K3KL5L50QM-JGCT - 128Gb LPDDR5X 7500Mbps DRAM | Samsung
MPN: K3KL5L50QM-JGCT ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $74.6 | $746.00 |
| 100 | $70.9 | $7,090.00 |
| 500 | $67.4 | $33,700.00 |
| 1,000 | $64 | $64,000.00 |
Drop-in alternatives for K3KL5L50QM-JGCT — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
K3KL3L30QM-JGCT
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View Datasheet →K3KL5L50QM-JGCT Maximum Ratings & Electrical Characteristics
| Memory Type | LPDDR5X DRAM (volatile) |
| Memory Size | 128 Gb (16 GB) |
| Memory Organization | x64 |
| Interface Speed | 7500 Mbps (LPDDR5X-7500) |
| Interface Type | LPDDR5X parallel interface |
| Supply Voltage (VDD1) | 1.8 V |
| Supply Voltage (VDD2) | 1.05 V |
| Supply Voltage (VDD2Q/other) | 0.9 V |
| Supply Voltage (VDDQ) | 0.5 V |
| Operating Temperature | -25C to +85C |
| Package | 441-ball FBGA |
| Mounting Type | Surface Mount (BGA) |
| Technology | LPDDR5X (JEDEC LPDDR5 extended) |
| Application Class | AI, in-vehicle and mobile devices |
| Product Status | EOL (End of Life) |
K3KL5L50QM-JGCT 441-ball fbga Pin Configuration Guide
Complete pinout information for K3KL5L50QM-JGCT (441-ball fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for K3KL5L50QM-JGCT.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
K3KL5L50QM-JGCT is suitable for 6 applications: Flagship Smartphone Main Memory, AI Edge Computing and Inference Accelerators, Automotive ADAS and In-Vehicle Infotainment, Ultra-Thin Laptops and Tablets, Network Appliance and 5G Infrastructure Buffering, Medical and Portable Diagnostic Instruments.
Flagship Smartphone Main Memory
The K3KL5L50QM-JGCT fits flagship smartphone platforms that require 16 GB of main memory with maximum bandwidth-per-watt. Its LPDDR5X-7500 interface at 7500 Mbps per pin, combined with Samsung's roughly 25% power-efficiency improvement over the prior generation, directly extends battery life under heavy multitasking and on-device AI workloads. The 441-ball FBGA footprint minimizes board area in dense smartphone PCB stacks, while the x64 organization lets the application processor aggregate two 32-bit channels. Placed on the SoC reference fly-by topology with on-die termination and DVFS-managed 0.5 V VDDQ, the part sustains multi-gigabit signaling within the -25C to +85C envelope typical of handset thermal designs.
Recommended
AI Edge Computing and Inference Accelerators
For edge AI modules running large language or vision models, the K3KL5L50QM-JGCT provides 16 GB of working memory at 7500 Mbps, giving inference engines the memory bandwidth needed to stream model weights without starvation. Samsung explicitly targets AI devices with this premium LPDDR5X generation, citing up to 1.25 times the speed of the previous generation. In an edge-inference card, the DRAM connects directly to an SoC or NPU memory controller over short fly-by traces; the four-rail power architecture (1.8 V / 1.05 V / 0.9 V / 0.5 V) allows the PMIC to scale VDDQ dynamically, trading a small bandwidth margin for significant power savings during idle inference periods.
Recommended
Automotive ADAS and In-Vehicle Infotainment
Distributor data describes the K3KL5L50QM-JGCT as low-power DRAM for AI and in-vehicle devices, and its -25C to +85C operating range covers automotive cabin electronics environments. In ADAS domain controllers and IVI head units, 16 GB of LPDDR5X supports multi-camera sensor fusion, surround-view rendering, and navigation workloads simultaneously. The 441-ball FBGA package withstands automotive vibration profiles when mounted per the SoC supplier's land-pattern recommendation. Designers must verify thermal conditions near the DRAM (self-refresh and active currents generate heat under the BGA) and confirm the automotive qualification grade with Samsung, since AEC-Q100 status is not stated in public listings.
Recommended
Ultra-Thin Laptops and Tablets
Premium thin-and-light PCs and large tablets adopt LPDDR5X for the same reasons as smartphones: high bandwidth in a low-power, small-footprint package. The K3KL5L50QM-JGCT's 7500 Mbps interface feeds integrated-GPU and CPU memory demand for 16 GB configurations, while its power efficiency (about 25% better than the previous generation per Samsung) directly improves battery runtime in fanless designs. Board designers typically place two packages to form a 128-bit bus on an x64-pair channel layout. Memory-down LPDDR5X also removes SO-DIMM height constraints, enabling slimmer chassis, at the cost of non-upgradeable memory that must be sized correctly at design time.
