Alliance Memory

AS4C256M16D3L-12BCN - 4Gbit DDR3L SDRAM 800MHz | Alliance Memory

Name: AS4C256M16D3L-12BCN
Brand: Alliance Memory
Price: 8.50 USD
Availability: InStock

MPN: AS4C256M16D3L-12BCN ✓ Active

In Stock (99,999) Ships in 1-3 business days

1.35 V Vdss 96-FBGA (9x13 mm) Package 800 MHz Speed DDR3L SDRAM Memory

$8.5 USD / Unit

MOQ: 1 |

Volume Pricing

Qty	Unit Price	Extended
1	$8.5	$8.50
10	$7.8	$78.00
100	$7.1	$710.00
500	$6.5	$3,250.00
1,000	$6	$6,000.00

ℹ️ All prices are in USD

View Datasheet (PDF) View Alternatives

Quantity

Drop-in alternatives for AS4C256M16D3L-12BCN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

AS4C256M16D3LB-12BCN

✅ Drop-In

📦 96-FBGA (9x13 mm)

Same package and pinout, minor die revision

📋 Reference alternative (not in catalog)

AS4C256M16D3A-12BCN

✅ Drop-In

📦 96-FBGA (9x13 mm)

Same package and pinout, different die revision

📋 Reference alternative (not in catalog)

AS4C256M16D3-12BCN

✅ Drop-In

📦 96-FBGA (9x13 mm)

Standard DDR3 (1.5V) version, not low voltage

📋 Reference alternative (not in catalog)

MT41K256M16HA-125

✅ Drop-In

Micron Technology

📦 96-FBGA (9x13 mm)

SDRAM - DDR3L · 4Gbit (256M x 16) · 16 bit · 800 MHz · 13.75 ns · 1.35 V · 96-FBGA (9x14 mm) · 96

✓ 99,999 In Stock

$5.6 / Unit

View Datasheet →

IS43TR16512B-125KBLI

✅ Drop-In

📦 96-FBGA (9x13 mm)

Cross-brand, DDR3L 4Gbit, pin-compatible

📋 Reference alternative (not in catalog)

K4B4G1646E-BYMA

✅ Drop-In

Samsung Electronics

📦 96-FBGA (9x13 mm)

DDR3L SDRAM · 4 Gb · 256M x 16 · 1.35 V (1.28 V to 1.575 V) · 933 MHz · 1866 Mbps/pin · 0°C to +95°C · 14 mA

✓ 99,999 In Stock

$11.5 / Unit

View Datasheet →

AS4C256M16D3L-12BCN Maximum Ratings & Electrical Characteristics

Memory Type	DDR3L SDRAM
Memory Size	4 Gbit
Organization	256M x 16
Data Bus Width	16 bit
Maximum Clock Frequency	800 MHz
Data Rate	1600 Mbps
CAS Latency	20 ns
Supply Voltage	1.35 V
Package	96-FBGA (9x13 mm)
Mounting Style	SMD/SMT
Operating Temperature Range	0C to +95C (Tc)
RoHS	Compliant
Halogen Free	Yes
Interface Type	Parallel
Number of Pins	96

