H5TC4G63CFR-H9A - 4Gb DDR3L SDRAM 96-FBGA | SK hynix
N.º da peça: H5TC4G63CFR-H9A ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $8.5 | $8,50 |
| 10 | $7.8 | $78,00 |
| 100 | $7.2 | $720,00 |
| 500 | $6.8 | $3.400,00 |
| 1.000 | $6.5 | $6.500,00 |
H5TC4G63CFR-H9A Visão geral
DDR3L SDRAM is a type of synchronous dynamic random-access memory that operates at a lower voltage (1.35V) compared to standard DDR3 (1.5V), reducing power consumption by up to 20% while maintaining backward compatibility with DDR3 environments. It is part of the DDR3 memory family, which uses double data rate architecture to transfer data on both edges of the clock, achieving high bandwidth. DDR3L is widely used in laptops, embedded systems, and networking equipment where energy efficiency is critical.
Key features include fully differential clock inputs (CK, CK), differential data strobe (DQS, DQS), and an on-chip DLL that aligns DQ, DQS, and DQS transitions with CK transitions. The DM (data mask) function masks write data at both rising and falling edges, ensuring data integrity. The device supports burst lengths of 8 and 4 (with burst chop), and features programmable CAS latency and additive latency for flexible timing.
The H5TC4G63CFR-H9A is designed for high-bandwidth, low-power main memory applications. Its 4Gb density and x16 organization make it ideal for applications requiring large memory capacity with a moderate bus width. The 96-ball TFBGA package offers excellent thermal and electrical performance, with a ball pitch of 0.8mm, facilitating high-density PCB layouts.
Typical applications include laptops and ultrabooks, embedded computing, networking switches and routers, and industrial automation systems. The low operating voltage and high bandwidth make it suitable for battery-powered devices and energy-conscious designs.
When designing with this component, ensure proper decoupling capacitors are placed near the VDD and VDDQ pins to minimize noise. The device requires a stable 1.35V supply and careful signal integrity management for the high-speed data bus. Refer to the datasheet for detailed timing parameters and PCB layout guidelines.
Alternativas drop-in para H5TC4G63CFR-H9A — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com H5TC4G63CFR-H9A (mesmo formato e footprint) — diferindo em Package, Burst Length, Supply Voltage, CAS Latency, Data Rate.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
H5TC4G63AFR-H9A
✅ Drop-In✓ Em estoque
$6.5 / unidade
Ver ficha técnica →H5TC4G63CFR-H9I
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$7.2 / unidade
Ver ficha técnica →H5TC4G63CFR-H9J
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$6 / unidade
Ver ficha técnica →K4B4G1646E-BYK0
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$1.8 / unidade
Ver ficha técnica →MT41K256M16HA-125
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$6.3636 / unidade
Ver ficha técnica →IS43TR16256AL-125KBL
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$5.6 / unidade
Ver ficha técnica →H5TC4G63CFR-H9A Classificações máximas e características elétricas
| Tipo de memória | DDR3L SDRAM |
| Memory Density | 4Gb (4294967296 bit) |
| Organização da memória | 256M x 16 |
| Supply Voltage (VDD) | 1.35V + 0.100 / - 0.067V |
| Supply Voltage (VDDQ) | 1.35V + 0.100 / - 0.067V |
| Encapsulamento | 96-ball TFBGA |
| Number of Terminals | 96 |
