RTAX4000SL-1CQ352EV - 4M Gate Rad-Tolerant FPGA 352-Pin CQFP | Microchip
MPN: RTAX4000SL-1CQ352EV ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
Drop-in alternatives for RTAX4000SL-1CQ352EV — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
RTAX4000SL-CQ352EV
✅ Drop-In✓ In Stock
$10250 / Unit
View Datasheet →RTAX4000SL-1CQ352E
✅ Drop-In✓ In Stock
$3840 / Unit
View Datasheet →RTAX4000SL-CQ352PROTO
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →RTAX4000DL-1CQ352E
✅ Drop-In✓ In Stock
$3300 / Unit
View Datasheet →RTAX4000DL-1CQ352V
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →RTAX2000SL-1CQ352V
✅ Drop-In✓ In Stock
$2050 / Unit
View Datasheet →RTAX4000SL-1CQ352EV Maximum Ratings & Electrical Characteristics
| Family | RTAX-SL (Radiation-Tolerant FPGA) |
| Equivalent System Gates | 4000000 |
| Logic Cells | 40320 |
| Core Supply Voltage | 1.5 V |
| Process Technology | 0.15 um CMOS |
| Speed Grade | 1 |
| Package | 352-pin Ceramic CQFP (CQ352) |
| JESD-30 Package Code | S-CQFP-F352 |
| Configuration Technology | Antifuse (live at power-up, single chip) |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Clock Resources | Segmentable clock conditioning circuits |
| Mounting Type | Surface Mount |
| Application Domain | Space-flight systems (radiation tolerant) |
RTAX4000SL-1CQ352EV s-cqfp-f352 Pin Configuration Guide
Complete pinout information for RTAX4000SL-1CQ352EV (s-cqfp-f352 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for RTAX4000SL-1CQ352EV.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
RTAX4000SL-1CQ352EV is suitable for 6 applications: Satellite Payload Processing, Spacecraft Avionics and Bus Control, Telemetry and Telecommand Interfaces, Space Sensor Interface and Glue Logic, Launcher and Reentry Vehicle Electronics, Deep-Space Instrument Data Handling.
Satellite Payload Processing
The RTAX4000SL-1CQ352EV fits satellite payload processing because its 4 million equivalent system gates and 40,320 logic cells provide enough capacity for on-board data compression, packet routing, and sensor pre-processing, while the 1.5 V core and SL low-power process keep static and dynamic power within solar-array budgets. Its antifuse configuration is live at power-up, so the payload FPGA requires no configuration device and cannot suffer configuration-memory SEUs during orbit insertion. Placed between payload sensors and the spacecraft data-handling unit, it implements wide parallel interfaces across the CQFP-352's generous I/O count; embedded SRAM FIFOs buffer sensor streams, and the segmentable clock conditioning circuits generate clean per-domain clocks. The trade-off versus SRAM-based space FPGAs is reduced design flexibility since antifuse programming is one-time.
Recommended
Spacecraft Avionics and Bus Control
Spacecraft avionics benefit from the RTAX4000SL-1CQ352EV because the device implements flight-data interfaces (MIL-STD-1553-style protocol cores, UARTs, and discrete I/O) in a single ceramic CQFP-352 package with 4M gates of capacity and deterministic, single-chip live-at-power-up startup demanded by fault-tolerant avionics architectures. The 0.15 um RTAX-SL process carries extensive flight heritage, and the antifuse fabric is immune to configuration upsets that would otherwise require scrubbing controllers. In the avionics chain it typically sits between the onboard computer and the power/telemetry distribution electronics, handling real-time control loops with segmented clock domains per subsystem. The 1.5 V core rail eases integration with modern 1.5-3.3 V mixed avionics supplies, while the ceramic hermetic package supports the thermal and outgassing requirements of sealed avionics enclosures.
Recommended
Telemetry and Telecommand Interfaces
Telemetry/telecommand (TM/TC) front ends use the RTAX4000SL-1CQ352EV because its 40,320 cells absorb frame formatting, convolutional or LDPC-adjacent framing logic, and redundant command-decoder implementations, while embedded SRAM FIFOs with built-in control logic buffer downlink bursts without external memory. Live-at-power-up antifuse configuration means the TM/TC chain is operational before any processor boots, a compliance requirement on many launchers and spacecraft buses. Interfacing between receivers and the baseband section, the FPGA maps TM/TC signal pairs onto dedicated I/O banks of the CQFP-352 package with 1.5 V core and 3.3 V-tolerant I/O options. The main consideration is one-time programmability: command-decoder updates require flight-spare management or dual-string redundancy, so verification effort concentrates in simulation before flight lot programming.
Recommended
Space Sensor Interface and Glue Logic
Star trackers, sun sensors, and reaction-wheel interfaces consolidate well into the RTAX4000SL-1CQ352EV: the 4M-gate fabric handles time-counter arrays, encoder decoding, and LVDS-adjacent capture logic, while the SL process variant limits idle power for missions where sensors are duty-cycled. Because the device is a true single-chip solution, sensor interface cards avoid configuration flash whose upsets would corrupt timing-critical measurement latches; live-at-power-up operation is available the instant power is applied during orbital eclipse recovery. The CQFP-352's 352 ceramic terminals provide generous pin count for parallel sensor buses, and segmentable clock conditioning lets each sensor domain run at its own rate with clean edge placement. Designers should budget I/O standards carefully, since RTAX-S I/O banks constrain mixed-voltage groupings per the datasheet banking rules.
