RTAX2000S-CG624PROTO - 2M-Gate Rad-Tolerant FPGA CCGA-624 | Microchip
MPN: RTAX2000S-CG624PROTO ✓ Active| Qty | Unit Price | Extended |
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Drop-in alternatives for RTAX2000S-CG624PROTO — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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RTAX2000S-1CG624PROTO
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View Datasheet →RTAX2000SL-1CG624PROTO
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View Datasheet →RTAX2000SL-CGS624B
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View Datasheet →RTAX2000S-1CGS624V
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$3950 / Unit
View Datasheet →RTAX2000S-CGS624V
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View Datasheet →RTAX2000S-CG624PROTO Maximum Ratings & Electrical Characteristics
| Family | RTAX-S Radiation-Tolerant FPGA |
| System Gates | 2,000,000 |
| Logic Cells (R-cells) | 21,504 |
| D-Flip-Flops (Registers) | 32,256 |
| Logic Architecture | CMOS antifuse (OTP), SEU-hardened |
| Package | CCGA-624 (ceramic column grid array, 624 balls) |
| Mounting Type | Surface Mount |
| Operating Temperature | -55C to +125C |
| Logic Family | CMOS |
| Configuration | Live at power-up (non-volatile antifuse) |
| SEU Immunity | SEU rate < 10^-10 errors/bit-day (per family datasheet) |
| Prototyping Variant | Yes (PROTO suffix) |
| Embedded Memory | Embedded SRAM blocks (FIFO / dual-port capable) |
| I/O Standards | Single-ended and differential (P/N pin pairs) |
| Design Software | Microsemi/Microchip Libero SoC |
RTAX2000S-CG624PROTO ccga-624 (ceramic column grid array, 624 balls) Pin Configuration Guide
Complete pinout information for RTAX2000S-CG624PROTO (ccga-624 (ceramic column grid array, 624 balls) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for RTAX2000S-CG624PROTO.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
RTAX2000S-CG624PROTO is suitable for 6 applications: Satellite Payload Data Processing, Spacecraft Telemetry, Tracking and Command (TT&C), Attitude Determination and Control Electronics, Radiation-Tolerant Glue Logic and Bus Interfaces, Instrumentation and Sensor Front-End Processing, Launch Vehicle and Reentry Avionics Prototyping.
Satellite Payload Data Processing
The RTAX2000S-CG624PROTO fits satellite payload data processing because its 2,000,000 system gates and 21,504 SEU-hardened R-cells provide the capacity to implement channelization, compression, and framing functions directly in one radiation-tolerant device. Its SEU rate below 10^-10 errors/bit-day eliminates the need for triple-module redundancy on registers, saving logic resources and timing margin compared to SEU-soft FPGAs requiring full TMR. In the payload chain the device typically sits between ADC/front-end circuitry and the telemetry downlink, using embedded SRAM blocks for FIFO buffering and its differential P/N I/O pairs for high-speed source-synchronous links. Prototyping with the PROTO variant lets teams validate RTL and pin maps in the exact CG624 footprint before committing expensive flight units.
Recommended
Spacecraft Telemetry, Tracking and Command (TT&C)
For TT&C subsystems, the RTAX2000S-CG624PROTO provides live-at-power-up antifuse configuration, meaning command decoders and safety logic are functional the instant spacecraft power is applied - a property flash- and SRAM-based FPGAs cannot guarantee without a boot device. Its single-chip form factor removes external configuration PROMs, improving reliability in the command path where a configuration-read failure could disable spacecraft control. The -55C to +125C operating range covers launch and eclipse thermal environments, and the ceramic CCGA-624 package withstands vibration and thermal cycling. Low static power suits the power-constrained TT&C budget. Engineers prototype the command decoder in the PROTO device, then order flight parts in the same CG624 footprint with identical pin assignments.
Recommended
Attitude Determination and Control Electronics
Attitude control systems benefit from the RTAX2000S's deterministic, SEU-hardened fabric: star-tracker interface, gyro data fusion, and wheel/torque-rod PWM drive logic can all reside in one 2M-gate device with an SEU rate below 10^-10 errors/bit-day, preventing a single-event upset from issuing an erroneous actuator command. The 32,256 flip-flops provide ample pipeline depth for control-loop mathematics, while embedded SRAM blocks hold calibration tables. Live-at-power-up operation ensures control logic is available during critical separation and sun-acquisition sequences without configuration boot delay. Prototyping on the CG624 PROTO device with the Aldec adaptor or Axcelerator conversion flow allows control-law iteration on reprogrammable hardware before freezing the antifuse design.
Recommended
Radiation-Tolerant Glue Logic and Bus Interfaces
The RTAX2000S-CG624PROTO consolidates ASIC-replacement glue logic - address decoding, bus bridges (MIL-STD-1553, SpaceWire front ends), voltage/temperature monitoring aggregation - into a single radiation-tolerant chip. Its 624-ball CCGA package offers enough user I/O to absorb dozens of legacy discrete-logic functions, cutting component count and board area in spacecraft avionics. Because the antifuse fabric is one-time programmable and immune to configuration upsets, interface logic cannot be corrupted by SEUs in a configuration memory, a key advantage over SRAM FPGAs in bus-interface roles. The 21,504 R-cells easily absorb legacy 1553 and discrete interface cores, and the CMOS process keeps static power within card-level budgets. Prototyping validates pin maps on real CG624 boards.