| Package Shape | RECTANGULAR |
| Status RoHS | Compliant |
| Lead-Free | Yes |
| Livre de halogênio | Yes |
| Burst Length | 8, 4 (with burst chop) |
| Differential Clock Inputs | Yes (CK, CK) |
| Differential Data Strobe | Yes (DQS, DQS) |
| On-Chip DLL | Yes |
| DM (Data Mask) | Yes |
Configuração de pinos do H5TC4G63CFR-H9A
| Pino A1 | VDD — Power supply |
| Pino A2 | DQ0 — Data input/output 0 |
| Pino A3 | DQ1 — Data input/output 1 |
| Pino A4 | VSS — Ground |
| Pino A5 | DQ2 — Data input/output 2 |
| Pino A6 | DQ3 — Data input/output 3 |
| Pino A7 | VDDQ — Power supply for output |
| Pino A8 | DQ4 — Data input/output 4 |
| Pino A9 | DQ5 — Data input/output 5 |
| Pino A10 | VSS — Ground |
| Pino A11 | DQ6 — Data input/output 6 |
| Pino A12 | DQ7 — Data input/output 7 |
| Pino B1 | VSS — Ground |
| Pino B2 | DQ8 — Data input/output 8 |
| Pino B3 | DQ9 — Data input/output 9 |
| Pino B4 | VDD — Power supply |
| Pino B5 | DQ10 — Data input/output 10 |
| Pino B6 | DQ11 — Data input/output 11 |
| Pino B7 | VSS — Ground |
| Pino B8 | DQ12 — Data input/output 12 |
| Pino B9 | DQ13 — Data input/output 13 |
| Pino B10 | VDDQ — Power supply for output |
| Pino B11 | DQ14 — Data input/output 14 |
| Pino B12 | DQ15 — Data input/output 15 |
| Pino C1 | VDDQ — Power supply for output |
| Pino C2 | VSS — Ground |
| Pino C3 | VDD — Power supply |
| Pino C4 | VSS — Ground |
| Pino C5 | VDDQ — Power supply for output |
| Pino C6 | VSS — Ground |
| Pino C7 | VDD — Power supply |
| Pino C8 | VSS — Ground |
| Pino C9 | VDDQ — Power supply for output |
| Pino C10 | VSS — Ground |
| Pino C11 | VDD — Power supply |
| Pino C12 | VSS — Ground |
| Pino D1 | CK — Clock input |
| Pino D2 | CK — Complementary clock input |
| Pino D3 | VSS — Ground |
| Pino D4 | CKE — Clock enable |
| Pino D5 | VDD — Power supply |
| Pino D6 | VSS — Ground |
| Pino D7 | VDDQ — Power supply for output |
| Pino D8 | VSS — Ground |
| Pino D9 | VDD — Power supply |
| Pino D10 | VSS — Ground |
| Pino D11 | VDDQ — Power supply for output |
| Pino D12 | VSS — Ground |
| Pino E1 | RAS — Row address strobe |
| Pino E2 | CAS — Column address strobe |
| Pino E3 | WE — Write enable |
| Pino E4 | CS — Chip select |
| Pino E5 | VDD — Power supply |
| Pino E6 | VSS — Ground |
| Pino E7 | VDDQ — Power supply for output |
| Pino E8 | VSS — Ground |
| Pino E9 | VDD — Power supply |
| Pino E10 | VSS — Ground |
| Pino E11 | VDDQ — Power supply for output |
| Pino E12 | VSS — Ground |
| Pino F1 | A0 — Address input 0 |
| Pino F2 | A1 — Address input 1 |
| Pino F3 | A2 — Address input 2 |
| Pino F4 | A3 — Address input 3 |
| Pino F5 | VDD — Power supply |
| Pino F6 | VSS — Ground |
| Pino F7 | VDDQ — Power supply for output |
| Pino F8 | VSS — Ground |
| Pino F9 | VDD — Power supply |
| Pino F10 | VSS — Ground |
| Pino F11 | VDDQ — Power supply for output |
| Pino F12 | VSS — Ground |
| Pino G1 | A4 — Address input 4 |
| Pino G2 | A5 — Address input 5 |
| Pino G3 | A6 — Address input 6 |
| Pino G4 | A7 — Address input 7 |
| Pino G5 | VDD — Power supply |
| Pino G6 | VSS — Ground |
| Pino G7 | VDDQ — Power supply for output |
| Pino G8 | VSS — Ground |
| Pino G9 | VDD — Power supply |
| Pino G10 | VSS — Ground |
| Pino G11 | VDDQ — Power supply for output |
| Pino G12 | VSS — Ground |
| Pino H1 | A8 — Address input 8 |
| Pino H2 | A9 — Address input 9 |
| Pino H3 | A10/AP — Address input 10 / Auto-precharge |
