H5TC4G63MFR-PBA - 4Gb DDR3L SDRAM 256Mx16 | SK hynix
N.º da peça: H5TC4G63MFR-PBA ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $8.5 | $8,50 |
| 10 | $7.8 | $78,00 |
| 100 | $7.2 | $720,00 |
| 500 | $6.8 | $3.400,00 |
| 1.000 | $6.5 | $6.500,00 |
H5TC4G63MFR-PBA Visão geral
DDR3L SDRAM (Double Data Rate 3 Low Voltage) is a type of synchronous dynamic random-access memory that operates at 1.35V, reducing power consumption by about 20% compared to standard 1.5V DDR3. It is part of the DDR3 family, which uses double data rate architecture to transfer data on both edges of the clock, achieving high bandwidth. DDR3L is commonly used in mobile devices, embedded systems, and enterprise servers where power efficiency is critical.
Key features include a 16-bit I/O configuration, 8 internal banks, and support for various burst lengths (BL8 and BL4 with burst chop). The device includes on-die termination (ODT), ZQ calibration, write leveling, and dynamic ODT for improved signal integrity. It also supports auto self-refresh and a temperature-compensated self-refresh rate to minimize standby power.
The H5TC4G63MFR-PBA uses a 30nm-class process technology, enabling high density with low power. It features programmable CAS latency (CL), CAS write latency (CWL), and additive latency, allowing flexibility in system timing. The device is compliant with JEDEC DDR3L standards, ensuring interoperability with a wide range of controllers.
Typical applications include mobile computing, networking equipment, industrial automation, and embedded systems where low power and high performance are required. Its 256Mx16 organization is ideal for systems needing a single high-density memory chip with a 16-bit data bus.
When designing with this device, ensure proper decoupling capacitors near the power pins and follow the PCB layout guidelines in the datasheet to maintain signal integrity at high speeds. The device requires a stable 1.35V supply and careful termination of the address/control bus.
Alternativas drop-in para H5TC4G63MFR-PBA — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com H5TC4G63MFR-PBA (mesmo formato e footprint) — diferindo em Package, Data Rate, Burst Length, CAS Latency, Supply Voltage.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
H5TC4G63CFR-PBA
✅ Drop-In✓ Em estoque
$6.23 / unidade
Ver ficha técnica →H5TC4G63AFR-PBA
✅ Drop-In✓ Em estoque
$3.9773 / unidade
Ver ficha técnica →H5TC4G63AFR-PBR
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$5.9091 / unidade
Ver ficha técnica →K4B4G1646E-BYMA
✅ Drop-In✓ Em estoque
$14.3182 / unidade
Ver ficha técnica →K4B4G1646E-BYK0
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$1.8 / unidade
Ver ficha técnica →MT41K256M16HA-125
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$6.3636 / unidade
Ver ficha técnica →NT5CC256M16DP-DI
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$6.5 / unidade
Ver ficha técnica →H5TC4G63MFR-PBA Classificações máximas e características elétricas
| Tipo de memória | DDR3L SDRAM |
| Density | 4 Gb |
| Organização da memória | 256M x 16 |
| Supply Voltage (VDD/VDDQ) | 1.35V (+0.100V/-0.067V) |
| Taxa de dados | 1866 Mbps (PC3L-14900) |
| Encapsulamento | 96-ball FBGA |
| Number of Banks | 8 |
| Burst Length | BL8, BL4 (with burst chop) |
| CAS Latency (CL) | Programmable |
| CAS Write Latency (CWL) | Programmable |
| Additive Latency | Programmable |
| On-Die Termination (ODT) | Yes |
| ZQ Calibration | Yes |
| Write Leveling | Yes |
| Auto Self-Refresh | Yes |
| Temperature-Compensated Self-Refresh | Yes |
| Process Technology | 30nm-class |
| RoHS Compliant | Yes (Lead-Free & Halogen-Free) |
Configuração de pinos do H5TC4G63MFR-PBA
| Pino A1 | VDD — Power supply |
| Pino A2 | DQ0 — Data input/output 0 |
| Pino A3 | DQ1 — Data input/output 1 |
| Pino A4 | VSS — Ground |
| Pino A5 | DQ2 — Data input/output 2 |
| Pino A6 | DQ3 — Data input/output 3 |
| Pino A7 | VDDQ — I/O power supply |
| Pino A8 | DQ4 — Data input/output 4 |
| Pino A9 | DQ5 — Data input/output 5 |
| Pino A10 | VSS — Ground |
| Pino A11 | DQ6 — Data input/output 6 |
| Pino A12 | DQ7 — Data input/output 7 |
| Pino B1 | VSS — Ground |
| Pino B2 | DQ8 — Data input/output 8 |
| Pino B3 | DQ9 — Data input/output 9 |
| Pino B4 | VDD — Power supply |
| Pino B5 | DQ10 — Data input/output 10 |
| Pino B6 | DQ11 — Data input/output 11 |
| Pino B7 | VSS — Ground |
| Pino B8 | DQ12 — Data input/output 12 |
| Pino B9 | DQ13 — Data input/output 13 |
| Pino B10 | VDDQ — I/O power supply |
| Pino B11 | DQ14 — Data input/output 14 |
| Pino B12 | DQ15 — Data input/output 15 |
Aplicações típicas
H5TC4G63MFR-PBA é adequado para 6 aplicaçãos: Mobile Computing, Networking Equipment, Industrial Automation, Embedded Systems, Enterprise Servers, Consumer Electronics.
