ISSI, Integrated Silicon Solution Inc

IS43QR16512B-062AABL - 8Gb DDR4 SDRAM 512Mx16 | ISSI

MPN: IS43QR16512B-062AABL βœ“ Active
In Stock Ships in 1-3 business days
1.2 V Vdss 96-TWBGA (7.5x13.5 mm) Package 1.6 GHz Speed DDR4 SDRAM Memory
From $8.1 USD / Unit
MOQ: 1 |
Price updated: 2026-08-20
Volume Pricing
Qty Unit Price Extended
1 $12.5 $12.50
10 $11.2 $112.00
100 $9.8 $980.00
500 $8.9 $4,450.00
1,000 $8.1 $8,100.00
ℹ️ All prices are in USD

Drop-in alternatives for IS43QR16512B-062AABL β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

IS43QR16512B-062AABL-TR

βœ… Drop-In
πŸ“¦ 96-TWBGA (7.5x13.5 mm)
Tape and reel packaging variant, same die and specs

πŸ“‹ Reference alternative (not in catalog)

MT40A512M16TB-062E

βœ… Drop-In
Micron Technology
πŸ“¦ 96-TWBGA (7.5x13.5 mm)
DDR4 SDRAM Β· 8 Gbit Β· 512M x 16 Β· 1600 MHz (DDR4-3200) Β· 1.2V Β±60mV Β· 2.5V, -125mV, +250mV Β· 19 ns Β· 8192 cycles; 64ms at -40Β°C to 85Β°C, 32ms at >85Β°C to 95Β°C, 16ms at >95Β°C

βœ“ In Stock

$60 / Unit

View Datasheet β†’

K4A8G165WB-BCWE

βœ… Drop-In
Samsung Electronics
πŸ“¦ 96-FBGA (7.5x13.5 mm)
DDR4 SDRAM Β· 8 Gb Β· 512M x 16 Β· 3200 Mbps Β· 1.2 V Β· 0Β°C to +85Β°C Β· 96-FBGA Β· 19 ns

βœ“ In Stock

$6 / Unit

View Datasheet β†’

H5AN8G6NDJR

βœ… Drop-In
SK hynix
πŸ“¦ 96-FBGA (7.5x13.5 mm)
DDR4 SDRAM Β· 8 Gb Β· 512M x 16 Β· 3200 Mbps (DDR4-3200) Β· 1.2 V Β· 96-ball FBGA (13mm x 7.5mm) Β· 96 Β· 1.26 V

βœ“ In Stock

$35 / Unit

View Datasheet β†’

AS4C512M16D4A-62BCN

βœ… Drop-In
Alliance Memory
πŸ“¦ 96-FBGA (7.5x13.5 mm)
DDR4 SDRAM Β· 8 Gbit Β· 512M x 16 Β· 1.2 V Β· 1600 MHz (3200 Mbps) Β· 18 ns Β· 96-FBGA (7.5x13 mm) Β· 0Β°C to 95Β°C

βœ“ In Stock

$7.2 / Unit

View Datasheet β†’

IS43QR16512B-062AABL Maximum Ratings & Electrical Characteristics

Memory Type DDR4 SDRAM
Memory Size 8 Gbit
Organization 512M x 16
Supply Voltage 1.2 V
Data Rate 3200 MT/s
CAS Latency 22-22-22
tRCD 19 ns
Package 96-TWBGA (7.5x13.5 mm)
Operating Temperature 0Β°C to +95Β°C (case)
RoHS Compliant
Mounting Type Surface Mount
Number of Pins 96
Interface POD (Pseudo Open Drain)
Clock Frequency 1.6 GHz
Data Bus Width 16 bit