| Pino H4 | A11 — Address input 11 |
| Pino H5 | VDD — Power supply |
| Pino H6 | VSS — Ground |
| Pino H7 | VDDQ — Power supply for output |
| Pino H8 | VSS — Ground |
| Pino H9 | VDD — Power supply |
| Pino H10 | VSS — Ground |
| Pino H11 | VDDQ — Power supply for output |
| Pino H12 | VSS — Ground |
| Pino J1 | A12 — Address input 12 |
| Pino J2 | A13 — Address input 13 |
| Pino J3 | BA0 — Bank address 0 |
| Pino J4 | BA1 — Bank address 1 |
| Pino J5 | VDD — Power supply |
| Pino J6 | VSS — Ground |
| Pino J7 | VDDQ — Power supply for output |
| Pino J8 | VSS — Ground |
| Pino J9 | VDD — Power supply |
| Pino J10 | VSS — Ground |
| Pino J11 | VDDQ — Power supply for output |
| Pino J12 | VSS — Ground |
| Pino K1 | BA2 — Bank address 2 |
| Pino K2 | ODT — On-die termination |
| Pino K3 | VSS — Ground |
| Pino K4 | VDD — Power supply |
| Pino K5 | VSS — Ground |
| Pino K6 | VDDQ — Power supply for output |
| Pino K7 | VSS — Ground |
| Pino K8 | VDD — Power supply |
| Pino K9 | VSS — Ground |
| Pino K10 | VDDQ — Power supply for output |
| Pino K11 | VSS — Ground |
| Pino K12 | VDD — Power supply |
| Pino L1 | DM — Data mask |
| Pino L2 | DQS — Data strobe |
| Pino L3 | DQS — Complementary data strobe |
| Pino L4 | VSS — Ground |
| Pino L5 | VDDQ — Power supply for output |
| Pino L6 | VSS — Ground |
| Pino L7 | VDD — Power supply |
| Pino L8 | VSS — Ground |
| Pino L9 | VDDQ — Power supply for output |
| Pino L10 | VSS — Ground |
| Pino L11 | VDD — Power supply |
| Pino L12 | VSS — Ground |
| Pino M1 | VSS — Ground |
| Pino M2 | VDD — Power supply |
| Pino M3 | VSS — Ground |
| Pino M4 | VDDQ — Power supply for output |
| Pino M5 | VSS — Ground |
| Pino M6 | VDD — Power supply |
| Pino M7 | VSS — Ground |
| Pino M8 | VDDQ — Power supply for output |
| Pino M9 | VSS — Ground |
| Pino M10 | VDD — Power supply |
| Pino M11 | VSS — Ground |
| Pino M12 | VDDQ — Power supply for output |
Aplicações típicas
H5TC4G63CFR-H9A é adequado para 6 aplicaçãos: Laptops and Ultrabooks, Embedded Computing, Networking Equipment, Industrial Automation, Consumer Electronics, Networking and Communications.
Laptops and Ultrabooks
The H5TC4G63CFR-H9A is ideal for laptops and ultrabooks due to its low 1.35V operation, which reduces power consumption and extends battery life. Its 4Gb density and x16 organization provide sufficient memory capacity for mainstream computing tasks. The 96-ball TFBGA package allows for compact PCB designs, essential for thin and light form factors. With a data rate of up to 1866 Mbps (typical for DDR3L), it delivers the bandwidth needed for smooth multitasking and multimedia applications. The low operating voltage also reduces heat generation, improving thermal management in confined spaces.
Recomendado
Embedded Computing
In embedded systems, the H5TC4G63CFR-H9A provides high-density, low-power memory for applications such as industrial PCs, point-of-sale terminals, and medical devices. Its 1.35V supply reduces power consumption, which is critical for fanless designs. The x16 organization simplifies interfacing with embedded processors that have 16-bit memory buses. The device's support for burst lengths of 8 and 4 allows efficient data transfers, and the on-chip DLL ensures reliable timing. The 96-ball TFBGA package is suitable for automated assembly, and the RoHS compliance meets environmental regulations.
