IS43QR16512B-062AABL vs H5AN8G6NDJR Comparison

Detailed side-by-side comparison of IS43QR16512B-062AABL by ISSI, Integrated Silicon Solution Inc and H5AN8G6NDJR by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

ISSI, Integrated Silicon Solution Inc
IS43QR16512B-062AABL

IS43QR16512B-062AABL - 8Gb DDR4 SDRAM 512Mx16 | ISSI

IS43QR16512B-062AABL βœ“ Active
SK hynix
H5AN8G6NDJR

H5AN8G6NDJR - 8Gb DDR4-3200 SDRAM | SK hynix

H5AN8G6NDJR βœ“ Active

Specification Comparison

Parameter IS43QR16512B-062AABL H5AN8G6NDJR
Brand ISSI, Integrated Silicon Solution Inc SK hynix
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $8.10 $35.00
Memory Type DDR4 SDRAM DDR4 SDRAM
Memory Size 8 Gbit β€”
Organization 512M x 16 512M x 16
Supply Voltage 1.2 V 1.2 V
Data Rate 3200 MT/s 3200 Mbps (DDR4-3200)
CAS Latency 22-22-22 22 cycles (at 3200 Mbps)
tRCD 19 ns β€”
Package 96-TWBGA (7.5x13.5 mm) 96-ball FBGA (13mm x 7.5mm)
Operating Temperature 0Β°C to +95Β°C (case) β€”
RoHS Compliant Compliant
Mounting Type Surface Mount β€”
Number of Pins 96 β€”
Interface POD (Pseudo Open Drain) β€”
Clock Frequency 1.6 GHz β€”
Data Bus Width 16 bit β€”
Density β€” 8 Gb
Number of Terminals β€” 96
Maximum Supply Voltage (Vsup) β€” 1.26 V
Maximum Operating Temperature β€” 85 Β°C
Burst Length β€” 8 (BL8), 4 (BC4)
Access Mode β€” Multi Bank Page Burst
JESD-30 Code β€” R-PBGA-B96
Features β€” Auto self-refresh, auto precharge, asynchronous reset, data mask, dynamic ODT, ZQ calibration, CRC, write leveling

Datasheets & Resources

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