H5ANAG8NCMR-XNI vs MT40A2G8AG-062E 比較

詳細並排比較 H5ANAG8NCMR-XNI 由 SK hynix 與 MT40A2G8AG-062E 由 Micron Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

SK hynix
H5ANAG8NCMR-XNI H5ANAG8NCMR-XNI - 16Gb DDR4 SDRAM 3200Mbps | SK Hynix

H5ANAG8NCMR-XNI - 16Gb DDR4 SDRAM 3200Mbps | SK Hynix

H5ANAG8NCMR-XNI ✓ 啟用中
Micron Technology
MT40A2G8AG-062E MT40A2G8AG-062E - 16Gb DDR4 SDRAM 2Gx8 3200Mbps | Micron

MT40A2G8AG-062E - 16Gb DDR4 SDRAM 2Gx8 3200Mbps | Micron

MT40A2G8AG-062E ✓ 啟用中

規格比較

參數 H5ANAG8NCMR-XNI MT40A2G8AG-062E
品牌 SK hynix Micron Technology
類別 Memory ICs Memory ICs
生命週期狀態 啟用中 啟用中
記憶體類型 Volatile (DRAM) DDR4 SDRAM
Memory Format DDR4 SDRAM —
記憶體容量 16 Gb —
Memory Organization x8 —
介面 Parallel —
資料速率 3200 Mbps (DDR4-3200) —
Supply Voltage (VDD) 1.2 V —
封裝 FBGA-78 78-FBGA (7.5 x 11 mm)
安裝類型 Surface Mount Surface Mount
Packaging Tray —
Product Status Active —
Manufacturer SK Hynix —
Technology CMOS DDR4 SDRAM —
RoHS 狀態 [DATA_NEEDED: RoHS status] Compliant
工作溫度 [DATA_NEEDED: operating temperature range] —
Refresh [DATA_NEEDED: refresh rate] —
Density — 16 Gbit
組織 — 2G x 8
Speed — DDR4-3200 (3200 MT/s)
Clock Frequency — 1600 MHz
Access Time (Clock Cycle Time) — 0.625 ns (tCK)
CAS 延遲 — CL22 (DDR4-3200)
Access Time — 19 ns
Supply Voltage VDD — 1.2 V
I/O Interface — POD12 (1.2 V pseudo-open drain)
VPP Voltage — 2.5 V
Number of Banks — 16 (4 bank groups x 4 banks)
Operating Temperature (AUT grade) — -40C to +95C (per Micron grade table)
Die Revision — AG (current generation)

資料表與資源

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