Recommended
Network Appliance and 5G Infrastructure Buffering
5G small cells, edge gateways, and network appliances use LPDDR5X as packet-buffer and control-plane memory where DRAM power draw is a significant share of system budget. The K3KL5L50QM-JGCT's 128 Gb density and 7500 Mbps rate handle deep packet buffers and fast table lookups, while the 0.5 V VDDQ rail minimizes I/O power during sustained traffic. The -25C to +85C range suits sealed outdoor enclosures without active cooling. Because network SoCs vary in LPDDR5X support maturity, verify PHY training compatibility and speed-grade support (LPDDR5X-7500) in the chosen network processor before layout, and provision the four-rail PMIC sequencing accordingly.
Recommended
Medical and Portable Diagnostic Instruments
Portable ultrasound, patient monitors, and handheld diagnostic imagers benefit from the K3KL5L50QM-JGCT's balance of 16 GB capacity, high bandwidth for real-time image pipelines, and low power for battery operation. The 441-ball FBGA package integrates into compact handheld PCBs, and the extended -25C low end accommodates storage and transport conditions beyond typical commercial specs. Image-processing SoCs with LPDDR5X interfaces achieve smooth frame buffering at 7500 Mbps without the power penalty of DDR4 DIMM solutions. Designers should implement the Samsung-recommended self-refresh and power-down modes so the DRAM draws microamp-scale current during standby, preserving battery life in clinical shift-length use.
Recommended
Recommended Products Summary
Engineering reference data for K3KL5L50QM-JGCT — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | K3KL3L30QM-JGCT | K3KL2L20DM-JGCT | K3KL1L10GM-JGCT |
|---|---|---|---|---|
| Package | 441-ball FBGA | 441-ball FBGA (QM) - same family | 441-ball FBGA (DM family) - verify footprint | 441-ball FBGA (GM family) - verify footprint |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics |
| Memory Size | 128 Gb | 64 Gb | 32 Gb class | 16 Gb class |
| Technology | LPDDR5X | LPDDR5X | LPDDR5X | LPDDR5X |
| Organization | x64 | x64 | x32 class - verify | x16 class - verify |
| Interface Speed | 7500 Mbps | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Operating Temperature | -25C to +85C | [DATA_NEEDED] | -25C to +85C (JGCT coding) | -25C to +85C (JGCT coding) |
| Supply Voltage Rails | 1.8 / 1.05 / 0.9 / 0.5 V | 1.8 / 1.05 / 0.9 / 0.5 V (LPDDR5X standard) | 1.8 / 1.05 / 0.9 / 0.5 V (LPDDR5X standard) | 1.8 / 1.05 / 0.9 / 0.5 V (LPDDR5X standard) |
| Product Status | EOL | Sampling (per icDirectory) | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest density in the compared family (vs K3KL3L30QM-JGCT)
- Extended low-temperature operation (vs Generic commercial-grade LPDDR5X)
- Same-package lower-cost fallback exists (vs K3KL3L30QM-JGCT)
Design Notes
The K3KL5L50QM-JGCT uses four supply rails (1.8 V VDD1, 1.05 V VDD2, 0.9 V aux, 0.5 V VDDQ). Use a PMIC with dedicated LPDDR5X rails and correct power-up sequencing (VDD1/VDD2 before VDDQ per LPDDR5X standard practice) to avoid I/O latch-up. LPDDR5X performs dynamic voltage scaling on VDDQ during operation, so the 0.5 V rail must support fast load transients; place bulk and 0.1 uF ceramic decoupling at each VDDQ ball group. Estimated: at 7500 Mbps with x64 loading, I/O dynamic power dominates, so rail integrity directly limits eye margin.
At LPDDR5X-7500 rates, fly-by CA and data-bus routing must follow the SoC vendor reference design: matched intra-byte-group lengths, controlled impedance (single-ended near 40 ohms on data), and reference-plane continuity under every ball fanout. On-die termination (ODT) settings and read/write training must be re-tuned whenever a different Samsung family member is substituted, since training tables in firmware are die-specific. Do not mix speed grades across channel pairs on a shared memory bus.
The part is EOL per ICAllIn specification data, so new designs should not start on this MPN without a lifecycle plan. Reported stock (about 48,000 pcs at Wolfchip as of Aug 2026) will deplete; secure date-code-consistent lots, insist on original Samsung packaging and authentication for broker-sourced units, and pre-qualify a same-family alternative such as K3KL3L30QM-JGCT for lower-density builds. Also verify AEC-Q100 status directly with Samsung if the end product is automotive - public listings do not state it.
Compliance Information
Provided web data does not state RoHS/REACH/AEC-Q100 status for K3KL5L50QM-JGCT. Request formal compliance declarations from Samsung Semiconductor or your franchised distributor.