Recommended
Launcher and Reentry Vehicle Electronics
Launch-vehicle and reentry electronics demand deterministic startup and extreme robustness, which the RTAX4000SL-1CQ352EV delivers through antifuse live-at-power-up configuration: sequencing logic, safety-critical interlocks, and flight-event timing operate the moment rails stabilize, with no boot device to fail under shock and vibration. The hermetic 352-pin ceramic CQFP package withstands the thermal cycling and mechanical stress profiles typical of booster electronics while providing solderable gull-wing leads for inspection. With 4 million system gates and 40,320 cells, a single device consolidates redundant-channel voting and event sequencing that would otherwise require multiple rad-hard ASICs, shortening qualification schedules at 1.5 V core power. The one-time-programmable fabric is actually an advantage here, as certified flight loads cannot be altered in the field.
Recommended
Deep-Space Instrument Data Handling
Deep-space science instruments choose the RTAX4000SL-1CQ352EV for its combination of 4M-gate capacity and the radiation tolerance that Jovian or solar-probe environments demand. Instrument sequencers, histogram engines, and compression pre-processors fit in the 40,320-cell fabric, and embedded SRAM FIFOs stage science data between instrument front ends and the spacecraft mass-memory unit. The SL low-power flow matters at outer-planet distances where every watt of RTG power is precious, and the antifuse architecture eliminates scrubbing controllers and their failure modes on multi-year cruises. The ceramic CQFP-352 supports reliable, inspectable assembly for instruments that cannot be serviced. Mission planners should procure early: flight-grade lot acceptance testing for these devices extends lead times substantially, and lot-specific radiation reports should be archived in the instrument's reliability documentation.
Recommended
Recommended Products Summary
Engineering reference data for RTAX4000SL-1CQ352EV — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | RTAX4000SL-CQ352EV | RTAX4000SL-1CQ352E | RTAX4000DL-1CQ352E | RTAX4000DL-1CQ352V | RTAX2000SL-1CQ352V |
|---|---|---|---|---|---|---|
| Package | 352-pin Ceramic CQFP (CQ352) | 352-pin Ceramic CQFP - same | 352-pin Ceramic CQFP - same | 352-pin Ceramic CQFP - same | 352-pin Ceramic CQFP - same | 352-pin Ceramic CQFP - same |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent System Gates | 4,000,000 | 4,000,000 | 4,000,000 | 4,000,000 | 4,000,000 | 2,000,000 |
| Logic Cells | 40320 | 40320 | 40320 | 40320 | 40320 | 21504 |
| Process Variant | SL (low-power) | SL (low-power) | SL (low-power) | DL (standard) | DL (standard) | SL (low-power) |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Speed Grade | 1 | standard (per ordering code) | 1 | 1 | 1 | 1 |
| Configuration Technology | Antifuse (live at power-up) | Antifuse (live at power-up) | Antifuse (live at power-up) | Antifuse (live at power-up) | Antifuse (live at power-up) | Antifuse (live at power-up) |
| Typical Availability | Quote-based (order on request) | Site MPN, quote-based | Site MPN, quote-based | Site MPN, quote-based | Site MPN, quote-based | Site MPN, quote-based |
Key Differentiators
- SL low-power process variant (vs RTAX4000DL-1CQ352E)
- 4M-gate density on a 352-pin ceramic footprint (vs RTAX2000SL-1CQ352V)
- Live-at-power-up antifuse configuration (vs RTAX4000SL-CQ352PROTO)
- Speed grade 1 ordering option (vs RTAX4000SL-CQ352EV)
Design Notes
RTAX-S devices are one-time programmable antifuse FPGAs: once programmed at the qualified programming house, the design cannot be changed. Never skip full functional simulation, static timing analysis, and radiation-margin review before releasing the programming file. Microchip's application note 'Prototyping for RTAX-S and RTAX-SL Devices' recommends prototyping on a footprint-compatible adapter board with a commercial device, then migrating via EDIF netlist and pinout converter - build this prototyping path into the schedule so errors are caught on the prototype, not on the flight lot.
The RTAX4000SL operates from a 1.5 V core supply with a 0.15 um CMOS fabric. Estimate core current from the Libero power calculator using your actual design utilization, toggle rates, and clock tree loading - a 40,320-cell design at high utilization can draw substantial static plus dynamic power even in the low-power SL flow. Verify the spacecraft power budget at worst-case radiation and temperature corners, and provide adequate decoupling on both core and I/O rails with low-ESR ceramics placed at the CQFP-352 corner power/ground pin groups.
The ceramic CQFP (JESD-30 S-CQFP-F352) has gull-wing leads on a 352-terminal perimeter. Follow the Microchip RTAX-S datasheet mechanical drawing for the land pattern, and design for lead coplanarity inspection, since ceramic package leads are sensitive to handling damage. Route high-speed clock and strobe pairs with matched lengths, respect I/O bank voltage groupings when mapping signal standards, and connect every designated power and ground pin - floating even one corner pin group can degrade signal integrity and increase ground bounce across the perimeter ring.
Use the segmentable clock conditioning circuits to partition clock domains by subsystem rather than running one global clock; this reduces simultaneous switching noise on the CQFP perimeter and eases timing closure across the 40,320-cell fabric. For interfaces leaving the package, check I/O standard drive and slew settings in Libero against flight harness capacitance, and terminate single-ended lines at the receiver per the datasheet I/O characteristics rather than relying on source termination alone.
Compliance Information
Ceramic hermetic space-grade package; aerospace device compliance (e.g., RoHS exemptions for hi-rel ceramic packaging) must be confirmed with Microchip for the specific ordering code and lot.