 252 user I/O and 53,248 bits of embedded RAM make it a strong fit for communications line card applications such as T1/E1 framers, ATM segmentation-and-reassembly blocks, and SONET/SDH mappers. The MultiCore architecture places LUT, product-term, and embedded system blocks (ESBs) on one die, allowing designers to implement wide datapath FIFOs alongside control logic without external SRAM. At the -3V speed grade the 3.6 ns pin-to-pin delay supports 167 MHz Fmax operation, sufficient for 155 Mbps POS-PHY and 66 MHz PCI bridge functions. Compared with a discrete glue-logic solution, the APEX 20K cuts BOM count, PCB area, and time-to-market for OEM telecom platforms.
Recommended
Industrial Motor Control and Drive
The EP20K100FC324-3V's 4,160 logic elements plus 53,248 embedded RAM bits deliver the deterministic parallel processing needed for field-oriented control (FOC) loops, PWM generation, and resolver decoding in industrial motor drives. The 252 user I/O can simultaneously support three-phase PWM channels, encoder feedback (QEP), SPI-controlled gate drivers, and current-sense ADCs, eliminating the need for an external CPLD or multiple microcontrollers. The MultiCore ESBs implement single-cycle lookup tables for sine/cosine and space-vector modulation without taxing logic resources. Designers targeting industrial automation benefit from the device's surface-mount 324-FBGA and the mature Quartus II toolchain, though the 0 °C to 85 °C TJ range should be verified against the enclosure thermal envelope.
Recommended
DSP Co-Processing Accelerator
The EP20K100FC324-3V integrates embedded memory and product-term logic that map efficiently to common DSP kernels including FIR filters, FFT butterflies, and correlators. With 53,248 bits of embedded RAM the device can hold 8,192 6-bit coefficients or 4,096 12-bit samples for a 256-tap FIR filter running at video line rates. The 167 MHz Fmax at -3V speed grade supports real-time video processing pipelines and baseband modem front-ends. Designers use the embedded system blocks as dual-port RAM to implement delay lines and window buffers, while LUT fabric carries the arithmetic tree. This positions the APEX 20K as a low-cost DSP co-processor beside a microcontroller or DSP chip.
Recommended
PCI Bridge and Embedded Processor Glue
The EP20K100FC324-3V delivers 252 user I/O and 4,160 logic elements, well-matched to PCI bus bridge, address mapping, and interrupt steering functions in embedded processor systems. At -3V speed grade, the 3.6 ns pin-to-pin delay supports 33 MHz and 66 MHz PCI target operation, while the ESB-based FIFOs decouple the PCI bus from the local processor bus with no external logic. Designers integrate PowerPC, MIPS, or ARM host processors with custom peripherals, DMA engines, and memory controllers inside a single APEX 20K, reducing board complexity. Quartus II IP cores (PCI Compiler, scatter-gather DMA) provide ready-to-use functions for fast integration.
Recommended
Legacy System Sustainment and Industrial Retrofit
The EP20K100FC324-3V is a workhorse for sustaining deployed industrial, defense, and medical systems where the APEX 20K design is locked in by qualification, certification, or regulatory approval. Authorized aftermarket distributors such as Rochester Electronics maintain traceability and date-code records that match the original factory parts. Designers performing board-level repair or obsolescence mitigation source the EP20K100FC324-3V to keep deployed systems in service without requalifying the host platform. The 324-FBGA footprint was widely adopted in the early 2000s, so many legacy designs have established rework procedures and socketed modules compatible with this package.
Recommended
Telecommunications Backplane Switching
The EP20K100FC324-3V delivers the IO count and embedded memory bandwidth suited to compact backplane switches, crossbar fabrics, and clock-distribution subsystems in telecom equipment. Its 252 IO pins drive multiple 8-bit parallel data ports plus serial control channels, while the 4,160 logic elements implement crossbar arbitration and queue management. ESBs serve as elastic store buffers absorbing frequency mismatch between upstream and downstream ports. The 0.22 µm CMOS process and 2.5 V core strike a balance between integration density and I/O drive strength for backplane signaling; multi-bank VCCIO allows mixing 3.3 V and 5 V peripherals on the same board.
