H5ANAG8NCMR-XNI vs MT40A2G8AG-062E Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng H5ANAG8NCMR-XNI sa pamamagitan ng SK hynix at MT40A2G8AG-062E sa pamamagitan ng Micron Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

SK hynix
H5ANAG8NCMR-XNI H5ANAG8NCMR-XNI - 16Gb DDR4 SDRAM 3200Mbps | SK Hynix

H5ANAG8NCMR-XNI - 16Gb DDR4 SDRAM 3200Mbps | SK Hynix

H5ANAG8NCMR-XNI ✓ Nakahanda
Micron Technology
MT40A2G8AG-062E MT40A2G8AG-062E - 16Gb DDR4 SDRAM 2Gx8 3200Mbps | Micron

MT40A2G8AG-062E - 16Gb DDR4 SDRAM 2Gx8 3200Mbps | Micron

MT40A2G8AG-062E ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro H5ANAG8NCMR-XNI MT40A2G8AG-062E
Brand SK hynix Micron Technology
Kategorya Memory ICs Memory ICs
Katayuan ng Lifecycle Aktibo Aktibo
Uri ng Memory Volatile (DRAM) DDR4 SDRAM
Memory Format DDR4 SDRAM —
Laki ng Memory 16 Gb —
Memory Organization x8 —
Interface Parallel —
Rate ng Data 3200 Mbps (DDR4-3200) —
Supply Voltage (VDD) 1.2 V —
Packhaging FBGA-78 78-FBGA (7.5 x 11 mm)
Uri ng Pagpapasok Surface Mount Surface Mount
Packaging Tray —
Product Status Active —
Manufacturer SK Hynix —
Technology CMOS DDR4 SDRAM —
Tindminan RoHS [DATA_NEEDED: RoHS status] Compliant
Temperature na Operasyon [DATA_NEEDED: operating temperature range] —
Refresh [DATA_NEEDED: refresh rate] —
Density — 16 Gbit
Organisasyon — 2G x 8
Speed — DDR4-3200 (3200 MT/s)
Clock Frequency — 1600 MHz
Access Time (Clock Cycle Time) — 0.625 ns (tCK)
Latensya ng CAS — CL22 (DDR4-3200)
Access Time — 19 ns
Supply Voltage VDD — 1.2 V
I/O Interface — POD12 (1.2 V pseudo-open drain)
VPP Voltage — 2.5 V
Number of Banks — 16 (4 bank groups x 4 banks)
Operating Temperature (AUT grade) — -40C to +95C (per Micron grade table)
Die Revision — AG (current generation)

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