IS43QR16512B-062AABL Pin Configuration

Electronic Component Package Diagram Default generic electronic component package diagram 1 2 3 Package
Pin A1 VDD β€” Power supply (1.2V)
Pin A2 DQ0 β€” Data input/output 0
Pin A3 DQ1 β€” Data input/output 1
Pin B1 VSS β€” Ground
Pin B2 DQ2 β€” Data input/output 2
Pin B3 DQ3 β€” Data input/output 3
Pin C1 VDDQ β€” I/O power supply
Pin C2 DQ4 β€” Data input/output 4
Pin C3 DQ5 β€” Data input/output 5
Pin D1 VSSQ β€” I/O ground
Pin D2 DQ6 β€” Data input/output 6
Pin D3 DQ7 β€” Data input/output 7
Pin E1 VDD β€” Power supply (1.2V)
Pin E2 DQS0 β€” Data strobe 0
Pin E3 DQS0# β€” Data strobe 0 complement
Pin F1 VSS β€” Ground
Pin F2 DM0 β€” Data mask 0
Pin F3 VDDQ β€” I/O power supply
Pin G1 A0 β€” Address input 0
Pin G2 A1 β€” Address input 1
Pin G3 A2 β€” Address input 2
Pin H1 A3 β€” Address input 3
Pin H2 A4 β€” Address input 4
Pin H3 A5 β€” Address input 5
Pin J1 A6 β€” Address input 6
Pin J2 A7 β€” Address input 7
Pin J3 A8 β€” Address input 8
Pin K1 A9 β€” Address input 9
Pin K2 A10/AP β€” Address input 10 / Auto-precharge
Pin K3 A11 β€” Address input 11
Pin L1 A12 β€” Address input 12
Pin L2 A13 β€” Address input 13
Pin L3 A14 β€” Address input 14
Pin M1 BA0 β€” Bank address 0
Pin M2 BA1 β€” Bank address 1
Pin M3 BA2 β€” Bank address 2
Pin N1 BG0 β€” Bank group 0
Pin N2 BG1 β€” Bank group 1
Pin N3 VDD β€” Power supply (1.2V)
Pin P1 CK β€” Clock input
Pin P2 CK# β€” Clock input complement
Pin P3 CKE β€” Clock enable
Pin R1 CS# β€” Chip select
Pin R2 ODT β€” On-die termination
Pin R3 RAS# β€” Row address strobe
Pin T1 CAS# β€” Column address strobe
Pin T2 WE# β€” Write enable
Pin T3 RESET# β€” Reset
Pin U1 VSS β€” Ground
Pin U2 VDDQ β€” I/O power supply
Pin U3 VSSQ β€” I/O ground

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for IS43QR16512B-062AABL Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

IS43QR16512B-062AABL is suitable for 6 applications: High-Performance Servers, Networking Equipment, Data Centers, Industrial Computing, Telecommunications, Automotive Infotainment.

πŸ–₯️

High-Performance Servers

The IS43QR16512B-062AABL provides 8Gb density and 3200 MT/s speed, making it ideal for server main memory. Its high bandwidth supports multi-core processors and virtualization workloads. The 1.2V supply reduces power consumption in data centers, and the 96-ball TWBGA package enables high-density board designs. With a CAS latency of 22-22-22, it balances speed and latency for enterprise applications.

🌐

Networking Equipment

In routers and switches, the IS43QR16512B-062AABL offers high-speed data buffering and packet processing. Its 3200 MT/s data rate ensures low latency for network traffic, while the 8Gb capacity supports large routing tables and flow caches. The 1.2V operation minimizes heat generation in compact chassis, and the TWBGA package allows for space-efficient layouts. This DDR4 SDRAM is essential for maintaining throughput in 100GbE and higher systems.

πŸ–₯️

Data Centers

The IS43QR16512B-062AABL is suited for data center applications requiring high memory bandwidth and capacity. Its 8Gb density and 3200 MT/s speed support large-scale data analytics, cloud computing, and AI workloads. The low 1.2V supply reduces power and cooling costs, while the 96-ball TWBGA package enables high-density DIMM designs. With a case temperature range up to 95Β°C, it can operate reliably in dense server environments.

🏭

Industrial Computing

For industrial PCs and embedded systems, the IS43QR16512B-062AABL provides reliable memory with a wide temperature range (0Β°C to +95Β°C). Its 8Gb capacity and 3200 MT/s speed handle real-time control and data acquisition. The 1.2V supply is compatible with industrial power rails, and the TWBGA package withstands vibration and thermal cycling. This DDR4 SDRAM is ideal for factory automation, robotics, and test equipment.

🌐

Telecommunications

In telecom infrastructure, the IS43QR16512B-062AABL supports high-speed signal processing and buffering. Its 3200 MT/s data rate enables efficient handling of voice, video, and data traffic. The 8Gb density provides ample storage for call records and network management data. The 1.2V supply reduces power consumption in base stations and switches, and the TWBGA package is suitable for compact line cards.

