MT40A512M16TD-062E - 8Gb DDR4 SDRAM 512Mx16 | Micron
MPN: MT40A512M16TD-062E ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $72.2 | $72.20 |
| 10 | $68.5 | $685.00 |
| 100 | $65 | $6,500.00 |
| 500 | $62 | $31,000.00 |
| 1,000 | $58 | $58,000.00 |
Drop-in alternatives for MT40A512M16TD-062E — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MT40A512M16TB-062E:R
✅ Drop-In✓ 99,999 In Stock
$60 / Unit
View Datasheet →MT40A512M16LY-062E
✅ Drop-In✓ 99,999 In Stock
$6.3 / Unit
View Datasheet →MT40A512M16TD-062E AUT:R
✅ Drop-In📋 Reference alternative (not in catalog)
MT40A512M16TD-062E AIT:R
✅ Drop-In📋 Reference alternative (not in catalog)
AS4C512M16D4B-62BCNTR
✅ Drop-In✓ 99,999 In Stock
$8.1 / Unit
View Datasheet →MT40A512M16JY-07EAIT:B
✅ Drop-In✓ 99,999 In Stock
$8.1 / Unit
View Datasheet →MT40A512M16TD-062E Maximum Ratings & Electrical Characteristics
| Memory Type | SDRAM - DDR4 |
| Memory Size | 8 Gbit |
| Organization | 512M x 16 |
| Data Bus Width | 16 bit |
| Clock Frequency | 1.6 GHz |
| Access Time | 19 ns |
| Supply Voltage | 1.2 V |
| Package | 96-FBGA (7.5x13) |
| Operating Temperature | 0C to +95C (TCASE) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Data Rate | 3200 MT/s |
| CAS Latency | 22 (typical) |
| Refresh | Auto-refresh and self-refresh |
| Number of Pins | 96 |
MT40A512M16TD-062E Pin Configuration
| Pin A1 | VDD — Power supply (1.2V) |
| Pin A2 | DQ0 — Data input/output 0 |
| Pin A3 | DQ1 — Data input/output 1 |
| Pin A4 | VSS — Ground |
| Pin A5 | DQ2 — Data input/output 2 |
| Pin A6 | DQ3 — Data input/output 3 |
| Pin A7 | VDD — Power supply (1.2V) |
| Pin A8 | DQ4 — Data input/output 4 |
| Pin A9 | DQ5 — Data input/output 5 |
| Pin A10 | VSS — Ground |
| Pin A11 | DQ6 — Data input/output 6 |
| Pin A12 | DQ7 — Data input/output 7 |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
MT40A512M16TD-062E is suitable for 6 applications: Server Memory Modules, High-Performance Computing (HPC), Networking Equipment, Embedded Systems, Data Center Storage, AI and Machine Learning Accelerators.
Server Memory Modules
The MT40A512M16TD-062E is ideal for server DIMMs, providing high density and speed for enterprise workloads. Its 8Gb capacity and 3200 MT/s data rate enable high-bandwidth memory subsystems, supporting virtualization, cloud computing, and database applications. The 1.2V operation reduces power consumption in data centers, and the 96-ball FBGA package allows for compact module designs. When used in RDIMMs or LRDIMMs, it pairs with register chips and data buffers to ensure signal integrity at high speeds.
Recommended
High-Performance Computing (HPC)
In HPC systems, the MT40A512M16TD-062E provides the memory bandwidth and capacity required for complex simulations and AI training. Its 3200 MT/s data rate and 8Gb density support large datasets and parallel processing. The device's low latency (19 ns access time) is critical for scientific computing. It can be used in compute nodes with multiple memory channels, and its thermal characteristics are suitable for air-cooled and liquid-cooled systems. Designers should ensure proper thermal management to maintain performance under sustained loads.