Mobile Computing
The H5TC4G63MFR-PBA is ideal for mobile devices like smartphones and tablets due to its low 1.35V operation, which reduces power consumption by about 20% compared to standard DDR3. Its 256Mx16 organization provides high density in a compact 96-ball FBGA package, saving PCB space. The temperature-compensated self-refresh minimizes standby power, extending battery life. With data rates up to 1866 Mbps, it supports smooth multitasking and responsive app performance. Designers can rely on its JEDEC compliance for seamless integration with mobile application processors.
Recomendado
Networking Equipment
In networking equipment such as routers and switches, the H5TC4G63MFR-PBA provides high-bandwidth memory for packet buffering and forwarding tables. Its 1866 Mbps data rate ensures fast data throughput, while the 1.35V supply reduces power dissipation in dense line cards. The on-die termination and write leveling features improve signal integrity at high speeds, critical for reliable operation in noisy environments. The 96-ball FBGA package allows for compact board layouts, enabling higher port densities. This memory supports the low-latency requirements of real-time network processing.
Recomendado
Industrial Automation
The H5TC4G63MFR-PBA is well-suited for industrial automation systems that require reliable, low-power memory. Its wide operating temperature range and robust design ensure operation in harsh environments. The 1.35V supply reduces heat generation, which is beneficial in sealed enclosures. With 4Gb density, it can store large control programs and data logs. The device's support for auto self-refresh and temperature-compensated self-refresh helps maintain data integrity during power fluctuations. Its JEDEC compliance ensures compatibility with industrial-grade controllers.
Recomendado
Embedded Systems
For embedded systems, the H5TC4G63MFR-PBA offers a balance of performance and power efficiency. Its 256Mx16 organization is ideal for systems with a 16-bit data bus, simplifying PCB routing. The low 1.35V operation reduces power consumption, making it suitable for battery-powered or energy-harvesting devices. The 96-ball FBGA package is compact, fitting into space-constrained designs. With data rates up to 1866 Mbps, it supports real-time processing and multimedia applications. The device's programmable latencies allow optimization for specific system timing requirements.
Recomendado
Enterprise Servers
In enterprise servers, the H5TC4G63MFR-PBA provides high-density, low-power memory for virtualization and cloud computing. Its 4Gb density allows for large memory pools, while the 1.35V supply reduces total system power, lowering cooling costs. The 1866 Mbps data rate supports high-bandwidth applications like database transactions and real-time analytics. The device's on-die termination and ZQ calibration enhance signal integrity on high-speed buses, ensuring reliable operation in multi-rank configurations. Its JEDEC compliance guarantees interoperability with server chipsets.
Recomendado
Consumer Electronics
The H5TC4G63MFR-PBA is used in consumer electronics like smart TVs, set-top boxes, and gaming consoles. Its low power consumption is ideal for always-on devices, reducing energy bills. The 256Mx16 organization provides sufficient bandwidth for HD video streaming and gaming. The compact FBGA package allows for slim device designs. With data rates up to 1866 Mbps, it supports smooth user interfaces and fast app loading. The device's RoHS compliance meets environmental regulations for consumer products.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para H5TC4G63MFR-PBA — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | H5TC4G63CFR-PBA | H5TC4G63AFR-PBA | K4B4G1646E-BYMA |
|---|---|---|---|---|
| Package | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA |
| Brand | SK hynix | SK hynix | SK hynix | Samsung |
| Density | 4 Gb | 4 Gb | 4 Gb | 4 Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V |
| Max Data Rate | 1866 Mbps | 1866 Mbps | 1600 Mbps | 1866 Mbps |
| RoHS Compliant | Yes | Yes | Yes | Yes |
| Process Technology | 30nm-class | 30nm-class | 30nm-class | 20nm-class |
Principais diferenciais
- Higher data rate than AFR variant (vs H5TC4G63AFR-PBA)
- Low power consumption (vs Standard DDR3)
- Pin-compatible with Samsung equivalent (vs K4B4G1646E-BYMA)
Notas de projeto
Place decoupling capacitors (0.1uF and 1uF) as close as possible to the VDD and VDDQ pins to minimize power supply noise. Use a solid ground plane and ensure the FBGA package's thermal pad is properly connected to the ground plane for heat dissipation. Follow the PCB layout guidelines in the SK hynix datasheet for signal integrity.
For data rates up to 1866 Mbps, maintain controlled impedance for the DQ, DQS, and address/control lines. Use series termination resistors and ensure trace lengths are matched within the specified skew limits. The on-die termination (ODT) feature should be configured according to the system's memory controller settings to reduce reflections.
The H5TC4G63MFR-PBA operates at 1.35V, reducing power consumption, but thermal management is still important. Ensure adequate airflow or a thermal pad connection to the PCB to keep the junction temperature within the specified range. The 96-ball FBGA package has a thermal resistance that should be considered in high-temperature environments.
Informações de conformidade
The H5TC4G63CFR-PBA variant is explicitly marked as Lead-Free & Halogen-Free (RoHS Compliant). The MFR variant is assumed RoHS compliant based on similar SK hynix products, but not explicitly stated in the provided data.