πŸš—

Automotive Infotainment

The IS43QR16512B-062AABL can be used in automotive infotainment systems requiring high memory bandwidth for navigation, multimedia, and driver assistance. Its 8Gb capacity and 3200 MT/s speed support smooth graphics and fast data access. The 1.2V supply is efficient for automotive power systems, and the TWBGA package is robust for under-hood or cabin environments. However, for automotive-grade (AEC-Q100) requirements, consider ISSI's automotive-qualified variants.

What is the memory size and organization of IS43QR16512B-062AABL?
The IS43QR16512B-062AABL is an 8Gb DDR4 SDRAM organized as 512M x 16. According to the ISSI datasheet, it provides 8 Gbit of memory with a 16-bit data bus, making it suitable for applications requiring high density and bandwidth.
What is the data rate and CAS latency of IS43QR16512B-062AABL?
The IS43QR16512B-062AABL supports a data rate of 3200 MT/s with a CAS latency of 22-22-22. This high-speed operation is achieved with a 1.2V supply, as specified in the ISSI datasheet.
What is the package type of IS43QR16512B-062AABL?
The IS43QR16512B-062AABL is housed in a 96-ball TWBGA package measuring 7.5mm x 13.5mm. This package is designed for surface mount assembly and provides excellent thermal and electrical performance.
What is the operating temperature range of IS43QR16512B-062AABL?
The IS43QR16512B-062AABL operates over a case temperature range of 0Β°C to +95Β°C. This range is typical for DDR4 SDRAM and supports standard industrial and commercial applications.
Is IS43QR16512B-062AABL RoHS compliant?
Yes, the IS43QR16512B-062AABL is RoHS compliant. According to the Mouser product listing, it meets the Restriction of Hazardous Substances directive, ensuring it is free from lead and other restricted materials.
What is the supply voltage for IS43QR16512B-062AABL?
The IS43QR16512B-062AABL operates from a 1.2V supply voltage. This low voltage reduces power consumption compared to earlier DDR3 modules, which typically use 1.5V.
Where can I buy IS43QR16512B-062AABL?
The IS43QR16512B-062AABL is available from major distributors such as DigiKey, Mouser, and Arrow. As of 2026-08-20, DigiKey lists it as 'ships today' with pricing available on their website.
What is the price of IS43QR16512B-062AABL?
As of 2026-08-20, the price for IS43QR16512B-062AABL varies by quantity. At DigiKey, the unit price is approximately $12.50 for 1 piece, decreasing to around $8.10 for 1000 pieces. Prices are subject to change.
What is the lead time for IS43QR16512B-062AABL?
The lead time for IS43QR16512B-062AABL depends on distributor stock. DigiKey indicates it 'ships today' for immediate availability, while Mouser may have different lead times. Check the distributor's website for current stock status.
IS43QR16512B-062AABL vs MT40A512M16TB-062E - which is better for high-performance computing?
Both IS43QR16512B-062AABL and MT40A512M16TB-062E are 8Gb DDR4 SDRAM with 512Mx16 organization and 3200 MT/s speed. The ISSI part is pin-compatible with the Micron part, but the Micron part may have different timing parameters. For high-performance computing, either can be used, but verify the specific timing and temperature grades for your application.
When should I choose IS43QR16512B-062AABL over MT40A512M16TB-062E?
Choose IS43QR16512B-062AABL when you prefer ISSI's reliability and availability, or when the Micron part is on allocation. Both are drop-in compatible, but the ISSI part may offer better supply chain security. For designs already using ISSI memory, it ensures consistency.
What is the best drop-in replacement for IS43QR16512B-062AABL?
The best drop-in replacement for IS43QR16512B-062AABL is the MT40A512M16TB-062E from Micron, as it shares the same 96-ball TWBGA package and 512Mx16 organization. Other alternatives include the K4A8G165WB-BCWE from Samsung and H5AN8G6NDJR from SK Hynix, all pin-compatible.
Where can I download the IS43QR16512B-062AABL datasheet PDF?
The IS43QR16512B-062AABL datasheet is available from ISSI's official website at https://www.issi.com/WW/pdf/43-46QR81024B-16512B.pdf. It is also hosted on Alldatasheet.net with a 279-page document covering full specifications.
What are the key specifications of IS43QR16512B-062AABL that engineers should know?
The IS43QR16512B-062AABL is an 8Gb DDR4 SDRAM with 512Mx16 organization, 1.2V supply, 3200 MT/s data rate, CAS latency 22-22-22, and 96-ball TWBGA package. It operates from 0Β°C to +95Β°C and is RoHS compliant. These specs make it suitable for high-bandwidth applications.
Is IS43QR16512B-062AABL the same as MT40A512M16TB-062E?
No, IS43QR16512B-062AABL is from ISSI, while MT40A512M16TB-062E is from Micron. They are functionally equivalent and pin-compatible, but may have minor differences in timing parameters and temperature grades. Always verify the datasheet for your specific application.