Recommended
Networking Equipment
The MT40A512M16TD-062E is well-suited for networking equipment such as routers and switches, where high-speed packet processing requires fast memory access. Its 16-bit data bus and 3200 MT/s data rate enable efficient data buffering and forwarding. The 1.2V supply reduces power dissipation in dense line cards. The device's on-die termination (ODT) improves signal integrity on high-speed buses, reducing the need for external components. It can be used in both control plane and data plane memory applications.
Recommended
Embedded Systems
For advanced embedded systems, the MT40A512M16TD-062E offers high memory density in a compact FBGA package, making it suitable for applications like industrial controllers, medical devices, and automotive infotainment. Its 1.2V operation is compatible with low-power designs, and the industrial temperature grade (AIT) option supports harsh environments. The device's self-refresh mode helps reduce power in standby. Designers can integrate it with application processors or FPGAs that have DDR4 controllers, ensuring reliable operation over extended temperature ranges.
Recommended
Data Center Storage
In data center storage systems, the MT40A512M16TD-062E is used in cache memory and metadata storage, providing low-latency access to frequently used data. Its high density reduces the number of memory devices needed, saving board space and power. The 3200 MT/s data rate supports high-throughput storage controllers. The device's error detection and correction features (if enabled) enhance reliability in enterprise environments. It can be paired with NVMe controllers or RAID controllers to accelerate storage performance.
Recommended
AI and Machine Learning Accelerators
The MT40A512M16TD-062E is essential for AI accelerators, providing the large memory capacity and bandwidth needed for model training and inference. Its 8Gb density and 3200 MT/s data rate enable efficient data movement between compute cores and memory. The device's low power consumption is critical for power-constrained AI edge devices. It can be used in conjunction with GPUs, FPGAs, or custom ASICs that have DDR4 interfaces. Designers should consider the memory controller's capabilities to fully utilize the device's speed.
Recommended
Recommended Products Summary
Engineering reference data for MT40A512M16TD-062E — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MT40A512M16TB-062E:R | MT40A512M16LY-062E | AS4C512M16D4B-62BCNTR |
|---|---|---|---|---|
| Package | 96-FBGA (7.5x13) | 96-FBGA (7.5x13) | 96-FBGA (7.5x13) | 96-FBGA (7.5x13) |
| Brand | Micron Technology | Micron Technology | Micron Technology | Alliance Memory |
| Memory Size | 8 Gbit | 8 Gbit | 8 Gbit | 8 Gbit |
| Organization | 512M x 16 | 512M x 16 | 512M x 16 | 512M x 16 |
| Clock Frequency | 1.6 GHz | 1.6 GHz | 1.6 GHz | 1.6 GHz |
| Access Time | 19 ns | 19 ns | 19 ns | 19 ns |
| Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Temperature Grade | Commercial (0C to +95C) | Commercial | Commercial | Commercial |
Key Differentiators
- High density 8Gb in a 16-bit organization (vs MT40A512M16TB-062E:R)
- Wide operating temperature range options (vs MT40A512M16TD-062E AIT:R)
- Automotive grade availability (vs MT40A512M16TD-062E AUT:R)
Design Notes
For DDR4 routing, maintain controlled impedance of 40-50 ohms for single-ended signals and 80-100 ohms for differential pairs. Keep trace lengths matched within +/- 10 mils for data and address/command groups. Use a solid ground plane beneath the memory device and provide adequate decoupling capacitors (0.1uF and 1uF) close to each VDD and VDDQ pin.
The MT40A512M16TD-062E can dissipate significant power at high data rates. Ensure adequate airflow or a heatsink if the device is operated near its maximum temperature rating. The maximum operating temperature is 95C (case). For high-density modules, consider thermal simulation to verify junction temperature stays within limits.
Use on-die termination (ODT) settings to match the memory bus impedance and reduce reflections. Micron provides recommended ODT values in the datasheet. Also, ensure the memory controller's drive strength is configured appropriately for the trace length and loading. For high-speed operation, perform signal integrity simulations to verify eye diagrams.
Compliance Information
RoHS compliant per distributor listings. AEC-Q100 not applicable for standard commercial grade; automotive variant (AUT) is qualified.