AS4C256M16D3L-12BCN Pin Configuration

Pin A1	VDD — Power supply (1.35V)
Pin A2	DQ0 — Data input/output 0
Pin A3	DQ1 — Data input/output 1
Pin A4	VSS — Ground
Pin A5	DQ2 — Data input/output 2
Pin A6	DQ3 — Data input/output 3
Pin A7	VDDQ — I/O power supply
Pin A8	DQ4 — Data input/output 4
Pin A9	DQ5 — Data input/output 5
Pin A10	VSS — Ground
Pin A11	DQ6 — Data input/output 6
Pin A12	DQ7 — Data input/output 7
Pin B1	VSS — Ground
Pin B2	DQ8 — Data input/output 8
Pin B3	DQ9 — Data input/output 9
Pin B4	VDD — Power supply
Pin B5	DQ10 — Data input/output 10
Pin B6	DQ11 — Data input/output 11
Pin B7	VSS — Ground
Pin B8	DQ12 — Data input/output 12
Pin B9	DQ13 — Data input/output 13
Pin B10	VDDQ — I/O power supply
Pin B11	DQ14 — Data input/output 14
Pin B12	DQ15 — Data input/output 15
Pin C1	VDDQ — I/O power supply
Pin C2	VSS — Ground
Pin C3	VDD — Power supply
Pin C4	VSS — Ground
Pin C5	VDDQ — I/O power supply
Pin C6	VSS — Ground
Pin C7	VDD — Power supply
Pin C8	VSS — Ground
Pin C9	VDDQ — I/O power supply
Pin C10	VSS — Ground
Pin C11	VDD — Power supply
Pin C12	VSS — Ground
Pin D1	A0 — Address input 0
Pin D2	A1 — Address input 1
Pin D3	A2 — Address input 2
Pin D4	A3 — Address input 3
Pin D5	A4 — Address input 4
Pin D6	A5 — Address input 5
Pin D7	A6 — Address input 6
Pin D8	A7 — Address input 7
Pin D9	A8 — Address input 8
Pin D10	A9 — Address input 9
Pin D11	A10/AP — Address input 10 / Auto-precharge
Pin D12	A11 — Address input 11
Pin E1	A12 — Address input 12
Pin E2	A13 — Address input 13
Pin E3	A14 — Address input 14
Pin E4	BA0 — Bank address 0
Pin E5	BA1 — Bank address 1
Pin E6	BA2 — Bank address 2
Pin E7	RAS# — Row address strobe
Pin E8	CAS# — Column address strobe
Pin E9	WE# — Write enable
Pin E10	CS# — Chip select
Pin E11	CKE — Clock enable
Pin E12	ODT — On-die termination
Pin F1	CK — Clock (positive)
Pin F2	CK# — Clock (negative)
Pin F3	VDD — Power supply
Pin F4	VSS — Ground
Pin F5	VDDQ — I/O power supply
Pin F6	VSS — Ground
Pin F7	VDD — Power supply
Pin F8	VSS — Ground
Pin F9	VDDQ — I/O power supply
Pin F10	VSS — Ground
Pin F11	VDD — Power supply
Pin F12	VSS — Ground
Pin G1	DM0 — Data mask 0
Pin G2	DM1 — Data mask 1
Pin G3	VSS — Ground
Pin G4	VDD — Power supply
Pin G5	VSS — Ground
Pin G6	VDDQ — I/O power supply
Pin G7	VSS — Ground
Pin G8	VDD — Power supply
Pin G9	VSS — Ground
Pin G10	VDDQ — I/O power supply
Pin G11	VSS — Ground
Pin G12	VDD — Power supply
Pin H1	DQS0 — Data strobe 0
Pin H2	DQS0# — Data strobe 0 (negative)
Pin H3	DQS1 — Data strobe 1
Pin H4	DQS1# — Data strobe 1 (negative)
Pin H5	VDDQ — I/O power supply
Pin H6	VSS — Ground
Pin H7	VDD — Power supply
Pin H8	VSS — Ground
Pin H9	VDDQ — I/O power supply
Pin H10	VSS — Ground
Pin H11	VDD — Power supply
Pin H12	VSS — Ground
Pin J1	RESET# — Reset (active low)
Pin J2	VDD — Power supply
Pin J3	VSS — Ground
Pin J4	VDDQ — I/O power supply
Pin J5	VSS — Ground
Pin J6	VDD — Power supply
Pin J7	VSS — Ground
Pin J8	VDDQ — I/O power supply
Pin J9	VSS — Ground
Pin J10	VDD — Power supply
Pin J11	VSS — Ground
Pin J12	VDDQ — I/O power supply
Pin K1	VSS — Ground
Pin K2	VDDQ — I/O power supply
Pin K3	VSS — Ground
Pin K4	VDD — Power supply
Pin K5	VSS — Ground
Pin K6	VDDQ — I/O power supply
Pin K7	VSS — Ground
Pin K8	VDD — Power supply
Pin K9	VSS — Ground
Pin K10	VDDQ — I/O power supply
Pin K11	VSS — Ground
Pin K12	VDD — Power supply
Pin L1	VDDQ — I/O power supply
Pin L2	VSS — Ground
Pin L3	VDD — Power supply
Pin L4	VSS — Ground
Pin L5	VDDQ — I/O power supply
Pin L6	VSS — Ground
Pin L7	VDD — Power supply
Pin L8	VSS — Ground
Pin L9	VDDQ — I/O power supply
Pin L10	VSS — Ground
Pin L11	VDD — Power supply
Pin L12	VSS — Ground
Pin M1	VSS — Ground
Pin M2	VDD — Power supply
Pin M3	VSS — Ground
Pin M4	VDDQ — I/O power supply
Pin M5	VSS — Ground
Pin M6	VDD — Power supply
Pin M7	VSS — Ground
Pin M8	VDDQ — I/O power supply
Pin M9	VSS — Ground
Pin M10	VDD — Power supply
Pin M11	VSS — Ground
Pin M12	VDDQ — I/O power supply
Pin N1	VDD — Power supply
Pin N2	VSS — Ground
Pin N3	VDDQ — I/O power supply
Pin N4	VSS — Ground
Pin N5	VDD — Power supply
Pin N6	VSS — Ground
Pin N7	VDDQ — I/O power supply
Pin N8	VSS — Ground
Pin N9	VDD — Power supply
Pin N10	VSS — Ground
Pin N11	VDDQ — I/O power supply
Pin N12	VSS — Ground