Recommended
Instrumentation and Sensor Front-End Processing
Scientific instruments on science and Earth-observation missions use the RTAX2000S to perform real-time sensor preprocessing: correlators for synthetic-aperture radar, histogramming for particle detectors, and CCD/CMOS image pipeline formatting. The 2M-gate fabric with 32,256 registers supports parallel datapaths at the family's hundreds-of-MHz clock rates, while the SEU-hardened registers keep accumulated science data valid across the mission's radiation environment without software scrubbing of configuration. The CG624 ceramic package supports the pin count needed for multi-channel sensor interfaces, including differential P/N pairs for low-noise signal capture. The PROTO variant enables algorithm validation with the Aldec ProASIC3E-based adaptor so the final antifuse image is flight-proven before submission.
Recommended
Launch Vehicle and Reentry Avionics Prototyping
Launch-vehicle flight computers and stage-separation controllers use RTAX-S devices because live-at-power-up antifuse logic removes boot-time configuration risk during the seconds of flight where software reconfiguration is impossible. The RTAX2000S-CG624PROTO is the vehicle for developing these designs: the AC170 flow converts the RTAX-S design to an Axcelerator device for functional prototyping, and the Aldec adaptor maps ProASIC3E reprogrammable silicon into the CG624 footprint for board-level bring-up. The -55C to +125C range and ceramic package cover booster thermal and vibration profiles. Since the reverse flow is not permitted, teams complete place-and-route, timing verification, and simulation against the RTAX2000S target before ordering flight units.
Recommended
Recommended Products Summary
Engineering reference data for RTAX2000S-CG624PROTO — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | RTAX2000S-1CG624PROTO | RTAX2000SL-1CG624PROTO | RTAX2000SL-CGS624B | RTAX2000S-1CGS624V | RTAX2000S-CGS624V |
|---|---|---|---|---|---|---|
| Package | CCGA-624 | CCGA-624 - same | CCGA-624 - same | CCGA-624 (CGS624 option) - same footprint | CCGA-624 (CGS624 option) - same footprint | CCGA-624 (CGS624 option) - same footprint |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 2,000,000 | 2,000,000 | 2,000,000 | 2,000,000 | 2,000,000 | 2,000,000 |
| Logic Cells (R-cells) | 21,504 | 21,504 | 21,504 | 21,504 | 21,504 | 21,504 |
| Speed Grade | Standard | -1 (faster) | -1 (faster, SL silicon) | Standard (SL silicon) | -1 (faster) | Standard |
| Configuration | Antifuse OTP, live at power-up | Antifuse OTP, live at power-up | Antifuse OTP, live at power-up | Antifuse OTP, live at power-up | Antifuse OTP, live at power-up | Antifuse OTP, live at power-up |
| Operating Temperature | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C |
| Proto (Reprogrammable Emulation) Support | Yes - PROTO flow (AC170 / Aldec adaptor) | Yes - PROTO flow | Yes - PROTO flow | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Faster timing headroom at identical footprint (vs RTAX2000S-1CG624PROTO)
- SEU-hardened registers remove TMR overhead (vs SRAM-based radiation-tolerant FPGAs (e.g., Xilinx Virtex-QV class))
- Live-at-power-up single-chip configuration (vs SRAM FPGA alternatives)
- PROTO flow with reprogrammable emulation (vs RTAX2000S-1CGS624V)
Design Notes
Do not treat the PROTO device as a flight part. Per Microchip application note AC170, design, pin assignment, place-and-route, timing verification, and simulation must all be done against the RTAX-S/SL device; the Libero SoC conversion to Axcelerator (or the Aldec ProASIC3E-based CG624 adaptor) is for functional prototyping only, and the reverse flow is not permitted. Flight units must be ordered under the correct flight-grade ordering P/N with the required screening flow. Ordering PROTO parts for flight is a program-level compliance failure.
The CG624 ceramic column grid array uses solder columns rather than solder balls, so PCB land patterns and reflow profiles differ from standard BGA practice. Follow the land pattern in the RTAX-S/SL datasheet package section and Microchip/Microsemi ceramic-CGA application guidance: use the specified pad geometry to accommodate column standoff tolerances, and consider X-ray inspection at column joints since hidden voids in CCGA joints are a common space-hardware defect. Thermal cycling screening per the program qualification flow is recommended for column-joint integrity.
Although the antifuse fabric is live at power-up, ensure the power rails sequence within the datasheet limits and that decoupling follows the datasheet recommendation for the CG624 package. The device consumes low static power, but dynamic power scales with clock frequency and toggle rate - for payload datapaths running at hundreds of MHz, run a power estimate in Libero SoC and size the rail converter accordingly. Estimated: dynamic power should be budgeted per Libero power-analysis output rather than from static datasheet figures alone.
Use the dedicated P/N pin pairs for differential I/O standards and match trace lengths within the datasheet skew budget. Because the antifuse design is one-time programmable, any I/O standard or termination error discovered after programming requires a new device - complete full IBIS-based signal-integrity simulation and board-level timing closure before submitting the programming file. Verify that bank voltage assignments in Libero match the PCB power planes for every I/O bank in the CG624 pinout.
Compliance Information
Compliance data not present in verified web data. Space-grade ceramic-packaged devices frequently have specific exemption status; confirm RoHS/REACH status via the Microchip product page or official certificate of conformance.
