5CSEBA4U19I7 vs 5CSEBA4U19A7N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng 5CSEBA4U19I7 sa pamamagitan ng Intel at 5CSEBA4U19A7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro 5CSEBA4U19I7 5CSEBA4U19A7N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Device Family Cyclone V SE SoC FPGA —
Logic Elements 40 K 40 K
Process Technology 28 nm TSMC low-power —
Core Voltage 1.1 V 1.1 V (typical)
HPS Core Dual-core ARM Cortex-A9 MPCore with CoreSight, NEON —
HPS Maximum Frequency 800 MHz —
FPGA Maximum Frequency 400 MHz —
DSP Blocks 156 (18x18 multipliers) —
Embedded Memory M10K blocks 3.4 Mbits (M9K)
Packhaging 484-UBGA (U19), 19x19 mm, 1.0 mm pitch 484-UBGA (U19), 19x19 mm, 1.0 mm pitch
Temperature na Operasyon -40C to +100C (industrial, I7 grade) —
HPS Peripherals EMAC, USB 2.0, SD/MMC, NAND, SPI, I2C, UART, I2S —
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount (BGA)
Level ng MSL [DATA_NEEDED: MSL level] 3 (168 hours)
Tindminan RoHS Compliant Compliant
Family — Cyclone V SE SoC FPGA
Hard Processor System — Dual ARM Cortex-A9 MPCore with CoreSight
Adaptive Logic Modules — [DATA_NEEDED: ALM count]
DSP Blocks (18x18 Multipliers) — 224
PLLs — [DATA_NEEDED: PLL count]
HPS Maximum Application Clock — 925 MHz
Memory Interfaces — DDR3, DDR3L, LPDDR2 (via HPS); soft DDR3/2 in FPGA
User I/O — 161
Temperature ng Junction na Operasyon — -40C to +125C (automotive) / -40C to +100C (industrial)
Process Node — TSMC 28 nm low-power

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