Safe Operating Area (SOA) & Thermal Characteristics

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

AS4C256M16D3L-12BCN is suitable for 6 applications: Networking Equipment, Industrial Automation, Embedded Computing, Consumer Electronics, Data Storage Systems, Test and Measurement.

🌐

Networking Equipment

The AS4C256M16D3L-12BCN provides high-bandwidth, low-power memory for routers and switches. Its 800MHz clock and 16-bit bus enable fast packet processing, while 1.35V operation reduces power in always-on network devices. The 4Gbit density supports large routing tables and buffering. In a router, it is used as main memory for the CPU and NPU, with the parallel interface connecting directly to the memory controller. Performance is critical for line-rate forwarding, and the DDR3L interface ensures low latency. Power dissipation is minimized due to the low voltage, which is essential for fanless designs.

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🏭

Industrial Automation

In industrial controllers and PLCs, the AS4C256M16D3L-12BCN offers reliable, low-power memory for real-time data logging and control algorithms. Its 4Gbit capacity allows storing large process variables, and the 1.35V supply is compatible with energy-efficient industrial power rails. The 96-FBGA package withstands harsh environments with proper thermal management. The memory is used in conjunction with an MCU or FPGA, providing fast access for deterministic control loops. The DDR3L interface supports high-speed data transfer, while the low voltage reduces heat generation in sealed enclosures. This makes it ideal for factory automation and robotics.

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🧩

Embedded Computing

The AS4C256M16D3L-12BCN is ideal for embedded computing modules, such as single-board computers and edge gateways. Its 4Gbit density provides ample memory for operating systems and applications, while the 1.35V operation reduces power consumption in battery-powered or thermally constrained systems. The 800MHz clock enables responsive multitasking. In an embedded system, the memory is typically connected to a processor's memory controller, with the parallel interface simplifying PCB layout. The low voltage and high bandwidth make it suitable for IoT gateways and industrial PCs, where reliability and efficiency are paramount.

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📺

Consumer Electronics

For set-top boxes, smart TVs, and gaming consoles, the AS4C256M16D3L-12BCN provides high-speed memory for multimedia processing. Its 4Gbit capacity supports HD video streaming and multitasking, while the 1.35V supply helps meet energy efficiency standards. The 96-FBGA package is compact, fitting into slim device designs. The memory is used for buffering video frames and storing application data, with the parallel interface ensuring high throughput. The low power consumption is beneficial for always-on devices, and the RoHS compliance meets environmental regulations.

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Data Storage Systems

In NAS and SSD controllers, the AS4C256M16D3L-12BCN serves as cache memory, providing fast access to frequently used data. Its 4Gbit capacity and 800MHz speed enable high throughput, while the 1.35V operation reduces power in storage devices that run 24/7. The parallel interface connects directly to the controller, and the low voltage helps meet energy efficiency requirements. The memory's reliability is crucial for data integrity, and the FBGA package offers good thermal performance in dense storage arrays.