Recomendado
Networking Equipment
The H5TC4G63CFR-H9A is well-suited for networking switches and routers, where high bandwidth and low power are essential. Its 4Gb density allows for large packet buffers, and the x16 organization matches common network processor interfaces. The low 1.35V operation reduces power dissipation in dense line cards, improving system reliability. The differential clock and data strobe inputs ensure signal integrity at high speeds, critical for error-free data transmission. The device's RoHS compliance is important for global market access.
Recomendado
Industrial Automation
In industrial automation, the H5TC4G63CFR-H9A provides reliable memory for PLCs, robotics controllers, and HMI systems. Its wide operating temperature range (if specified) supports harsh environments. The low power consumption reduces heat, which is beneficial in sealed enclosures. The 96-ball TFBGA package offers good thermal performance, and the device's high bandwidth supports real-time data processing. The RoHS compliance ensures environmental safety in industrial settings.
Recomendado
Consumer Electronics
The H5TC4G63CFR-H9A is used in consumer electronics such as smart TVs, set-top boxes, and gaming consoles. Its 4Gb density provides ample memory for multimedia applications, and the low 1.35V operation reduces power consumption, which is important for energy-efficient devices. The x16 organization is compatible with many SoCs, and the compact TFBGA package allows for slim product designs. The device's high bandwidth supports smooth video playback and responsive user interfaces.
Recomendado
Networking and Communications
The H5TC4G63CFR-H9A is also used in communication infrastructure such as base stations and network appliances. Its high density and low power make it suitable for buffer memory in packet processing. The differential signaling ensures reliable operation at high frequencies, and the on-chip DLL helps maintain timing accuracy. The device's RoHS compliance is essential for global deployment. The 96-ball TFBGA package is suitable for high-density PCB designs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para H5TC4G63CFR-H9A — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | H5TC4G63AFR-H9A | H5TC4G63CFR-H9I | H5TC4G63CFR-H9J | K4B4G1646E-BYK0 | MT41K256M16HA-125 | IS43TR16256AL-125KBL |
|---|---|---|---|---|---|---|---|
| Package | 96-ball TFBGA | 96-ball TFBGA | 96-ball TFBGA | 96-ball TFBGA | 96-ball FBGA | 96-ball FBGA | 96-ball TFBGA |
| Brand | SK hynix | SK hynix | SK hynix | SK hynix | Samsung | Micron | ISSI |
| Memory Density | 4Gb | 4Gb | 4Gb | 4Gb | 4Gb | 4Gb | 4Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V | 1.35V | 1.35V | 1.35V |
| RoHS Compliant | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Speed Grade | H9A (1866 Mbps) | H9A (1866 Mbps) | H9I (1600 Mbps) | H9J (1333 Mbps) | BYK0 (1866 Mbps) | -125 (1600 Mbps) | -125 (1600 Mbps) |
| Data Rate | 1866 Mbps | 1866 Mbps | 1600 Mbps | 1333 Mbps | 1866 Mbps | 1600 Mbps | 1600 Mbps |
Principais diferenciais
- Low power consumption (vs K4B4G1646E-BYK0)
- High speed grade (vs MT41K256M16HA-125)
- Same-brand availability (vs IS43TR16256AL-125KBL)
Notas de projeto
Ensure stable 1.35V supply for VDD and VDDQ. Use low-ESR decoupling capacitors (e.g., 0.1uF and 1uF) placed close to each power pin to minimize noise. The tolerance is +0.100V / -0.067V, so a well-regulated supply is critical. Consider using a dedicated DDR3L power solution to maintain voltage accuracy under load transients.
For high-speed DDR3L signals, maintain controlled impedance (typically 50 ohms single-ended, 100 ohms differential) and keep trace lengths matched within 50 mils. Place the device close to the controller to minimize stub effects. Use ground planes to provide a return path and reduce EMI. Follow the layout guidelines in the SK hynix datasheet for optimal signal integrity.
The H5TC4G63CFR-H9A in a 96-ball TFBGA package has a thermal resistance that depends on PCB design. Ensure adequate thermal vias and copper pour under the package to dissipate heat. The device's low 1.35V operation reduces power dissipation, but in high-density systems, monitor junction temperature to stay within the specified operating range.
Informações de conformidade
RoHS compliant and lead-free/halogen-free per datasheet. REACH and conflict minerals status not specified in provided data.