Recommended
Recommended Products Summary
Engineering reference data for EP20K100FC324-3V — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K100FC324-2X | EP20K100FC324-1X | EP20K100FC324-2 | EP20K100FC324-1V | EP20K100FC324-2V |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 324-FBGA (19x19 mm) | 324-FBGA - same | 324-FBGA - same | 324-FBGA - same | 324-FBGA - same | 324-FBGA - same |
| System Gates | 100,000 | 100,000 - same | 100,000 - same | 100,000 - same | 100,000 - same | 100,000 - same |
| Logic Elements | 4,160 | 4,160 - same | 4,160 - same | 4,160 - same | 4,160 - same | 4,160 - same |
| Total RAM Bits | 53,248 | 53,248 - same | 53,248 - same | 53,248 - same | 53,248 - same | 53,248 - same |
| User I/O | 252 | 252 - same | 252 - same | 252 - same | 252 - same | 252 - same |
| Speed Grade (Pin-to-Pin Delay) | -3V (3.6 ns) | -2X (slower) | -1X (slowest) | -2 (slower) | -1V (slowest) | -2V (slower) |
| Core Voltage | 2.5 V (VCCINT 1.71-1.89 V) | 2.5 V - same | 2.5 V - same | 2.5 V - same | 2.5 V - same | 2.5 V - same |
| Process Technology | 0.22 µm CMOS | 0.22 µm CMOS - same | 0.22 µm CMOS - same | 0.22 µm CMOS - same | 0.22 µm CMOS - same | 0.22 µm CMOS - same |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Fastest speed grade in the EP20K100FC324 family (vs EP20K100FC324-2X)
- Same silicon as -3 grade with VCCIO power characterization (vs EP20K100FC324-3 (no V suffix))
- Embedded memory density advantage over CPLD alternatives (vs MAX 7000S CPLD family)
Design Notes
The 324-FBGA FineLine package uses 1.0 mm ball pitch, which permits escape routing on 4-layer FR-4 with 4-mil traces and 8-mil via pads using standard PCB processes, but requires careful BGA fan-out planning to avoid via-in-pad cost. Place all decoupling capacitors within 100 mils of their respective VCCINT and VCCIO pins, with 0.1 µF ceramic in parallel with 10 µF bulk tantalum or polymer per VCC rail. The 19 x 19 mm package body provides sufficient thermal mass for typical industrial duty cycles without external heatsinking, but check junction temperature under sustained high-utilization workloads.
Do not assume the APEX 20K configuration port is 5 V tolerant; the JTAG and passive serial configuration pins operate at VCCIO levels and must be level-shifted if driven by a 5 V host processor. Configuration flash memory must be sized to accommodate the compressed bitstream plus 8-byte preamble; undersized EPC devices cause configuration failures at power-on. The MultiCore ESBs can be configured as either dual-port RAM or ROM at compile time, and re-purposing ESB contents after place-and-route requires a full recompile in Quartus II.
Synchronous IO interfaces running above 66 MHz should use the LVDS-capable IO banks of the APEX 20K E-series rather than the LVTTL/LVCMOS-only banks on the standard APEX 20K. For 167 MHz Fmax datapaths, set the Quartus II fitter to optimize timing-driven synthesis and route clock nets through dedicated clock networks to avoid skew. Maintain 3H rule spacing on parallel LVTTL buses above 50 MHz to limit crosstalk; consider series termination for backplane traces exceeding 6 inches.
Compliance Information
Compliance data not present in the Verified Web Data for EP20K100FC324-3V; consult the official Altera/Intel PSG material declaration for accurate RoHS, REACH, lead-free, and halogen-free status. AEC-Q100 is not applicable for this industrial/consumer FPG