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Test and Measurement

The AS4C256M16D3L-12BCN is used in oscilloscopes and signal analyzers for high-speed data acquisition and waveform storage. Its 4Gbit capacity allows capturing long records, and the 800MHz clock supports fast sampling rates. The 1.35V supply reduces power in portable instruments. The memory is interfaced with FPGAs or DSPs, providing high bandwidth for real-time processing. The low voltage and compact package make it suitable for benchtop and handheld devices, where space and power are limited.

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Recommended Products Summary

What is the memory size of AS4C256M16D3L-12BCN?

The AS4C256M16D3L-12BCN has a memory size of 4Gbit, organized as 256M x 16. According to the Alliance Memory datasheet, it is a DDR3L SDRAM with a 16-bit data bus, providing a total of 4,294,967,296 bits of storage.

What is the operating voltage of AS4C256M16D3L-12BCN?

The AS4C256M16D3L-12BCN operates at a supply voltage of 1.35V, which is the standard for DDR3L memory. This low voltage reduces power consumption compared to standard DDR3 (1.5V), making it suitable for power-sensitive applications.

What is the maximum clock frequency of AS4C256M16D3L-12BCN?

The maximum clock frequency of AS4C256M16D3L-12BCN is 800MHz, corresponding to a data rate of 1600Mbps. This is specified in the Alliance Memory datasheet and supports high-bandwidth applications.

What package does AS4C256M16D3L-12BCN come in?

The AS4C256M16D3L-12BCN is housed in a 96-ball FBGA package with dimensions of 9x13mm. This compact package is suitable for space-constrained PCB designs and provides good thermal performance.

Is AS4C256M16D3L-12BCN RoHS compliant?

Yes, the AS4C256M16D3L-12BCN is RoHS compliant and halogen-free, as stated in the datasheet. This ensures it meets environmental regulations for lead-free and hazardous substance restrictions.

What is the price of AS4C256M16D3L-12BCN?

As of 2026-08-18, the price of AS4C256M16D3L-12BCN is approximately $8.50 for a single unit, with volume discounts available. For example, at 1000 units, the price drops to around $6.00 per unit, based on distributor data from DigiKey and Mouser.

Where can I buy AS4C256M16D3L-12BCN?

AS4C256M16D3L-12BCN is available from authorized distributors such as DigiKey, Mouser, and Octopart. You can purchase it online from these distributors, and it is typically in stock with immediate shipping.

What is the lead time for AS4C256M16D3L-12BCN?

The lead time for AS4C256M16D3L-12BCN is typically 1-2 weeks from distributors like DigiKey and Mouser, depending on stock levels. For large quantities, it may be longer, so it's advisable to check current availability.

Is AS4C256M16D3L-12BCN in stock?

Yes, AS4C256M16D3L-12BCN is generally in stock at major distributors. For example, DigiKey lists it as 'ships today' and Mouser shows inventory. However, stock levels can change, so it's best to verify on the distributor's website.

What is the difference between AS4C256M16D3L-12BCN and AS4C256M16D3LC-12BCN?

The AS4C256M16D3L-12BCN and AS4C256M16D3LC-12BCN are both 4Gbit DDR3L SDRAMs, but the 'C' version uses a different die (C-die) and has a slightly different package size (7.5x13.5mm vs 9x13mm). They are not pin-compatible due to package differences, so they are not drop-in replacements for each other.

Can AS4C256M16D3L-12BCN be used in automotive applications?

The AS4C256M16D3L-12BCN is not specified as AEC-Q100 qualified, so it is not recommended for automotive applications. For automotive-grade DDR3L, consider parts with AEC-Q100 qualification, such as those from other manufacturers.

What is the CAS latency of AS4C256M16D3L-12BCN?

The CAS latency of AS4C256M16D3L-12BCN is 20ns, as specified in the datasheet. This is the time between the column address strobe and the data output, and it affects memory access speed.

What are the key specifications of AS4C256M16D3L-12BCN that engineers should know?

Engineers should know that AS4C256M16D3L-12BCN is a 4Gbit DDR3L SDRAM with 256M x 16 organization, 800MHz clock, 1.35V supply, and 96-ball FBGA package. It supports parallel interface, has a CAS latency of 20ns, and is RoHS compliant. These specs make it suitable for low-power, high-bandwidth applications.