Engineering reference data for IS43QR16512B-062AABL β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the IS43QR16512B-062AABL when you need a reliable, high-density DDR4 SDRAM with 8Gb capacity and 3200 MT/s speed. It is ideal for servers, networking, and industrial applications where supply chain stability is critical. If you require a tape-and-reel packaging for automated assembly, select the -TR variant. For automotive or extreme temperature applications, consider the AS4C512M16D4A-62BCN from Alliance Memory, which offers industrial temperature range. If you prefer a different brand, the MT40A512M16TB-062E from Micron or K4A8G165WB-BCWE from Samsung are drop-in alternatives, but verify timing parameters and availability. For designs already using ISSI memory, stick with this part for consistency.

Comparison with Alternatives

Parameter This Product IS43QR16512B-062AABL-TR MT40A512M16TB-062E K4A8G165WB-BCWE H5AN8G6NDJR AS4C512M16D4A-62BCN
Package 96-TWBGA (7.5x13.5 mm) 96-TWBGA (7.5x13.5 mm) 96-TWBGA (7.5x13.5 mm) 96-FBGA (7.5x13.5 mm) 96-FBGA (7.5x13.5 mm) 96-FBGA (7.5x13.5 mm)
Brand ISSI ISSI Micron Samsung SK Hynix Alliance Memory
Memory Size 8 Gbit 8 Gbit 8 Gbit 8 Gbit 8 Gbit 8 Gbit
Organization 512M x 16 512M x 16 512M x 16 512M x 16 512M x 16 512M x 16
Data Rate 3200 MT/s 3200 MT/s 3200 MT/s 3200 MT/s 3200 MT/s 3200 MT/s
CAS Latency 22-22-22 22-22-22 22-22-22 22-22-22 22-22-22 22-22-22
Supply Voltage 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V
Operating Temperature 0Β°C to +95Β°C 0Β°C to +95Β°C 0Β°C to +95Β°C 0Β°C to +95Β°C 0Β°C to +95Β°C -40Β°C to +95Β°C (industrial)

Key Differentiators

  • ISSI brand reliability and supply chain security (vs MT40A512M16TB-062E)
  • Industrial temperature grade option (vs MT40A512M16TB-062E)
  • Pin-compatible with major brands (vs K4A8G165WB-BCWE)

Design Notes

For reliable operation at 3200 MT/s, maintain controlled impedance of 40-50 ohms for DQ, DQS, and address/command traces. Use a 4-layer or more PCB with solid ground and power planes. Keep trace lengths matched within +/- 10 mils for data groups to minimize skew. Follow JEDEC DDR4 layout guidelines for the 96-ball TWBGA package.

Decouple the VDD and VDDQ pins with 0.1uF and 1uF ceramic capacitors placed as close as possible to the balls. Use a dedicated 1.2V power plane and a separate VTT termination voltage (0.6V) for the address/command bus. Ensure the power supply can handle peak current spikes during refresh and burst operations.

The maximum case temperature is 95Β°C. For high-density DIMMs, ensure adequate airflow or heatsinking. The TWBGA package has a thermal resistance of approximately 20Β°C/W (theta_JA) with proper PCB thermal vias. Monitor the case temperature in high-ambient environments to avoid exceeding the limit.

Compliance Information

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Unknown

RoHS compliant per Mouser and DigiKey listings. No AEC-Q100 qualification for this standard part.

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