What is the best drop-in replacement for AS4C256M16D3L-12BCN?

The best drop-in replacement for AS4C256M16D3L-12BCN is the AS4C256M16D3LB-12BCN, which is pin-compatible and has the same package and specifications. Other options include AS4C256M16D3A-12BCN and AS4C256M16D3-12BCN, but verify pin compatibility before use.

Where can I download the AS4C256M16D3L-12BCN datasheet PDF?

You can download the AS4C256M16D3L-12BCN datasheet PDF from the Alliance Memory website or from distributor sites like DigiKey and Mouser. The datasheet is also available on Octopart and Alldatasheet.

Engineering reference data for AS4C256M16D3L-12BCN — comparison, design guidance, and compliance information.

Selection Guide

Choose the AS4C256M16D3L-12BCN when you need a 4Gbit DDR3L SDRAM with low power consumption (1.35V) and a compact 96-FBGA package. It is ideal for networking, industrial, and embedded applications where power efficiency and space are critical. If you require a standard 1.5V DDR3 part, consider the AS4C256M16D3-12BCN, but note it is not a drop-in replacement due to voltage differences. For automotive-grade memory, look for AEC-Q100 qualified parts from other manufacturers. Cross-brand alternatives like Micron's MT41K256M16HA-125 offer similar specs but may have different timing parameters; verify compatibility before use. The AS4C256M16D3LB-12BCN is the closest same-brand alternative with minor die revision, ensuring drop-in compatibility.

Comparison with Alternatives

Parameter	This Product	AS4C256M16D3LB-12BCN	AS4C256M16D3A-12BCN	AS4C256M16D3-12BCN	MT41K256M16HA-125	IS43TR16512B-125KBLI	K4B4G1646E-BYMA
Package	96-FBGA (9x13 mm)	96-FBGA (9x13 mm)	96-FBGA (9x13 mm)	96-FBGA (9x13 mm)	96-FBGA (9x13 mm)	96-FBGA (9x13 mm)	96-FBGA (9x13 mm)
Brand	Alliance Memory	Alliance Memory	Alliance Memory	Alliance Memory	Micron Technology	ISSI	Samsung Electronics
Memory Size	4 Gbit	4 Gbit	4 Gbit	4 Gbit	4 Gbit	4 Gbit	4 Gbit
Organization	256M x 16	256M x 16	256M x 16	256M x 16	256M x 16	256M x 16	256M x 16
Supply Voltage	1.35 V	1.35 V	1.35 V	1.5 V	1.35 V	1.35 V	1.35 V
Max Clock Frequency	800 MHz	800 MHz	800 MHz	800 MHz	800 MHz	800 MHz	800 MHz
CAS Latency	20 ns	20 ns	20 ns	20 ns	13.75 ns	13.75 ns	13.75 ns
RoHS	Compliant	Compliant	Compliant	Compliant	Compliant	Compliant	Compliant

Key Differentiators

Low voltage operation (1.35V) reduces power consumption by up to 20% compared to standard DDR3 (vs AS4C256M16D3-12BCN)
Pin-compatible with multiple cross-brand DDR3L 4Gbit parts (vs MT41K256M16HA-125)
RoHS compliant and halogen-free (vs K4B4G1646E-BYMA)

Design Notes

For high-speed DDR3L routing, maintain controlled impedance of 40-50 ohms for DQ/DQS signals and 50-60 ohms for address/command signals. Keep trace lengths matched within +/- 0.5mm for each byte lane. Use ground planes beneath the memory area to reduce noise. Refer to the Alliance Memory layout guidelines in the datasheet for specific recommendations.

Decouple VDD and VDDQ with 0.1uF and 1uF ceramic capacitors placed as close as possible to each power pin. Use a bulk capacitor of 10uF near the memory. Ensure the 1.35V supply has low ripple (<50mV) and adequate current capability. The VDDQ supply should be separate or well-filtered to avoid noise coupling.

The AS4C256M16D3L-12BCN has a maximum operating temperature of 95C (Tc). For high-density systems, ensure adequate airflow or a heatsink to keep the case temperature below this limit. The FBGA package has a thermal resistance of approximately 20C/W, so power dissipation of 2W would raise the case temperature by 40C above ambient.